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NESG3031M14-FB-A

产品描述RF Small Signal Bipolar Transistor, 0.035A I(C), 1-Element, C Band, Silicon Germanium, NPN, LEADLESS MINIMOLD, M14, 4 PIN
产品类别分立半导体    晶体管   
文件大小73KB,共10页
制造商NEC(日电)
标准
下载文档 详细参数 选型对比 全文预览

NESG3031M14-FB-A概述

RF Small Signal Bipolar Transistor, 0.035A I(C), 1-Element, C Band, Silicon Germanium, NPN, LEADLESS MINIMOLD, M14, 4 PIN

NESG3031M14-FB-A规格参数

参数名称属性值
是否Rohs认证符合
厂商名称NEC(日电)
包装说明LEADLESS MINIMOLD, M14, 4 PIN
Reach Compliance Codecompliant
最大集电极电流 (IC)0.035 A
基于收集器的最大容量0.25 pF
集电极-发射极最大电压4.3 V
配置SINGLE
最高频带C BAND
JESD-30 代码R-PDSO-F4
JESD-609代码e6
湿度敏感等级1
元件数量1
端子数量4
封装主体材料PLASTIC/EPOXY
封装形状RECTANGULAR
封装形式SMALL OUTLINE
峰值回流温度(摄氏度)260
极性/信道类型NPN
认证状态Not Qualified
表面贴装YES
端子面层TIN BISMUTH
端子形式FLAT
端子位置DUAL
处于峰值回流温度下的最长时间10
晶体管应用AMPLIFIER
晶体管元件材料SILICON GERMANIUM

文档预览

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DATA SHEET
NPN SILICON GERMANIUM RF TRANSISTOR
NESG3031M14
NPN SiGe RF TRANSISTOR FOR
LOW NOISE, HIGH-GAIN AMPLIFICATION
4-PIN LEAD-LESS MINIMOLD (M14, 1208 PACKAGE)
FEATURES
• The device is an ideal choice for low noise, high-gain amplification
NF = 0.95 dB TYP., G
a
= 10.0 dB TYP. @ V
CE
= 2 V, I
C
= 6 mA, f = 5.2 GHz
NF = 1.1 dB TYP., G
a
= 9.5 dB TYP. @ V
CE
= 2 V, I
C
= 6 mA, f = 5.8 GHz
• Maximum stable power gain: MSG = 15.0 dB TYP. @ V
CE
= 3 V, I
C
= 20 mA, f = 5.8 GHz
• SiGe HBT technology (UHS3) adopted: f
max
= 110 GHz
• 4-pin lead-less minimold (M14, 1208 package)
ORDERING INFORMATION
Part Number
NESG3031M14
NESG3031M14-T3
Quantity
50 pcs (Non reel)
10 kpcs/reel
• 8 mm wide embossed taping
• Pin 1 (Collector), Pin 4 (Emitter) face the perforation side of the tape
Supplying Form
Remark
To order evaluation samples, contact your nearby sales office.
Unit sample quantity is 50 pcs.
ABSOLUTE MAXIMUM RATINGS (T
A
= +25°C)
Parameter
Collector to Base Voltage
Collector to Emitter Voltage
Emitter to Base Voltage
Collector Current
Total Power Dissipation
Junction Temperature
Storage Temperature
Symbol
V
CBO
V
CEO
V
EBO
I
C
P
tot
Note
Ratings
12.0
4.3
1.5
35
150
150
−65
to +150
Unit
V
V
V
mA
mW
°C
°C
T
j
T
stg
2
Note
Mounted on 1.08 cm
×
1.0 mm (t) glass epoxy PWB
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.
The information in this document is subject to change without notice. Before using this document, please confirm that
this is the latest version.
Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices
representative for availability and additional information.
Document No. PU10415EJ02V0DS (2nd edition)
Date Published July 2004 CP(K)
Printed in Japan
The mark
shows major revised points.
NEC Compound Semiconductor Devices, Ltd. 2003, 2004

NESG3031M14-FB-A相似产品对比

NESG3031M14-FB-A NESG3031M14-T3FB-A NESG3031M14-T3FB NESG3031M14-FB
描述 RF Small Signal Bipolar Transistor, 0.035A I(C), 1-Element, C Band, Silicon Germanium, NPN, LEADLESS MINIMOLD, M14, 4 PIN RF Small Signal Bipolar Transistor, 0.035A I(C), 1-Element, C Band, Silicon Germanium, NPN, LEADLESS MINIMOLD, M14, 4 PIN RF Small Signal Bipolar Transistor, 0.035A I(C), 1-Element, C Band, Silicon Germanium, NPN, LEADLESS MINIMOLD, M14, 4 PIN RF Small Signal Bipolar Transistor, 0.035A I(C), 1-Element, C Band, Silicon Germanium, NPN, LEADLESS MINIMOLD, M14, 4 PIN
是否Rohs认证 符合 符合 不符合 不符合
厂商名称 NEC(日电) NEC(日电) NEC(日电) NEC(日电)
包装说明 LEADLESS MINIMOLD, M14, 4 PIN SMALL OUTLINE, R-PDSO-F4 LEADLESS MINIMOLD, M14, 4 PIN LEADLESS MINIMOLD, M14, 4 PIN
Reach Compliance Code compliant compliant compliant compliant
最大集电极电流 (IC) 0.035 A 0.035 A 0.035 A 0.035 A
基于收集器的最大容量 0.25 pF 0.25 pF 0.25 pF 0.25 pF
集电极-发射极最大电压 4.3 V 4.3 V 4.3 V 4.3 V
配置 SINGLE SINGLE SINGLE SINGLE
最高频带 C BAND C BAND C BAND C BAND
JESD-30 代码 R-PDSO-F4 R-PDSO-F4 R-PDSO-F4 R-PDSO-F4
JESD-609代码 e6 e6 e0 e0
元件数量 1 1 1 1
端子数量 4 4 4 4
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE
峰值回流温度(摄氏度) 260 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
极性/信道类型 NPN NPN NPN NPN
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified
表面贴装 YES YES YES YES
端子面层 TIN BISMUTH TIN BISMUTH TIN LEAD TIN LEAD
端子形式 FLAT FLAT FLAT FLAT
端子位置 DUAL DUAL DUAL DUAL
处于峰值回流温度下的最长时间 10 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
晶体管应用 AMPLIFIER AMPLIFIER AMPLIFIER AMPLIFIER
晶体管元件材料 SILICON GERMANIUM SILICON GERMANIUM SILICON GERMANIUM SILICON GERMANIUM
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