EE PLD, 23.6ns, 560-Cell, CMOS, PBGA356, BGA-356
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Intel(英特尔) |
| 包装说明 | LBGA, BGA356,26X26,50 |
| Reach Compliance Code | compliant |
| 其他特性 | 560 MACROCELLS |
| 最大时钟频率 | 100 MHz |
| 系统内可编程 | YES |
| JESD-30 代码 | S-PBGA-B356 |
| JESD-609代码 | e0 |
| JTAG BST | YES |
| 长度 | 35 mm |
| 专用输入次数 | |
| I/O 线路数量 | 216 |
| 宏单元数 | 560 |
| 端子数量 | 356 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 0 DEDICATED INPUTS, 216 I/O |
| 输出函数 | MACROCELL |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LBGA |
| 封装等效代码 | BGA356,26X26,50 |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY, LOW PROFILE |
| 峰值回流温度（摄氏度） | 220 |
| 电源 | 3.3/5,5 V |
| 可编程逻辑类型 | EE PLD |
| 传播延迟 | 23.6 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.63 mm |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | BALL |
| 端子节距 | 1.27 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 35 mm |
| EPM9560BI356-20 | EPM9560GI280-15 | EPM9560GI280-20 | EPM9560RI208-15 | EPM9560RI240-15 | EPM9560RI304-15 | EPM9560ABI356-10 | |
|---|---|---|---|---|---|---|---|
| 描述 | EE PLD, 23.6ns, 560-Cell, CMOS, PBGA356, BGA-356 | EE PLD, 16.6ns, 560-Cell, CMOS, CPGA280, CERAMIC, PGA-280 | EE PLD, 23.6ns, 560-Cell, CMOS, CPGA280, CERAMIC, PGA-280 | EE PLD, 16.6ns, 560-Cell, CMOS, PQFP208, RQFP-208 | EE PLD, 16.6ns, 560-Cell, CMOS, PQFP240, RQFP-240 | EE PLD, 16.6ns, 560-Cell, CMOS, PQFP304, RQFP-304 | EE PLD, 11.4ns, 560-Cell, CMOS, PBGA356, BGA-356 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Intel(英特尔) | Intel(英特尔) | Intel(英特尔) | Intel(英特尔) | Intel(英特尔) | Intel(英特尔) | Intel(英特尔) |
| 包装说明 | LBGA, BGA356,26X26,50 | PGA, PGA280,19X19 | PGA, PGA280,19X19 | HFQFP, HQFP208,1.2SQ,20 | HFQFP, HQFP240,1.37SQ,20 | HFQFP, HQFP304,1.7SQ,20 | LBGA, BGA356,26X26,50 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| 其他特性 | 560 MACROCELLS | 560 MACROCELLS; 772 FLIP FLOPS; CONFIGURABLE I/O OPERATION - 3.3V OR 5V | 772 FLIP FLOPS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V | 560 MACROCELLS; 772 FLIP FLOPS; CONFIGURABLE I/O OPERATION - 3.3V OR 5V | 560 MACROCELLS; 772 FLIP FLOPS; CONFIGURABLE I/O OPERATION - 3.3V OR 5V | 560 MACROCELLS; 772 FLIP FLOPS; CONFIGURABLE I/O OPERATION - 3.3V OR 5V | 560 MACROCELLS |
| 最大时钟频率 | 100 MHz | 117.6 MHz | 100 MHz | 117.6 MHz | 117.6 MHz | 117.6 MHz | 144.9 MHz |
| 系统内可编程 | YES | YES | YES | YES | YES | YES | YES |
| JESD-30 代码 | S-PBGA-B356 | S-CPGA-P280 | S-CPGA-P280 | S-PQFP-G208 | S-PQFP-G240 | S-PQFP-G304 | S-PBGA-B356 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| JTAG BST | YES | YES | YES | YES | YES | YES | YES |
| 长度 | 35 mm | 49.78 mm | 49.78 mm | 28 mm | 32 mm | 40 mm | 35 mm |
| I/O 线路数量 | 216 | 216 | 216 | 153 | 191 | 216 | 216 |
| 宏单元数 | 560 | 560 | 560 | 560 | 560 | 560 | 560 |
| 端子数量 | 356 | 280 | 280 | 208 | 240 | 304 | 356 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 0 DEDICATED INPUTS, 216 I/O | 0 DEDICATED INPUTS, 216 I/O | 0 DEDICATED INPUTS, 216 I/O | 0 DEDICATED INPUTS, 153 I/O | 0 DEDICATED INPUTS, 191 I/O | 0 DEDICATED INPUTS, 216 I/O | 0 DEDICATED INPUTS, 216 I/O |
| 输出函数 | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LBGA | PGA | PGA | HFQFP | HFQFP | HFQFP | LBGA |
| 封装等效代码 | BGA356,26X26,50 | PGA280,19X19 | PGA280,19X19 | HQFP208,1.2SQ,20 | HQFP240,1.37SQ,20 | HQFP304,1.7SQ,20 | BGA356,26X26,50 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY, LOW PROFILE | GRID ARRAY | GRID ARRAY | FLATPACK, HEAT SINK/SLUG, FINE PITCH | FLATPACK, HEAT SINK/SLUG, FINE PITCH | FLATPACK, HEAT SINK/SLUG, FINE PITCH | GRID ARRAY, LOW PROFILE |
| 峰值回流温度（摄氏度） | 220 | 220 | 220 | 220 | 220 | 220 | 220 |
| 电源 | 3.3/5,5 V | 3.3/5,5 V | 3.3/5,5 V | 3.3/5,5 V | 3.3/5,5 V | 3.3/5,5 V | 3.3/5,5 V |
| 可编程逻辑类型 | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD |
| 传播延迟 | 23.6 ns | 16.6 ns | 23.6 ns | 16.6 ns | 16.6 ns | 16.6 ns | 11.4 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.63 mm | 5.08 mm | 5.08 mm | 4.1 mm | 4.1 mm | 4.5 mm | 1.63 mm |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | NO | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | BALL | PIN/PEG | PIN/PEG | GULL WING | GULL WING | GULL WING | BALL |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 0.5 mm | 0.5 mm | 0.5 mm | 1.27 mm |
| 端子位置 | BOTTOM | PERPENDICULAR | PERPENDICULAR | QUAD | QUAD | QUAD | BOTTOM |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
| 宽度 | 35 mm | 49.78 mm | 49.78 mm | 28 mm | 32 mm | 40 mm | 35 mm |
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