SRAM Module, 1MX8, 12ns, BICMOS,
| 参数名称 | 属性值 |
| 厂商名称 | EDI [Electronic devices inc.] |
| Reach Compliance Code | unknown |
| 最长访问时间 | 12 ns |
| 其他特性 | CONFIGURABLE AS 256K X 32 |
| 备用内存宽度 | 16 |
| JESD-30 代码 | R-XSMA-N64 |
| 内存密度 | 8388608 bit |
| 内存集成电路类型 | SRAM MODULE |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端口数量 | 1 |
| 端子数量 | 64 |
| 字数 | 1048576 words |
| 字数代码 | 1000000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 1MX8 |
| 输出特性 | 3-STATE |
| 可输出 | YES |
| 封装主体材料 | UNSPECIFIED |
| 封装形状 | RECTANGULAR |
| 封装形式 | MICROELECTRONIC ASSEMBLY |
| 并行/串行 | PARALLEL |
| 认证状态 | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | BICMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | NO LEAD |
| 端子位置 | SINGLE |
| EDI8F32256B12MMC-G | EDI8F32256B10MMC-G | EDI8F32256C20MNC-G | EDI8F32256C35MNC-G | EDI8F32256B10MNC-G | EDI8F32256C25MNC-G | EDI8F32256B15MZC | EDI8F32256B12MNC-G | EDI8F32256B15MMC | EDI8F32256B15MNC | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | SRAM Module, 1MX8, 12ns, BICMOS, | SRAM Module, 1MX8, 10ns, BICMOS, | SRAM Module, 1MX8, 20ns, CMOS, | SRAM Module, 1MX8, 35ns, CMOS, | SRAM Module, 1MX8, 10ns, BICMOS, | SRAM Module, 1MX8, 25ns, CMOS, | SRAM Module, 1MX8, 15ns, BICMOS, | SRAM Module, 1MX8, 12ns, BICMOS, | SRAM Module, 256KX32, 15ns, BICMOS, | SRAM Module, 1MX8, 15ns, BICMOS, |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow | unknow | unknow |
| 最长访问时间 | 12 ns | 10 ns | 20 ns | 35 ns | 10 ns | 25 ns | 15 ns | 12 ns | 15 ns | 15 ns |
| JESD-30 代码 | R-XSMA-N64 | R-XSMA-N64 | R-XSMA-N64 | R-XSMA-N64 | R-XSMA-N64 | R-XSMA-N64 | R-XZMA-T64 | R-XSMA-N64 | R-XSMA-N64 | R-XSMA-N64 |
| 内存密度 | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bi | 8388608 bi | 8388608 bi |
| 内存集成电路类型 | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 32 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
| 字数 | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 262144 words | 1048576 words |
| 字数代码 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 256000 | 1000000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 1MX8 | 1MX8 | 1MX8 | 1MX8 | 1MX8 | 1MX8 | 1MX8 | 1MX8 | 256KX32 | 1MX8 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 可输出 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| 技术 | BICMOS | BICMOS | CMOS | CMOS | BICMOS | CMOS | BICMOS | BICMOS | BICMOS | BICMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | THROUGH-HOLE | NO LEAD | NO LEAD | NO LEAD |
| 端子位置 | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | ZIG-ZAG | SINGLE | SINGLE | SINGLE |
| 厂商名称 | EDI [Electronic devices inc.] | - | EDI [Electronic devices inc.] | EDI [Electronic devices inc.] | EDI [Electronic devices inc.] | EDI [Electronic devices inc.] | EDI [Electronic devices inc.] | EDI [Electronic devices inc.] | EDI [Electronic devices inc.] | EDI [Electronic devices inc.] |
| 其他特性 | CONFIGURABLE AS 256K X 32 | CONFIGURABLE AS 256K X 32 | CONFIGURABLE AS 256K X 32 | CONFIGURABLE AS 256K X 32 | CONFIGURABLE AS 256K X 32 | CONFIGURABLE AS 256K X 32 | CONFIGURABLE AS 256K X 32 | CONFIGURABLE AS 256K X 32 | - | CONFIGURABLE AS 256K X 32 |
| 备用内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | - | 16 |
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