BCT/FBT SERIES, 10-BIT DRIVER, TRUE OUTPUT, CDIP24, 0.300 INCH, CERAMIC, DIP-24
| 参数名称 | 属性值 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, |
| 针数 | 24 |
| Reach Compliance Code | unknown |
| 系列 | BCT/FBT |
| JESD-30 代码 | R-GDIP-T24 |
| 长度 | 32.005 mm |
| 逻辑集成电路类型 | BUS DRIVER |
| 位数 | 10 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 24 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 传播延迟（tpd） | 8.6 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | BICMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 7.62 mm |
| SN74BCT29841JT | 407F21GM | SN74BCT29841NT-10 | SN74BCT29841W | SN74BCT29841DW-00 | |
|---|---|---|---|---|---|
| 描述 | BCT/FBT SERIES, 10-BIT DRIVER, TRUE OUTPUT, CDIP24, 0.300 INCH, CERAMIC, DIP-24 | Surface Mount Quartz Crystal | BCT/FBT SERIES, 10-BIT DRIVER, TRUE OUTPUT, PDIP24 | BCT/FBT SERIES, 10-BIT DRIVER, TRUE OUTPUT, PDFP24, PLASTIC, DFP-24 | BCT/FBT SERIES, 10-BIT DRIVER, TRUE OUTPUT, PDSO24 |
| 厂商名称 | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 包装说明 | DIP, | - | DIP, | DFP, | SOP, |
| Reach Compliance Code | unknown | - | unknown | unknown | unknown |
| 系列 | BCT/FBT | - | BCT/FBT | BCT/FBT | BCT/FBT |
| JESD-30 代码 | R-GDIP-T24 | - | R-PDIP-T24 | R-PDFP-F24 | R-PDSO-G24 |
| 长度 | 32.005 mm | - | 31.64 mm | 14.36 mm | 15.4 mm |
| 逻辑集成电路类型 | BUS DRIVER | - | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 位数 | 10 | - | 10 | 10 | 10 |
| 功能数量 | 1 | - | 1 | 1 | 1 |
| 端口数量 | 2 | - | 2 | 2 | 2 |
| 端子数量 | 24 | - | 24 | 24 | 24 |
| 最高工作温度 | 70 °C | - | 70 °C | 70 °C | 70 °C |
| 输出特性 | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | - | TRUE | TRUE | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | - | DIP | DFP | SOP |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | - | IN-LINE | FLATPACK | SMALL OUTLINE |
| 传播延迟（tpd） | 8.6 ns | - | 10 ns | 8.6 ns | 10 ns |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | - | 5.08 mm | 2.29 mm | 2.65 mm |
| 最大供电电压 (Vsup) | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | - | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | - | 5 V | 5 V | 5 V |
| 表面贴装 | NO | - | NO | YES | YES |
| 技术 | BICMOS | - | BICMOS | BICMOS | BICMOS |
| 温度等级 | COMMERCIAL | - | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | THROUGH-HOLE | - | THROUGH-HOLE | FLAT | GULL WING |
| 端子节距 | 2.54 mm | - | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | - | DUAL | DUAL | DUAL |
| 宽度 | 7.62 mm | - | 7.62 mm | 9.09 mm | 7.5 mm |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
