ZBT SRAM, 128KX36, 4.2ns, CMOS, PQFP100
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | SAMSUNG(三星) |
| 包装说明 | QFP, QFP100,.63X.87 |
| Reach Compliance Code | unknown |
| 最长访问时间 | 4.2 ns |
| 最大时钟频率 (fCLK) | 133 MHz |
| I/O 类型 | COMMON |
| JESD-30 代码 | R-PQFP-G100 |
| JESD-609代码 | e1 |
| 内存密度 | 4718592 bit |
| 内存集成电路类型 | ZBT SRAM |
| 内存宽度 | 36 |
| 湿度敏感等级 | 3 |
| 端子数量 | 100 |
| 字数 | 131072 words |
| 字数代码 | 128000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 128KX36 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QFP |
| 封装等效代码 | QFP100,.63X.87 |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 2.5/3.3,3.3 V |
| 认证状态 | Not Qualified |
| 最大待机电流 | 0.05 A |
| 最小待机电流 | 3.14 V |
| 最大压摆率 | 0.25 mA |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | TIN SILVER COPPER |
| 端子形式 | GULL WING |
| 端子节距 | 0.635 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 40 |
| K7N403601B-QC13T | K7N401801B-QC130 | K7N401801B-QI130 | K7N401801B-QC13T | K7N401801B-QI13T | K7N403601B-QI13T | K7N403601B-QI130 | K7N403601B-QC130 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | ZBT SRAM, 128KX36, 4.2ns, CMOS, PQFP100 | ZBT SRAM, 256KX18, 4.2ns, CMOS, PQFP100, 20 X 14 MM, TQFP-100 | ZBT SRAM, 256KX18, 4.2ns, CMOS, PQFP100, 20 X 14 MM, TQFP-100 | ZBT SRAM, 256KX18, 4.2ns, CMOS, PQFP100 | ZBT SRAM, 256KX18, 4.2ns, CMOS, PQFP100 | ZBT SRAM, 128KX36, 4.2ns, CMOS, PQFP100 | ZBT SRAM, 128KX36, 4.2ns, CMOS, PQFP100, 20 X 14 MM, TQFP-100 | ZBT SRAM, 128KX36, 4.2ns, CMOS, PQFP100, 20 X 14 MM, TQFP-100 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | QFP, QFP100,.63X.87 | LQFP, QFP100,.63X.87 | LQFP, QFP100,.63X.87 | QFP, QFP100,.63X.87 | QFP, QFP100,.63X.87 | QFP, QFP100,.63X.87 | LQFP, QFP100,.63X.87 | LQFP, QFP100,.63X.87 |
| Reach Compliance Code | unknown | unknown | compliant | unknown | unknown | unknown | compliant | unknown |
| 最长访问时间 | 4.2 ns | 4.2 ns | 4.2 ns | 4.2 ns | 4.2 ns | 4.2 ns | 4.2 ns | 4.2 ns |
| 最大时钟频率 (fCLK) | 133 MHz | 133 MHz | 133 MHz | 133 MHz | 133 MHz | 133 MHz | 133 MHz | 133 MHz |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 |
| 内存密度 | 4718592 bit | 4718592 bit | 4718592 bit | 4718592 bit | 4718592 bit | 4718592 bit | 4718592 bit | 4718592 bit |
| 内存集成电路类型 | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM |
| 内存宽度 | 36 | 18 | 18 | 18 | 18 | 36 | 36 | 36 |
| 端子数量 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 |
| 字数 | 131072 words | 262144 words | 262144 words | 262144 words | 262144 words | 131072 words | 131072 words | 131072 words |
| 字数代码 | 128000 | 256000 | 256000 | 256000 | 256000 | 128000 | 128000 | 128000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 85 °C | 70 °C | 85 °C | 85 °C | 85 °C | 70 °C |
| 组织 | 128KX36 | 256KX18 | 256KX18 | 256KX18 | 256KX18 | 128KX36 | 128KX36 | 128KX36 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QFP | LQFP | LQFP | QFP | QFP | QFP | LQFP | LQFP |
| 封装等效代码 | QFP100,.63X.87 | QFP100,.63X.87 | QFP100,.63X.87 | QFP100,.63X.87 | QFP100,.63X.87 | QFP100,.63X.87 | QFP100,.63X.87 | QFP100,.63X.87 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK | FLATPACK | FLATPACK | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 电源 | 2.5/3.3,3.3 V | 2.5/3.3,3.3 V | 2.5/3.3,3.3 V | 2.5/3.3,3.3 V | 2.5/3.3,3.3 V | 2.5/3.3,3.3 V | 2.5/3.3,3.3 V | 2.5/3.3,3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大待机电流 | 0.05 A | 0.05 A | 0.05 A | 0.05 A | 0.05 A | 0.05 A | 0.05 A | 0.05 A |
| 最小待机电流 | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V |
| 最大压摆率 | 0.25 mA | 0.25 mA | 0.25 mA | 0.25 mA | 0.25 mA | 0.25 mA | 0.25 mA | 0.25 mA |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.635 mm | 0.65 mm | 0.65 mm | 0.635 mm | 0.635 mm | 0.635 mm | 0.65 mm | 0.65 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| JESD-609代码 | e1 | - | e0 | e1 | e1 | e1 | e0 | - |
| 峰值回流温度（摄氏度） | 260 | - | 230 | 260 | 260 | NOT SPECIFIED | 230 | - |
| 端子面层 | TIN SILVER COPPER | - | TIN LEAD | TIN SILVER COPPER | TIN SILVER COPPER | TIN SILVER COPPER | TIN LEAD | - |
| 处于峰值回流温度下的最长时间 | 40 | - | 30 | 40 | 40 | NOT SPECIFIED | 30 | - |
| Base Number Matches | - | 1 | 1 | 1 | 1 | 1 | - | - |
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