LS SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDIP20, CERAMIC, DIP-20
| 参数名称 | 属性值 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | DIP |
| 包装说明 | CERAMIC, DIP-20 |
| 针数 | 20 |
| Reach Compliance Code | compliant |
| 系列 | LS |
| JESD-30 代码 | R-CDIP-T20 |
| 长度 | 24.515 mm |
| 逻辑集成电路类型 | BUS DRIVER |
| 位数 | 8 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 传播延迟（tpd） | 30 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | TTL |
| 温度等级 | MILITARY |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 7.62 mm |
| SN54LS373J | SN74LS373N | SN74LS374DW | SN54LS374J | SN74LS374N | SN74LS373DW | |
|---|---|---|---|---|---|---|
| 描述 | LS SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDIP20, CERAMIC, DIP-20 | LS SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDIP20, PLASTIC, DIP-20 | LS SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20, PLASTIC, SOIC-20 | IC,FLIP-FLOP,OCTAL,D TYPE,LS-TTL,DIP,20PIN,CERAMIC | LS SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDIP20, PLASTIC, DIP-20 | IC,LATCH,SINGLE,8-BIT,LS-TTL,SOP,20PIN,PLASTIC |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 零件包装代码 | DIP | DIP | SOIC | DIP | DIP | SOIC |
| 包装说明 | CERAMIC, DIP-20 | PLASTIC, DIP-20 | SOP, | DIP, | DIP, | SOP, |
| 针数 | 20 | 20 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | compliant | compliant | unknown | compliant | compliant | compliant |
| 系列 | LS | LS | LS | LS | LS | LS |
| JESD-30 代码 | R-CDIP-T20 | R-PDIP-T20 | R-PDSO-G20 | R-CDIP-T20 | R-PDIP-T20 | R-PDSO-G20 |
| 长度 | 24.515 mm | 26.415 mm | 12.8 mm | 24.515 mm | 26.415 mm | 12.8 mm |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 位数 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 125 °C | 70 °C | 70 °C | 125 °C | 70 °C | 70 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | SOP | DIP | DIP | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE |
| 传播延迟（tpd） | 30 ns | 30 ns | 28 ns | 28 ns | 28 ns | 30 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | 5.08 mm | 2.65 mm | 5.08 mm | 5.08 mm | 2.65 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.25 V | 5.25 V | 5.5 V | 5.25 V | 5.25 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.75 V | 4.75 V | 4.5 V | 4.75 V | 4.75 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | YES | NO | NO | YES |
| 技术 | TTL | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING |
| 端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 7.62 mm | 7.62 mm | 7.5 mm | 7.62 mm | 7.62 mm | 7.5 mm |
| Base Number Matches | - | 1 | 1 | 1 | 1 | - |
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