IC,DECODER/DEMUX,4-TO-16-LINE,HC-CMOS,LLCC,28PIN,CERAMIC
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 包装说明 | QCCN, LCC28,.45SQ |
| Reach Compliance Code | not_compliant |
| JESD-30 代码 | S-XQCC-N28 |
| 逻辑集成电路类型 | OTHER DECODER/DRIVER |
| 功能数量 | 1 |
| 端子数量 | 28 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC |
| 封装代码 | QCCN |
| 封装等效代码 | LCC28,.45SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 电源 | 2/6 V |
| 认证状态 | Not Qualified |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| SN54HC4514FH | SN74HC4514NTP1 | SN74HC4514NT1 | SN74HC4515NTP1 | SN74HC4514JT | SN74HC4514FH | |
|---|---|---|---|---|---|---|
| 描述 | IC,DECODER/DEMUX,4-TO-16-LINE,HC-CMOS,LLCC,28PIN,CERAMIC | IC,DECODER/DEMUX,4-TO-16-LINE,HC-CMOS,DIP,24PIN,PLASTIC | IC,DECODER/DEMUX,4-TO-16-LINE,HC-CMOS,DIP,24PIN,PLASTIC | IC,DECODER/DEMUX,4-TO-16-LINE,HC-CMOS,DIP,24PIN,PLASTIC | IC,DECODER/DEMUX,4-TO-16-LINE,HC-CMOS,DIP,24PIN,CERAMIC | IC,DECODER/DEMUX,4-TO-16-LINE,HC-CMOS,LLCC,28PIN,CERAMIC |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 包装说明 | QCCN, LCC28,.45SQ | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 | QCCN, LCC28,.45SQ |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| JESD-30 代码 | S-XQCC-N28 | R-PDIP-T24 | R-PDIP-T24 | R-PDIP-T24 | R-XDIP-T24 | S-XQCC-N28 |
| 逻辑集成电路类型 | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 28 | 24 | 24 | 24 | 24 | 28 |
| 最高工作温度 | 125 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -55 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | CERAMIC |
| 封装代码 | QCCN | DIP | DIP | DIP | DIP | QCCN |
| 封装等效代码 | LCC28,.45SQ | DIP24,.3 | DIP24,.3 | DIP24,.3 | DIP24,.3 | LCC28,.45SQ |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER |
| 电源 | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | YES | NO | NO | NO | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | NO LEAD |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| 端子位置 | QUAD | DUAL | DUAL | DUAL | DUAL | QUAD |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
