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IDT70T3399S133DDI

产品描述Dual-Port SRAM, 128KX18, 15ns, CMOS, PQFP144, 20 X 20 MM, 1.40 MM HEIGHT, TQFP-144
产品类别存储    存储   
文件大小821KB,共27页
制造商IDT (Integrated Device Technology)
下载文档 详细参数 选型对比 全文预览

IDT70T3399S133DDI概述

Dual-Port SRAM, 128KX18, 15ns, CMOS, PQFP144, 20 X 20 MM, 1.40 MM HEIGHT, TQFP-144

IDT70T3399S133DDI规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称IDT (Integrated Device Technology)
零件包装代码QFP
包装说明20 X 20 MM, 1.40 MM HEIGHT, TQFP-144
针数144
Reach Compliance Codenot_compliant
ECCN代码3A991.B.2.A
最长访问时间15 ns
其他特性FLOW-THROUGH OR PIPELINED ARCHITECTURE
最大时钟频率 (fCLK)133 MHz
I/O 类型COMMON
JESD-30 代码S-PQFP-G144
JESD-609代码e0
长度20 mm
内存密度2359296 bit
内存集成电路类型DUAL-PORT SRAM
内存宽度18
湿度敏感等级4
功能数量1
端口数量2
端子数量144
字数131072 words
字数代码128000
工作模式SYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织128KX18
输出特性3-STATE
封装主体材料PLASTIC/EPOXY
封装代码LFQFP
封装等效代码QFP144,.87SQ,20
封装形状SQUARE
封装形式FLATPACK, LOW PROFILE, FINE PITCH
并行/串行PARALLEL
峰值回流温度(摄氏度)225
电源2.5,2.5/3.3 V
认证状态Not Qualified
座面最大高度1.6 mm
最大待机电流0.02 A
最小待机电流2.4 V
最大压摆率0.45 mA
最大供电电压 (Vsup)2.6 V
最小供电电压 (Vsup)2.4 V
标称供电电压 (Vsup)2.5 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层Tin/Lead (Sn85Pb15)
端子形式GULL WING
端子节距0.5 mm
端子位置QUAD
处于峰值回流温度下的最长时间30
宽度20 mm

文档预览

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HIGH-SPEED 2.5V
512/256/128K X 18
IDT70T3339/19/99S
SYNCHRONOUS
DUAL-PORT STATIC RAM
WITH 3.3V OR 2.5V INTERFACE
Features:
True Dual-Port memory cells which allow simultaneous
access of the same memory location
High-speed data access
– Commercial: 3.4 (200MHz)/3.6ns (166MHz)/
4.2ns (133MHz)(max.)
– Industrial: 3.6ns (166MHz)/4.2ns (133MHz) (max.)
Selectable Pipelined or Flow-Through output mode
Counter enable and repeat features
Dual chip enables allow for depth expansion without
additional logic
Interrupt and Collision Detection Flags
Full synchronous operation on both ports
– 5ns cycle time, 200MHz operation (14Gbps bandwidth)
– Fast 3.4ns clock to data out
– Data input, address, byte enable and control registers
– 1.5ns setup to clock and 0.5ns hold on all control, data,
and address inputs @ 200MHz
– Self-timed write allows fast cycle time
Separate byte controls for multiplexed bus and bus
matching compatibility
Dual Cycle Deselect (DCD) for Pipelined Output Mode
2.5V (±100mV) power supply for core
LVTTL compatible, selectable 3.3V (±150mV) or 2.5V
(±100mV) power supply for I/Os and control signals on
each port
Industrial temperature range (-40°C to +85°C) is
available at 166MHz and 133MHz
Available in a 256-pin Ball Grid Array (BGA) and 208-pin fine
pitch Ball Grid Array (fpBGA)
Supports JTAG features compliant with IEEE 1149.1
Green parts available, see ordering information
Functional Block Diagram
UB
L
LB
L
UB
R
LB
R
FT/PIPE
L
1/0
0a 1a
a
0b 1b
b
1b 0b
b
1a 0a
a
1/0
FT/PIPE
R
R/W
L
CE
0L
CE
1L
1
0
1/0
B B
WW
0 1
L L
B B
WW
1 0
RR
1
0
1/0
R/W
R
CE
0R
CE
1R
OE
L
Dout0-8_L
Dout9-17_L
Dout0-8_R
Dout9-17_R
OE
R
1b 0b 1a 0a
FT/PIPE
L
0/1
0a 1a 0b
1b
,
0/1
FT/PIPE
R
ab
512/256/128K x 18
MEMORY
ARRAY
ba
I/O
0L
- I/O
17L
Din_L
Din_R
I/O
0R
- I/O
17R
CLK
L
A
18L
(1)
A
0L
REPEAT
L
ADS
L
CNTEN
L
A
18R(1)
CLK
R
,
Counter/
Address
Reg.
ADDR_L
ADDR_R
Counter/
Address
Reg.
A
0R
REPEAT
R
ADS
R
CNTEN
R
TDI
TCK
TMS
TRST
CE
0 L
CE1L
R/
W
L
INTERRUPT
COLLISION
DETECTION
LOGIC
CE
0 R
CE1R
R/
W
R
JTAG
TDO
COL
L
INT
L
ZZ
L
(2)
COL
R
INT
R
ZZ
CONTROL
LOGIC
ZZ
R
(2)
5652 drw 01
NOTES:
1. Address A
18
is a NC for the IDT70T3319. Also, Addresses A
18
and A
17
are NC's for the IDT70T3399.
2. The sleep mode pin shuts off all dynamic inputs, except JTAG inputs, when asserted. All static inputs, i.e., PL/FTx and
OPTx and the sleep mode pins themselves (ZZx) are not affected during sleep mode.
JUNE 2015
DSC-5652/8
1
©2015 Integrated Device Technology, Inc.

IDT70T3399S133DDI相似产品对比

IDT70T3399S133DDI IDT70T3319S133DDI IDT70T3399S166DD
描述 Dual-Port SRAM, 128KX18, 15ns, CMOS, PQFP144, 20 X 20 MM, 1.40 MM HEIGHT, TQFP-144 Dual-Port SRAM, 256KX18, 15ns, CMOS, PQFP144, 20 X 20 MM, 1.40 MM HEIGHT, TQFP-144 Dual-Port SRAM, 128KX18, 12ns, CMOS, PQFP144, 20 X 20 MM, 1.40 MM HEIGHT, TQFP-144
是否Rohs认证 不符合 不符合 不符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
零件包装代码 QFP QFP QFP
包装说明 20 X 20 MM, 1.40 MM HEIGHT, TQFP-144 20 X 20 MM, 1.40 MM HEIGHT, TQFP-144 20 X 20 MM, 1.40 MM HEIGHT, TQFP-144
针数 144 144 144
Reach Compliance Code not_compliant not_compliant not_compliant
ECCN代码 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
最长访问时间 15 ns 15 ns 12 ns
其他特性 FLOW-THROUGH OR PIPELINED ARCHITECTURE FLOW-THROUGH OR PIPELINED ARCHITECTURE FLOW-THROUGH OR PIPELINED ARCHITECTURE
最大时钟频率 (fCLK) 133 MHz 133 MHz 166 MHz
I/O 类型 COMMON COMMON COMMON
JESD-30 代码 S-PQFP-G144 S-PQFP-G144 S-PQFP-G144
JESD-609代码 e0 e0 e0
长度 20 mm 20 mm 20 mm
内存密度 2359296 bit 4718592 bit 2359296 bit
内存集成电路类型 DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM
内存宽度 18 18 18
湿度敏感等级 4 4 4
功能数量 1 1 1
端口数量 2 2 2
端子数量 144 144 144
字数 131072 words 262144 words 131072 words
字数代码 128000 256000 128000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 85 °C 85 °C 70 °C
最低工作温度 -40 °C -40 °C -
组织 128KX18 256KX18 128KX18
输出特性 3-STATE 3-STATE 3-STATE
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 LFQFP LFQFP LFQFP
封装等效代码 QFP144,.87SQ,20 QFP144,.87SQ,20 QFP144,.87SQ,20
封装形状 SQUARE SQUARE SQUARE
封装形式 FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
并行/串行 PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) 225 225 225
电源 2.5,2.5/3.3 V 2.5,2.5/3.3 V 2.5,2.5/3.3 V
认证状态 Not Qualified Not Qualified Not Qualified
座面最大高度 1.6 mm 1.6 mm 1.6 mm
最大待机电流 0.02 A 0.02 A 0.015 A
最小待机电流 2.4 V 2.4 V 2.4 V
最大压摆率 0.45 mA 0.45 mA 0.45 mA
最大供电电压 (Vsup) 2.6 V 2.6 V 2.6 V
最小供电电压 (Vsup) 2.4 V 2.4 V 2.4 V
标称供电电压 (Vsup) 2.5 V 2.5 V 2.5 V
表面贴装 YES YES YES
技术 CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL COMMERCIAL
端子面层 Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15)
端子形式 GULL WING GULL WING GULL WING
端子节距 0.5 mm 0.5 mm 0.5 mm
端子位置 QUAD QUAD QUAD
处于峰值回流温度下的最长时间 30 30 30
宽度 20 mm 20 mm 20 mm

 
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