PD - 94353
IRGC49B120KB
Die in Wafer Form
Features
•
•
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•
•
•
•
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GEN5 Non Punch Through (NPT) Technology
Low V
CE(on)
10
µ
s Short Circuit Capability
Square RBSOA
Positive V
CE(on)
Temperature Coefficient
Benchmark Efficiency for Motor Control Applications
Rugged Transient Performance
Excellent Current Sharing in Parallel Operation
Qualified for Industrial Market
C
Benefits
G
E
1200V
I
C(nom)
= 50A
V
CE(on) typ.
=2.33V @
I
C(nom)
@ 25°C
Motor Control IGBT
Short Circuit Rated
150mm Wafer
Reference Standard IR Package Part: IRGPS60B120KD
Electrical Characteristics (Wafer Form)
Parameter
V
CE (on)
V
(BR)CES
V
GE(th)
I
CES
I
GES
Description
Guaranteed (min, max)
Collector-to-Emitter Saturation Voltage
1.35V min, 1.60V max
Colletor-to-Emitter Breakdown Voltage
1200V min
Gate Threshold Voltage
4.4V min, 6.0V max
Zero Gate Voltage Collector Current
20µA max
Gate-to-Emitter Leakage Current
± 1.1µA max
Test Conditions
I
C
= 10A, T
J
= 25°C, V
GE
= 15V
T
J
= 25°C, I
CES
= 500µA, V
GE
= 0V
V
GE
= V
CE
, T
J
=25°C, I
C
= 500µA
T
J
= 25°C, V
CE
= 1200V
T
J
= 25°C, V
GE
= +/-20V
Mechanical Data
Nominal Backmetal Composition, (Thickness)
Nominal Front Metal Composition, (Thickness)
Dimensions
Wafer Diameter
Wafer Thickness, Tolerance
Relevant Die Mechanical Dwg. Number
Minimum Street Width
Reject Ink Dot Size
Ink Dot Location
Recommended Storage Environment
Recommended Die Attach Conditions
Al - Ti - Ni/V - Ag, (1kA - 1kA - 4kA - 6kA)
99% Al/1% Si, (4µm)
0.305" x 0.390"
150mm, with std. < 100 > flat
185µm, +/-15µm
01-5405
100µm
0.25mm diameter minimum
Consistent throughout same wafer lot
Store in original container, in dessicated
nitrogen, with no contamination
For optimum electrical results, die attach
temperature should not exceed 300°C
Die Outline
7.747
[.305]
6.354
[.250]
NOT ES :
1. ALL DIMENS IONS ARE S HOWN IN MILLIMETERS [INCHES ].
2. CONT ROLLING DIMENSION: [INCH].
3. LETT ER DES IGNAT ION:
S = S OURCE
G = GATE
S K = S OURCE KELVIN
IS = CURRENTS ENS E
< 0.635 T OLERANCE = + /- 0.013
< [.0250] T OLERANCE = + /- [.0005]
> 0.635 T OLERANCE = + /- 0.025
> [.0250] T OLERANCE = + /- [.0010]
< 1.270 T OLERANCE = + /- 0.102
< [.050] T OLERANCE = + /- [.004]
> 1.270 T OLERANCE = + /- 0.203
> [.050] T OLERANCE = + /- [.008]
E = EMIT TER
4. DIMENS IONAL T OLERANCES :
9.906
[.390]
8.429
[.332]
BONDING PADS :
WIDT H
&
LENGTH
OVERALL DIE:
EMIT T ER
1.205
[.047]
G
1.196
[.047]
WIDT H
&
LENGTH
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01/09/02
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