SMT POWER INDUCTORS
Planar - PA1X9X Series
Height:
7.4mm Max
Footprint:
19.8mm x 19.6mm Max
Current Rating:
up to 73A
Inductance Range:
.405µH to 6.2µH
Electrical Specifications @ 25°C — Operating Temperature -40°C to +130°C
8
Part Number
5,7
Inductance
@ Irated
(µH ±15%)
Irated
1
(A
DC
)
DCR
(mΩ)
TYP
.38
.38
.38
.38
.38
.38
.78
.78
.78
.78
.78
.78
1.15
1.15
1.15
1.15
1.15
1.15
1.44
1.44
1.44
1.44
1.44
1.44
MAX
.48
.48
.48
.48
.48
.48
.98
.98
.98
.98
.98
.98
1.43
1.43
1.43
1.43
1.43
1.43
1.80
1.80
1.80
1.80
1.80
1.80
Inductance
@ 0 A
DC
(µH ±15%)
0.45
0.65
0.91
1.10
1.30
1.50
0.45
0.65
0.91
1.10
1.30
1.50
1.0
1.5
2.0
2.5
3.0
3.5
1.60
2.42
3.60
4.40
5.34
6.20
Saturation Current
2
25°C
95
63
46
35
29
24
95
63
46
35
29
24
68
43
29
23
18
15
55
35
20
16
13
11
100°C
80
53
37
30
26
22
80
53
37
30
26
22
54
35
25
21
16
13
43
27
18
15
12
10
Heating
Current
3
(A)
73
73
73
73
73
73
52
52
52
52
52
52
42
42
42
42
42
42
37
37
37
37
37
37
2-T
URN
(L
OW
- L
OSS
) S
ERIES
PA1294.450
0.45
PA1294.650
0.63
PA1294.910
PA1294.112
PA1294.132
PA1294.152
2-T
URN
S
ERIES
PA1292.450
PA1292.650
PA1292.910
PA1292.112
PA1292.132
PA1292.152
3-T
URN
S
ERIES
PA1393.102
PA1393.152
PA1393.202
PA1393.252
PA1393.302
PA1393.352
4-T
URN
S
ERIES
PA1494.162
PA1494.242
PA1494.362
PA1494.442
PA1494.532
PA1494.622
0.85
1.05
1.25
1.45
0.45
0.63
0.85
1.05
1.25
1.45
0.95
1.40
1.90
2.40
2.80
3.40
1.60
2.40
3.30
4.00
4.90
5.80
73
54
39
30
25
21
52
52
39
30
25
21
42
36
25
20
15
12
37
30
17
14
11
9
NOTES:
1. The rated current as listed is either 85% of the saturation current or
the heating current, depending on which value is lower.
2. The saturation current is the current which causes the inductance to
drop by 15% at the stated ambient temperatures (25°C and 100°C).
This current is determined by placing the component in the specified
ambient environment and applying a short duration pulse current (to
eliminate self-heating effects) to the component.
3. The heating current is the DC current which causes the temperature
of the part to increase by approximately 45°C. This current is deter-
mined by mounting the component on a PCB with .25” wide, 2 oz.
equivalent copper traces, and applying the current to the device for
30 minutes with no forced air cooling.
4. In high volt*time applications, additional heating in the component
can occur due to core losses in the inductor which may neccessitate
derating the current in order to limit the temperature rise of the
component. In order to determine the approximate total losses
(or temperature rise) for a given application, the total copper and core
losses should be taken into account. For approximate value of core
losses, in a given application, use the core loss graph on page 24.
5. Optional Tape & Reel packaging can be ordered by adding a "T"
suffix to the part number (i.e. PA1294.450 becomes PA1294.450T).
Pulse complies to industry standard tape and reel specification EIA481.
6. Meets solderability test per IPC/EIA J-STD-002B using flux type ORL0.
7. To order RoHS compliant part, add the suffix “NL” to the part number
(i.e. PA1294.450 becomes PA1294.450NL and PA1294.450T
becomes PA1294.450NLT).
8. The temperature of the component (ambient plus temperature rise)
must be within the stated operating temperature range.
USA 858 674 8100
•
Germany 49 7032 7806 0
•
Singapore 65 6287 8998
•
Shanghai
86 21 54643211 / 2
•
China 86 755 33966678
•
Taiwan 886 3 4641811
www.pulseeng.com
66
SPM2007 (7/07)
SMT POWER INDUCTORS
Planar - PA1X9X Series
Inductance vs. Current Characteristics (25°C)
1.80
1.60
1.40
1.20
1.00
0.80
0.60
0.40
0.20
1
4
7
10
13
16
19
22
25
28
31
34
37
40
43
46
49
52
55
58
61
64
67
70
73
76
79
82
85
88
91
94
97
PA1292.XXX & PA1294.XXX Series
Inductance (uH)
4.00
3.50
3.00
2.50
2.00
1.50
1.00
0.50
0.00
PA1393.XXX Series
Inductance (uH)
Current (Amps DC)
7.00
6.00
PA1494.XXX Series
Inductance (uH)
5.00
4.00
3.00
2.00
1.00
0.00
1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
47
49
51
53
55
57
59
Current (Amps DC)
CoreLoss = 1.59E-13*(DB)
2.5
*(Freq_kHz)
1.8
Core Loss vs. Flux Density
2.0
Temperature Rise (°C)
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
Core Loss (W)
100kHz
200kHz
300kHz
400kHz
500kHz
600kHz
700kHz
0
500
1000
DB
= 179 * L(µH) *
DA
/ (Pri_Turns)
D
B (Gauss)
1500
2000
2500
Total Power Dissipation = Copper Loss (W) + Core Loss (W)
Copper Loss (W) = Current (rms)
2
* DCR (mW) / 1000 Core
Loss (W) = per table
USA 858 674 8100
•
Germany 49 7032 7806 0
•
Singapore 65 6287 8998
•
Shanghai
86 21 54643211 / 2
•
China 86 755 33966678
•
Taiwan 886 3 4641811
www.pulseeng.com
68
1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
47
49
51
53
55
57
59
61
63
65
67
69
71
73
0.00
Current (Amps DC)
Temperature Rise vs. Power (W) Dissipation
120
100
80
60
40
20
0
0
1
2
3
4
5
6
7
Total Power (W) Dissipation
SPM2007 (7/07)
Microchip MCU
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