Fixed-Point Digital Signal Processor 196-NFBGA -10 to 70
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 零件包装代码 | BGA |
| 包装说明 | LFBGA, BGA196,14X14,25 |
| 针数 | 196 |
| Reach Compliance Code | compli |
| ECCN代码 | 3A991.A.2 |
| Factory Lead Time | 6 weeks |
| 地址总线宽度 | 21 |
| 桶式移位器 | NO |
| 位大小 | 16 |
| 边界扫描 | YES |
| 最大时钟频率 | 12 MHz |
| 外部数据总线宽度 | 16 |
| 格式 | FIXED POINT |
| 集成缓存 | NO |
| 内部总线架构 | SINGLE |
| JESD-30 代码 | S-PBGA-B196 |
| JESD-609代码 | e1 |
| 长度 | 10 mm |
| 低功率模式 | YES |
| 湿度敏感等级 | 3 |
| DMA 通道数量 | 16 |
| 外部中断装置数量 | 2 |
| 端子数量 | 196 |
| 计时器数量 | 3 |
| 片上数据RAM宽度 | 8 |
| 片上程序ROM宽度 | 8 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | -10 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LFBGA |
| 封装等效代码 | BGA196,14X14,25 |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY, LOW PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 1.05/1.3,1.8/3.3 V |
| 认证状态 | Not Qualified |
| RAM（字数） | 163840 |
| ROM可编程性 | MROM |
| 座面最大高度 | 1.3 mm |
| 最大供电电压 | 1.15 V |
| 最小供电电压 | 0.998 V |
| 标称供电电压 | 1.05 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL |
| 端子节距 | 0.65 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 10 mm |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER |
| Base Number Matches | 1 |
| TMS320C5515AZCH12 | TMS320C5515AZCH10 | TMX320C5515AZCH12 | TMS320C5515AZCHA10 | TMS320C5515AZCHA12 | |
|---|---|---|---|---|---|
| 描述 | Fixed-Point Digital Signal Processor 196-NFBGA -10 to 70 | Fixed-Point Digital Signal Processor 196-NFBGA -10 to 70 | Fixed-Point Digital Signal Processor 196-NFBGA -10 to 70 | Fixed-Point Digital Signal Processor 196-NFBGA -40 to 85 | Fixed-Point Digital Signal Processor 196-NFBGA -40 to 85 |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | BGA | BGA | BGA | BGA | BGA |
| 包装说明 | LFBGA, BGA196,14X14,25 | NFBGA-196 | NFBGA-196 | NFBGA-196 | NFBGA-196 |
| 针数 | 196 | 196 | 196 | 196 | 196 |
| Reach Compliance Code | compli | compli | unknow | compli | compli |
| 地址总线宽度 | 21 | 21 | 21 | 21 | 21 |
| 桶式移位器 | NO | NO | NO | NO | NO |
| 位大小 | 16 | 16 | 16 | 16 | 16 |
| 边界扫描 | YES | YES | YES | YES | YES |
| 最大时钟频率 | 12 MHz | 12 MHz | 12 MHz | 12 MHz | 12 MHz |
| 外部数据总线宽度 | 16 | 16 | 16 | 16 | 16 |
| 格式 | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT |
| 内部总线架构 | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
| JESD-30 代码 | S-PBGA-B196 | S-PBGA-B196 | S-PBGA-B196 | S-PBGA-B196 | S-PBGA-B196 |
| JESD-609代码 | e1 | e1 | e1 | e1 | e1 |
| 长度 | 10 mm | 10 mm | 10 mm | 10 mm | 10 mm |
| 低功率模式 | YES | YES | YES | YES | YES |
| 湿度敏感等级 | 3 | 3 | 3 | 3 | 3 |
| 端子数量 | 196 | 196 | 196 | 196 | 196 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 85 °C | 85 °C |
| 最低工作温度 | -10 °C | -10 °C | -10 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LFBGA | LFBGA | LFBGA | LFBGA | LFBGA |
| 封装等效代码 | BGA196,14X14,25 | BGA196,14X14,25 | BGA196,14X14,25 | BGA196,14X14,25 | BGA196,14X14,25 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | 260 | 260 | NOT SPECIFIED | 260 | 260 |
| 电源 | 1.05/1.3,1.8/3.3 V | 1.05/1.3,1.8/3.3 V | 1.05/1.3,1.8/3.3 V | 1.05/1.3,1.8/3.3 V | 1.05/1.3,1.8/3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM（字数） | 163840 | 163840 | 163840 | 163840 | 163840 |
| 座面最大高度 | 1.3 mm | 1.3 mm | 1.3 mm | 1.3 mm | 1.3 mm |
| 最大供电电压 | 1.15 V | 1.15 V | 1.15 V | 1.15 V | 1.15 V |
| 最小供电电压 | 0.998 V | 0.998 V | 0.998 V | 0.998 V | 0.998 V |
| 标称供电电压 | 1.05 V | 1.05 V | 1.05 V | 1.05 V | 1.05 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL | BALL | BALL | BALL | BALL |
| 端子节距 | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 10 mm | 10 mm | 10 mm | 10 mm | 10 mm |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER |
| 是否无铅 | 不含铅 | 不含铅 | - | 不含铅 | 不含铅 |
| ECCN代码 | 3A991.A.2 | 3A991.A.2 | - | 3A991.A.2 | 3A991.A.2 |
| Factory Lead Time | 6 weeks | 1 week | - | 1 week | 6 weeks |
| 集成缓存 | NO | NO | - | NO | NO |
| DMA 通道数量 | 16 | 16 | - | 16 | 16 |
| 外部中断装置数量 | 2 | 2 | - | 2 | 2 |
| 计时器数量 | 3 | 3 | - | 3 | 3 |
| 片上数据RAM宽度 | 8 | 8 | - | 8 | 8 |
| 片上程序ROM宽度 | 8 | 8 | - | 8 | 8 |
| ROM可编程性 | MROM | MROM | - | MROM | MROM |
| Base Number Matches | 1 | 1 | - | 1 | 1 |
| 厂商名称 | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| Samacsys Status | - | Released | - | Released | Released |
| Samacsys PartID | - | 346760 | - | 379242 | 346759 |
| Samacsys Pin Cou | - | 196 | - | 196 | 196 |
| Samacsys Part Category | - | Integrated Circui | - | Integrated Circui | Integrated Circui |
| Samacsys Package Category | - | Othe | - | Othe | Othe |
| Samacsys Footprint Name | - | BGA196C65P14X14_1000X1000X130 | - | BGA196C65P14X14_1000X1000X130 | BGA196C65P14X14_1000X1000X130 |
| Samacsys Released Date | - | 2017-01-12 12:59:53 | - | 2017-01-12 12:59:53 | 2017-01-12 12:59:53 |
| Is Samacsys | - | N | - | N | N |
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