PLL Based Clock Driver, 23S Series, 8 True Output(s), 0 Inverted Output(s), PDSO16, TSSOP-16
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | IDT (Integrated Device Technology) |
零件包装代码 | TSSOP |
包装说明 | TSSOP, TSSOP16,.25 |
针数 | 16 |
Reach Compliance Code | not_compliant |
IDT23S08-5HPGI | IDT23S08-2DCGI | IDT23S08-1HDCG | IDT23S08-2DCG | IDT23S08-5HPG | |
---|---|---|---|---|---|
描述 | PLL Based Clock Driver, 23S Series, 8 True Output(s), 0 Inverted Output(s), PDSO16, TSSOP-16 | PLL Based Clock Driver, 23S Series, 8 True Output(s), 0 Inverted Output(s), PDSO16, GREEN, SOIC-16 | PLL Based Clock Driver, 23S Series, 8 True Output(s), 0 Inverted Output(s), PDSO16, GREEN, SOIC-16 | PLL Based Clock Driver, 23S Series, 8 True Output(s), 0 Inverted Output(s), PDSO16, GREEN, SOIC-16 | PLL Based Clock Driver, 23S Series, 8 True Output(s), 0 Inverted Output(s), PDSO16, TSSOP-16 |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 不符合 | 符合 | 符合 | 符合 | 不符合 |
零件包装代码 | TSSOP | SOIC | SOIC | SOIC | TSSOP |
包装说明 | TSSOP, TSSOP16,.25 | SOP, SOP16,.25 | SOP, SOP16,.25 | SOP, SOP16,.25 | TSSOP-16 |
针数 | 16 | 16 | 16 | 16 | 16 |
Reach Compliance Code | not_compliant | unknow | compli | unknow | not_compliant |
ECCN代码 | - | EAR99 | EAR99 | EAR99 | - |
系列 | - | 23S | 23S | 23S | 23S |
输入调节 | - | STANDARD | STANDARD | STANDARD | STANDARD |
JESD-30 代码 | - | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 |
JESD-609代码 | - | e3 | e3 | e3 | e0 |
长度 | - | 9.9314 mm | 9.9314 mm | 9.9314 mm | 5 mm |
逻辑集成电路类型 | - | PLL BASED CLOCK DRIVER | PLL BASED CLOCK DRIVER | PLL BASED CLOCK DRIVER | PLL BASED CLOCK DRIVER |
最大I(ol) | - | 0.008 A | 0.012 A | 0.008 A | 0.012 A |
湿度敏感等级 | - | 3 | 3 | 3 | 1 |
功能数量 | - | 1 | 1 | 1 | 1 |
端子数量 | - | 16 | 16 | 16 | 16 |
实输出次数 | - | 8 | 8 | 8 | 8 |
最高工作温度 | - | 85 °C | 70 °C | 70 °C | 70 °C |
输出特性 | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | - | SOP | SOP | SOP | TSSOP |
封装等效代码 | - | SOP16,.25 | SOP16,.25 | SOP16,.25 | TSSOP16,.25 |
封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | - | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | - | 260 | 260 | 260 | 240 |
电源 | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Same Edge Skew-Max(tskwd) | - | 0.4 ns | 0.2 ns | 0.4 ns | 0.2 ns |
座面最大高度 | - | 1.7272 mm | 1.7272 mm | 1.7272 mm | 1.2 mm |
最大供电电压 (Vsup) | - | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | - | 3 V | 3 V | 3 V | 3 V |
标称供电电压 (Vsup) | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | - | YES | YES | YES | YES |
温度等级 | - | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | - | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Tin/Lead (Sn85Pb15) |
端子形式 | - | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | - | 1.27 mm | 1.27 mm | 1.27 mm | 0.65 mm |
端子位置 | - | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | - | 30 | 30 | 30 | 20 |
宽度 | - | 3.937 mm | 3.937 mm | 3.937 mm | 4.4 mm |
最小 fmax | - | 133.3 MHz | 133.3 MHz | 133.3 MHz | 133.3 MHz |
Base Number Matches | - | 1 | 1 | 1 | - |
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