8K ROM Z8 CMOS MICROCONTROLLER
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Zilog, Inc. |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP40,.6 |
| 针数 | 40 |
| Reach Compliance Code | unknown |
| 具有ADC | NO |
| 其他特性 | RAM/ROM PROTECT; OPTIONAL LOW EMI MODE; TWO STANDBY MODES |
| 地址总线宽度 | 16 |
| 位大小 | 8 |
| 边界扫描 | NO |
| CPU系列 | Z8 |
| 最大时钟频率 | 12 MHz |
| DAC 通道 | NO |
| DMA 通道 | NO |
| 外部数据总线宽度 | 8 |
| 格式 | FIXED POINT |
| 集成缓存 | NO |
| JESD-30 代码 | R-PDIP-T40 |
| JESD-609代码 | e0 |
| 长度 | 52.325 mm |
| 低功率模式 | YES |
| DMA 通道数量 | |
| 外部中断装置数量 | 4 |
| I/O 线路数量 | 32 |
| 串行 I/O 数 | 1 |
| 端子数量 | 40 |
| 计时器数量 | 2 |
| 片上数据RAM宽度 | 8 |
| 片上程序ROM宽度 | 8 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| PWM 通道 | NO |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP40,.6 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| RAM（字节） | 236 |
| RAM（字数） | 256 |
| ROM（单词） | 8192 |
| ROM可编程性 | MROM |
| 座面最大高度 | 4.24 mm |
| 速度 | 12 MHz |
| 最大压摆率 | 30 mA |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 15.24 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER |
| Z86C2112PSC | Z86C2116PSC | Z86C2116VSC | Z86C2112VSC | Z86C2116FSC | Z86C2112VEC | Z86C2112FSC | Z86C2112PEC | Z86C21 | Z86C2112FEC | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | 8K ROM Z8 CMOS MICROCONTROLLER | 8K ROM Z8 CMOS MICROCONTROLLER | 8K ROM Z8 CMOS MICROCONTROLLER | 8K ROM Z8 CMOS MICROCONTROLLER | 8K ROM Z8 CMOS MICROCONTROLLER | 8K ROM Z8 CMOS MICROCONTROLLER | 8K ROM Z8 CMOS MICROCONTROLLER | 8K ROM Z8 CMOS MICROCONTROLLER | 8K ROM Z8 CMOS MICROCONTROLLER | 8K ROM Z8 CMOS MICROCONTROLLER |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | - | 不符合 |
| 厂商名称 | Zilog, Inc. | Zilog, Inc. | - | Zilog, Inc. | Zilog, Inc. | Zilog, Inc. | Zilog, Inc. | Zilog, Inc. | - | Zilog, Inc. |
| 零件包装代码 | DIP | DIP | LCC | LCC | QFP | LCC | QFP | DIP | - | QFP |
| 包装说明 | DIP, DIP40,.6 | PLASTIC, DIP-40 | QCCJ, LDCC44,.7SQ | QCCJ, LDCC44,.7SQ | PLASTIC, QFP-44 | QCCJ, LDCC44,.7SQ | QFP, QFP44,.57SQ,32 | DIP, DIP40,.6 | - | QFP, QFP44,.57SQ,32 |
| 针数 | 40 | 40 | 44 | 44 | 44 | 44 | 44 | 40 | - | 44 |
| Reach Compliance Code | unknown | unknown | unknow | unknown | unknown | unknown | unknown | unknown | - | unknown |
| 具有ADC | NO | NO | NO | NO | NO | NO | NO | NO | - | NO |
| 其他特性 | RAM/ROM PROTECT; OPTIONAL LOW EMI MODE; TWO STANDBY MODES | RAM/ROM PROTECT; OPTIONAL LOW EMI MODE; TWO STANDBY MODES | RAM/ROM PROTECT; OPTIONAL ROMLESS MODE; OPTIONAL LOW EMI MODE; TWO STANDBY MODES | RAM/ROM PROTECT; OPTIONAL ROMLESS MODE; OPTIONAL LOW EMI MODE; TWO STANDBY MODES | RAM/ROM PROTECT; OPTIONAL ROMLESS MODE; OPTIONAL LOW EMI MODE; TWO STANDBY MODES | RAM/ROM PROTECT; OPTIONAL ROMLESS MODE; OPTIONAL LOW EMI MODE; TWO STANDBY MODES | RAM/ROM PROTECT; OPTIONAL ROMLESS MODE; OPTIONAL LOW EMI MODE; TWO STANDBY MODES | RAM/ROM PROTECT; OPTIONAL LOW EMI MODE; TWO STANDBY MODES | - | RAM/ROM PROTECT; OPTIONAL ROMLESS MODE; OPTIONAL LOW EMI MODE; TWO STANDBY MODES |
| 地址总线宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | - | 16 |
| 位大小 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | - | 8 |
| 边界扫描 | NO | NO | NO | NO | NO | NO | NO | NO | - | NO |
| CPU系列 | Z8 | Z8 | Z8 | Z8 | Z8 | Z8 | Z8 | Z8 | - | Z8 |
| 最大时钟频率 | 12 MHz | 16 MHz | 16 MHz | 12 MHz | 16 MHz | 12 MHz | 12 MHz | 12 MHz | - | 12 MHz |
| DAC 通道 | NO | NO | NO | NO | NO | NO | NO | NO | - | NO |
| DMA 通道 | NO | NO | NO | NO | NO | NO | NO | NO | - | NO |
| 外部数据总线宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | - | 8 |
| 格式 | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | - | FIXED POINT |
| 集成缓存 | NO | NO | NO | NO | NO | NO | NO | NO | - | NO |
| JESD-30 代码 | R-PDIP-T40 | R-PDIP-T40 | S-PQCC-J44 | S-PQCC-J44 | S-PQFP-G44 | S-PQCC-J44 | S-PQFP-G44 | R-PDIP-T40 | - | S-PQFP-G44 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | - | e0 |
| 长度 | 52.325 mm | 52.325 mm | 16.5862 mm | 16.5862 mm | 10 mm | 16.5862 mm | 10 mm | 52.325 mm | - | 10 mm |
| 低功率模式 | YES | YES | YES | YES | YES | YES | YES | YES | - | YES |
| 外部中断装置数量 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | - | 4 |
| I/O 线路数量 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | - | 32 |
| 串行 I/O 数 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - | 1 |
| 端子数量 | 40 | 40 | 44 | 44 | 44 | 44 | 44 | 40 | - | 44 |
| 计时器数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | - | 2 |
| 片上数据RAM宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | - | 8 |
| 片上程序ROM宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | - | 8 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 105 °C | 70 °C | 105 °C | - | 105 °C |
| PWM 通道 | NO | NO | NO | NO | NO | NO | NO | NO | - | NO |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | QCCJ | QCCJ | QFP | QCCJ | QFP | DIP | - | QFP |
| 封装等效代码 | DIP40,.6 | DIP40,.6 | LDCC44,.7SQ | LDCC44,.7SQ | QFP44,.57SQ,32 | LDCC44,.7SQ | QFP44,.57SQ,32 | DIP40,.6 | - | QFP44,.57SQ,32 |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | RECTANGULAR | - | SQUARE |
| 封装形式 | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | FLATPACK | CHIP CARRIER | FLATPACK | IN-LINE | - | FLATPACK |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | 240 | 225 | 225 | 240 | 240 | 240 | 240 | - | 240 |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | - | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified |
| RAM（字节） | 236 | 236 | 236 | 236 | 236 | 236 | 236 | 236 | - | 236 |
| RAM（字数） | 256 | 256 | 256 | 256 | 256 | 256 | 256 | 256 | - | 256 |
| ROM（单词） | 8192 | 8192 | 8192 | 8192 | 8192 | 8000 | 8000 | 8000 | - | 8000 |
| ROM可编程性 | MROM | MROM | MROM | MROM | MROM | MROM | MROM | MROM | - | MROM |
| 座面最大高度 | 4.24 mm | 4.96 mm | 4.57 mm | 4.57 mm | 2.5 mm | 4.57 mm | 2.5 mm | 4.96 mm | - | 2.5 mm |
| 速度 | 12 MHz | 16 MHz | 16 MHz | 12 MHz | 16 MHz | 12 MHz | 12 MHz | 12 MHz | - | 12 MHz |
| 最大压摆率 | 30 mA | 35 mA | 35 mA | 30 mA | 35 mA | 30 mA | 30 mA | 30 mA | - | 30 mA |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | - | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | - | 5 V |
| 表面贴装 | NO | NO | YES | YES | YES | YES | YES | NO | - | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | - | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | - | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | J BEND | J BEND | GULL WING | J BEND | GULL WING | THROUGH-HOLE | - | GULL WING |
| 端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 0.8 mm | 1.27 mm | 0.8 mm | 2.54 mm | - | 0.8 mm |
| 端子位置 | DUAL | DUAL | QUAD | QUAD | QUAD | QUAD | QUAD | DUAL | - | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | 30 | 30 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
| 宽度 | 15.24 mm | 15.24 mm | 16.5862 mm | 16.5862 mm | 10 mm | 16.5862 mm | 10 mm | 15.24 mm | - | 10 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | - | MICROCONTROLLER |
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