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IDT71T64805S100BQ

产品描述QDR SRAM, 512KX18, 3ns, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165
产品类别存储    存储   
文件大小253KB,共17页
制造商IDT (Integrated Device Technology)
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IDT71T64805S100BQ概述

QDR SRAM, 512KX18, 3ns, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165

IDT71T64805S100BQ规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称IDT (Integrated Device Technology)
零件包装代码BGA
包装说明TBGA,
针数165
Reach Compliance Codecompliant
ECCN代码3A991.B.2.A
最长访问时间3 ns
其他特性ALSO REQUIRES 1.5V I/O POWER SUPPLY
JESD-30 代码R-PBGA-B165
JESD-609代码e0
长度15 mm
内存密度9437184 bit
内存集成电路类型QDR SRAM
内存宽度18
湿度敏感等级3
功能数量1
端子数量165
字数524288 words
字数代码512000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织512KX18
封装主体材料PLASTIC/EPOXY
封装代码TBGA
封装形状RECTANGULAR
封装形式GRID ARRAY, THIN PROFILE
并行/串行PARALLEL
峰值回流温度(摄氏度)225
认证状态Not Qualified
座面最大高度1.2 mm
最大供电电压 (Vsup)2.6 V
最小供电电压 (Vsup)2.4 V
标称供电电压 (Vsup)2.5 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Lead (Sn/Pb)
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间20
宽度13 mm

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9Mb Pipelined
QDR™ SRAM
Burst of 4
x
x
Advance
Information
IDT71T64805
Features
9Mb Density (512K x 18)
Separate Independent Read and Write Data Ports
— Supports concurrent transactions
333 MHz Data Rate for High Bandwidth Applications
Fast Clock-to Valid access times
— 2.5ns for 166 MHz version
4-Word Burst for reduced address bus frequency
(same as the external clock rate)
Double Data Rate (DDR) interfaces on both Read and
Write ports (data transferred at 333 MHz)
Two input clocks (K and
K),
using rising edges only, for
precise DDR timing
Two output clocks (C and
C)
compensate for clock skew
and flight time mismatches
— Clock and data delivered together to receiving device
Single multiplexed address input bus latches address
inputs for both READ and WRITE ports
Separate Port Enables for depth expansion
Synchronous internally self-timed writes
2.5V core power supply with HSTL Inputs and Outputs
165-ball, 1.0mm pitch 13mm x 15mm fBGA package
Variable drive HSTL output buffers
JTAG Interface
Description
The IDT71T64805 is a 2.5V synchronous pipelined SRAM equipped
with QDR™ architecture. QDR architecture consists of two separate
ports to access the memory array. The Read port has dedicated Data
Outputs to support Read operations, and the Write Port has dedi-
cated Data Inputs to support Write operations. QDR architecture has
separate data inputs and data outputs to completely eliminate the
need to “turn-around” the data bus required with common I/O de-
vices. Access to each port is accomplished through a common ad-
dress bus. Addresses for Read and Write addresses are latched on
alternate rising edges of the input (K) clock. Accesses to the IDT71T64805
Read and Write ports are completely independent of one another. In
order to maximize data throughout, both Read and Write ports are equipped
with Double Data Rate (DDR) interfaces. Each address location is asso-
ciated with four 18-bit words that burst sequentially into or out of the
device. Since data can be transferred into and out of the device on every
rising edge of both input clocks (K/K and C/C), memory bandwidth is
maximized while simplifying system design by eliminating bus “turn-
arounds.”
Depth expansion is accomplished with Port Enables for each port.
Port enables allow each port to operate independently.
All synchronous inputs pass through input registers controlled by
the K or
K
input clocks. All data outputs pass through output registers
controlled by the C or
C
input clocks. Writes are conducted with on-
chip synchronous self-timed write circuitry.
x
x
x
x
x
x
x
x
x
x
x
x
x
Pin Description Summary
A
0
- A
16
Address Inputs
Read Port Enable
Write Port Enable
Individual Byte Write Selects
Clock signals for Data, Address and Control Inputs
Data Output Clocks
Data Input
Data Output
Output Impedance Matching Input
JTAG Inputs
JTAG Output
Reference Voltage Input
Core and Output Power
Ground
Input
Input
Input
Input
Input
Input
Input
Output
Input
Input
Input
Input
Supply
Supply
Synchronous
Synchronous
Synchronous
Synchronous
N/A
N/A
Synchronous
Synchronous
Static
N/A
N/A
Static
Static
Static
5284 tbl 01
RPE
WPE
BW
0
,
BW
1
K,
K
C,
C
D
0
-
D
17
Q
0
-
Q
17
ZQ
TMS, TDI, TCK
TDO
V
REF
V
DD,
V
DDQ
V
SS
QDR SRAMs and Quad Data Rate comprise a new family of products developed by IDT Inc., Cypress Semiconductor and Micron Technology.
AUGUST 2000
DSC-5284/04
1
©2000 Integrated Device Technology, Inc.

IDT71T64805S100BQ相似产品对比

IDT71T64805S100BQ IDT71T64805S133BQ IDT71T64805S166BQ
描述 QDR SRAM, 512KX18, 3ns, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165 QDR SRAM, 512KX18, 3ns, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165 QDR SRAM, 512KX18, 2.5ns, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165
是否无铅 含铅 含铅 含铅
是否Rohs认证 不符合 不符合 不符合
零件包装代码 BGA BGA BGA
包装说明 TBGA, TBGA, TBGA,
针数 165 165 165
Reach Compliance Code compliant compliant compliant
ECCN代码 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
最长访问时间 3 ns 3 ns 2.5 ns
其他特性 ALSO REQUIRES 1.5V I/O POWER SUPPLY ALSO REQUIRES 1.5V I/O POWER SUPPLY ALSO REQUIRES 1.5V I/O POWER SUPPLY
JESD-30 代码 R-PBGA-B165 R-PBGA-B165 R-PBGA-B165
JESD-609代码 e0 e0 e0
长度 15 mm 15 mm 15 mm
内存密度 9437184 bit 9437184 bit 9437184 bit
内存集成电路类型 QDR SRAM QDR SRAM QDR SRAM
内存宽度 18 18 18
湿度敏感等级 3 3 3
功能数量 1 1 1
端子数量 165 165 165
字数 524288 words 524288 words 524288 words
字数代码 512000 512000 512000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 70 °C 70 °C 70 °C
组织 512KX18 512KX18 512KX18
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TBGA TBGA TBGA
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 GRID ARRAY, THIN PROFILE GRID ARRAY, THIN PROFILE GRID ARRAY, THIN PROFILE
并行/串行 PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) 225 225 225
认证状态 Not Qualified Not Qualified Not Qualified
座面最大高度 1.2 mm 1.2 mm 1.2 mm
最大供电电压 (Vsup) 2.6 V 2.6 V 2.6 V
最小供电电压 (Vsup) 2.4 V 2.4 V 2.4 V
标称供电电压 (Vsup) 2.5 V 2.5 V 2.5 V
表面贴装 YES YES YES
技术 CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 BALL BALL BALL
端子节距 1 mm 1 mm 1 mm
端子位置 BOTTOM BOTTOM BOTTOM
处于峰值回流温度下的最长时间 20 20 20
宽度 13 mm 13 mm 13 mm
厂商名称 IDT (Integrated Device Technology) - IDT (Integrated Device Technology)
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