CYStech Electronics Corp.
Silicon PNP Epitaxial Planar Transistor
Spec. No. : C854T3
Issued Date : 2005.08.23
Revised Date :2006.07.11
Page No. : 1/4
BTB1236AT3
Description
•
High BV
CEO
•
High current capability
•
Pb-free package
Symbol
BTB1236AT3
Outline
TO-126
B
：
Base
C
：
Collector
E
：
Emitter
E CB
Absolute Maximum Ratings
(Ta=25°C)
Parameter
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current (DC)
Collector Current (Pulse)
Base Current
Power Dissipation @T
A
=25℃
Power Dissipation @T
C
=25℃
Junction Temperature
Storage Temperature
Symbol
V
CBO
V
CEO
V
EBO
I
C
I
CP
I
B
P
D
Tj
Tstg
Limits
-180
-160
-5
-1.5
-3
0.5
1
20
150
-55~+150
Unit
V
V
V
A
A
A
W
°C
°C
BTB1236AT3
CYStek Product Specification
CYStech Electronics Corp.
Characteristic Curves
Current Gain vs Collector Current
1000
VCE=5V
Spec. No. : C854T3
Issued Date : 2005.08.23
Revised Date :2006.07.11
Page No. : 3/4
Saturation Voltage vs Collector Current
1000
VCE(SAT)@IC=10IB
100
Saturation Voltage-(mV)
1
10
100
1000
10000
Current Gain---
HFE
100
10
1
Collector Current---IC(mA)
10
1
10
100
1000
Collector Current---IC(mA)
10000
On Voltage vs Collector Current
10000
VBE(ON)@VCE=5V
Power Derating Curve
1.2
Power Dissipation---PD(W)
1
0.8
0.6
0.4
0.2
0
On Voltage---(mV)
1000
100
1
10
100
1000
10000
Collector Current---IC(mA)
0
50
100
150
200
Ambient Temperature---TA(℃)
Power Derating Curve
25
20
15
10
5
0
0
50
100
150
200
Case Temperature---TC(℃)
BTB1236AT3
Power Dissipation---PD(W)
CYStek Product Specification
CYStech Electronics Corp.
TO-126 Dimension
D
A
B
1 2 3
G
C
I
Spec. No. : C854T3
Issued Date : 2005.08.23
Revised Date :2006.07.11
Page No. : 4/4
E
J
K
M
Marking:
α
3
α
4
B1236A
Style: Pin 1.Emitter 2.Collector 3.Base
F
H
L
α
1
α
2
3-Lead TO-126 Plastic Package
CYStek Package Code: T3
*: Typical
DIM
α1
α2
α3
α4
A
B
C
D
E
Inches
Min.
Max.
-
*3°
-
*3°
-
*3°
-
*3°
0.1500
0.1539
0.2752
0.2791
0.5315
0.6102
0.2854
0.3039
0.0374
0.0413
Millimeters
Min.
Max.
-
*3°
-
*3°
-
*3°
-
*3°
3.81
3.91
6.99
7.09
13.50
15.50
7.52
7.72
0.95
1.05
DIM
F
G
H
I
J
K
L
M
Inches
Min.
Max.
0.0280
0.0319
0.0480
0.0520
0.1709
0.1890
0.0950
0.1050
0.0450
0.0550
0.0450
0.0550
-
*0.0217
0.1378
0.1520
Millimeters
Min.
Max.
0.71
0.81
1.22
1.32
4.34
4.80
2.41
2.66
1.14
1.39
1.14
1.39
-
*0.55
3.50
3.86
Notes:
1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
•
Lead: 42 Alloy; solder plating
•
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
•
CYStek reserves the right to make changes to its products without notice.
•
CYStek
semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BTB1236AT3
CYStek Product Specification
嵌入式系统
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