SPST, 4 Func, 1 Channel, CMOS, PDSO14, DMP-14
| 参数名称 | 属性值 |
| 厂商名称 | New Japan Radio Co Ltd |
| 零件包装代码 | SOIC |
| 包装说明 | SOP, |
| 针数 | 14 |
| Reach Compliance Code | unknown |
| 模拟集成电路 - 其他类型 | SPST |
| JESD-30 代码 | R-PDSO-G14 |
| 长度 | 10 mm |
| 信道数量 | 1 |
| 功能数量 | 4 |
| 端子数量 | 14 |
| 通态电阻匹配规范 | 15 Ω |
| 最大通态电阻 (Ron) | 1050 Ω |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2 mm |
| 最大供电电压 (Vsup) | 18 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 最长断开时间 | 70 ns |
| 最长接通时间 | 70 ns |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 宽度 | 5 mm |
| NJU4066BM(T1) | NJU4066BV(TE1) | NJU4066BV(TE2) | NJU4066BM(TE2) | NJU4066BM(TE1) | NJU4066BM(T2) | |
|---|---|---|---|---|---|---|
| 描述 | SPST, 4 Func, 1 Channel, CMOS, PDSO14, DMP-14 | SPST, 4 Func, 1 Channel, CMOS, PDSO14, SSOP-14 | SPST, 4 Func, 1 Channel, CMOS, PDSO14, SSOP-14 | SPST, 4 Func, 1 Channel, CMOS, PDSO14, DMP-14 | SPST, 4 Func, 1 Channel, CMOS, PDSO14, DMP-14 | SPST, 4 Func, 1 Channel, CMOS, PDSO14, DMP-14 |
| 厂商名称 | New Japan Radio Co Ltd | New Japan Radio Co Ltd | New Japan Radio Co Ltd | New Japan Radio Co Ltd | New Japan Radio Co Ltd | New Japan Radio Co Ltd |
| 零件包装代码 | SOIC | SSOP | SSOP | SOIC | SOIC | SOIC |
| 包装说明 | SOP, | LSSOP, | LSSOP, | SOP, | SOP, | SOP, |
| 针数 | 14 | 14 | 14 | 14 | 14 | 14 |
| Reach Compliance Code | unknown | compliant | compliant | compliant | compliant | unknown |
| 模拟集成电路 - 其他类型 | SPST | SPST | SPST | SPST | SPST | SPST |
| JESD-30 代码 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 |
| 长度 | 10 mm | 5 mm | 5 mm | 10 mm | 10 mm | 10 mm |
| 信道数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 4 | 4 | 4 | 4 | 4 | 4 |
| 端子数量 | 14 | 14 | 14 | 14 | 14 | 14 |
| 通态电阻匹配规范 | 15 Ω | 15 Ω | 15 Ω | 15 Ω | 15 Ω | 15 Ω |
| 最大通态电阻 (Ron) | 1050 Ω | 1050 Ω | 1050 Ω | 1050 Ω | 1050 Ω | 1050 Ω |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | LSSOP | LSSOP | SOP | SOP | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2 mm | 1.45 mm | 1.45 mm | 2 mm | 2 mm | 2 mm |
| 最大供电电压 (Vsup) | 18 V | 18 V | 18 V | 18 V | 18 V | 18 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 最长断开时间 | 70 ns | 70 ns | 70 ns | 70 ns | 70 ns | 70 ns |
| 最长接通时间 | 70 ns | 70 ns | 70 ns | 70 ns | 70 ns | 70 ns |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | 0.65 mm | 0.65 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 5 mm | 4.4 mm | 4.4 mm | 5 mm | 5 mm | 5 mm |
| Is Samacsys | - | N | N | N | N | - |
| Base Number Matches | - | 1 | 1 | 1 | 1 | - |
模拟与混合信号
嵌入式系统
嵌入式系统
嵌入式系统
嵌入式系统
FPGA/CPLD
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