Octal Buffers/Drivers With Open-Collector Outputs 20-SOIC 0 to 70
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | SOIC |
| 包装说明 | SOP, SOP20,.4 |
| 针数 | 20 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| Factory Lead Time | 1 week |
| Samacsys Descripti | Texas Instruments SN74BCT760DW Octal Buffer & Line Driver, 3-State, Open Collector, 5V, 20-Pin SOIC |
| 控制类型 | ENABLE LOW |
| 计数方向 | UNIDIRECTIONAL |
| 系列 | BCT/FBT |
| JESD-30 代码 | R-PDSO-G20 |
| JESD-609代码 | e4 |
| 长度 | 12.8 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER |
| 最大I（ol） | 0.064 A |
| 湿度敏感等级 | 1 |
| 位数 | 4 |
| 功能数量 | 2 |
| 端口数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 输出特性 | OPEN-COLLECTOR |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP20,.4 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 包装方法 | TUBE |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 5 V |
| 最大电源电流（ICC） | 76 mA |
| Prop。Delay @ Nom-Su | 10 ns |
| 传播延迟（tpd） | 7.2 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.65 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | BICMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.5 mm |
| SN74BCT760DW | SN74BCT760N | SN74BCT760DWG4 | SN74BCT760NSR | SN74BCT760DWRG4 | SN74BCT760DWR | |
|---|---|---|---|---|---|---|
| 描述 | Octal Buffers/Drivers With Open-Collector Outputs 20-SOIC 0 to 70 | Octal Buffers/Drivers With Open-Collector Outputs 20-PDIP 0 to 70 | Octal Buffers/Drivers With Open-Collector Outputs 20-SOIC 0 to 70 | Buffers & Line Drivers Octal Buffer/Driver | Octal Buffers/Drivers With Open-Collector Outputs 20-SOIC 0 to 70 | Octal Buffers/Drivers With Open-Collector Outputs 20-SOIC 0 to 70 |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | SOIC | DIP | SOIC | SOIC | SOIC | SOIC |
| 包装说明 | SOP, SOP20,.4 | DIP, DIP20,.3 | SOP, SOP20,.4 | SOP, SOP20,.3 | SOP, SOP20,.4 | SOP, SOP20,.4 |
| 针数 | 20 | 20 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | compli | compli | compli | compli | compli | compli |
| ECCN代码 | EAR99 | EAR99 | - | - | EAR99 | EAR99 |
| Factory Lead Time | 1 week | 1 week | 6 weeks | - | 6 weeks | 6 weeks |
| 控制类型 | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | - |
| 计数方向 | UNIDIRECTIONAL | UNIDIRECTIONAL | UNIDIRECTIONAL | - | UNIDIRECTIONAL | - |
| 系列 | BCT/FBT | BCT/FBT | BCT/FBT | BCT/FBT | BCT/FBT | - |
| JESD-30 代码 | R-PDSO-G20 | R-PDIP-T20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | - |
| JESD-609代码 | e4 | e4 | e4 | e4 | e4 | - |
| 长度 | 12.8 mm | 24.325 mm | 12.8 mm | 12.6 mm | 12.8 mm | - |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | - |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | - |
| 最大I（ol） | 0.064 A | 0.064 A | 0.064 A | 0.064 A | 0.064 A | - |
| 湿度敏感等级 | 1 | - | 1 | 1 | 1 | - |
| 位数 | 4 | 4 | 4 | 4 | 4 | - |
| 功能数量 | 2 | 2 | 2 | 2 | 2 | - |
| 端口数量 | 2 | 2 | 2 | 2 | 2 | - |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | - |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | - |
| 输出特性 | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | - |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | SOP | DIP | SOP | SOP | SOP | - |
| 封装等效代码 | SOP20,.4 | DIP20,.3 | SOP20,.4 | SOP20,.3 | SOP20,.4 | - |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | - |
| 包装方法 | TUBE | TUBE | TUBE | TAPE AND REEL | TR | - |
| 峰值回流温度（摄氏度） | 260 | NOT SPECIFIED | 260 | 260 | 260 | - |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | - |
| 最大电源电流（ICC） | 76 mA | 76 mA | 76 mA | 76 mA | 76 mA | - |
| Prop。Delay @ Nom-Su | 10 ns | 10 ns | 10 ns | 10 ns | 10 ns | - |
| 传播延迟（tpd） | 7.2 ns | 7.2 ns | 7.2 ns | 10 ns | 7.2 ns | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 座面最大高度 | 2.65 mm | 5.08 mm | 2.65 mm | 2 mm | 2.65 mm | - |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | - |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | - |
| 表面贴装 | YES | NO | YES | YES | YES | - |
| 技术 | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | - |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | - |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | - |
| 端子形式 | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | - |
| 端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | - |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 宽度 | 7.5 mm | 7.62 mm | 7.5 mm | 5.3 mm | 7.5 mm | - |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
