PCM Codec, MU-Law, 1-Func, CMOS, PDIP16, 0.300 INCH, 2.54 MM PITCH, PLASTIC, DIP-16
参数名称 | 属性值 |
厂商名称 | OKI |
零件包装代码 | DIP |
包装说明 | DIP, |
针数 | 16 |
Reach Compliance Code | unknown |
压伸定律 | MU-LAW |
滤波器 | YES |
JESD-30 代码 | R-PDIP-T16 |
长度 | 19.05 mm |
功能数量 | 1 |
端子数量 | 16 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | -10 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
认证状态 | Not Qualified |
座面最大高度 | 5.08 mm |
标称供电电压 | 5 V |
表面贴装 | NO |
技术 | CMOS |
电信集成电路类型 | PCM CODEC |
温度等级 | COMMERCIAL |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
宽度 | 7.62 mm |
MSM7508BRS | 253C203A45NB | MSM7508BGS-K | MSM7509BGS-K | MSM7508BJS | MSM7509BJS | |
---|---|---|---|---|---|---|
描述 | PCM Codec, MU-Law, 1-Func, CMOS, PDIP16, 0.300 INCH, 2.54 MM PITCH, PLASTIC, DIP-16 | Two Axis, Ministick Controller With Optional Momentary Switch | PCM Codec, MU-Law, 1-Func, CMOS, PDSO24, 0.430 INCH, 1.27 MM PITCH, PLASTIC, SOP-24 | PCM Codec, A-Law, 1-Func, CMOS, PDSO24, 0.430 INCH, 1.27 MM PITCH, PLASTIC, SOP-24 | PCM Codec, MU-Law, 1-Func, CMOS, PQCC28, 0.450 INCH, 1.27 MM PITCH, PLASTIC, QFJ-28 | PCM Codec, A-Law, 1-Func, CMOS, PQCC28, 0.450 INCH, 1.27 MM PITCH, PLASTIC, QFJ-28 |
厂商名称 | OKI | - | OKI | OKI | OKI | OKI |
零件包装代码 | DIP | - | SOIC | SOIC | QFJ | QFJ |
包装说明 | DIP, | - | SOP, | SOP, | QCCJ, | QCCJ, |
针数 | 16 | - | 24 | 24 | 28 | 28 |
Reach Compliance Code | unknown | - | unknown | unknown | unknown | unknown |
压伸定律 | MU-LAW | - | MU-LAW | A-LAW | MU-LAW | A-LAW |
滤波器 | YES | - | YES | YES | YES | YES |
JESD-30 代码 | R-PDIP-T16 | - | R-PDSO-G24 | R-PDSO-G24 | S-PQCC-J28 | S-PQCC-J28 |
长度 | 19.05 mm | - | 15.95 mm | 15.95 mm | 11.51 mm | 11.51 mm |
功能数量 | 1 | - | 1 | 1 | 1 | 1 |
端子数量 | 16 | - | 24 | 24 | 28 | 28 |
工作模式 | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 70 °C | - | 70 °C | 70 °C | 70 °C | 70 °C |
最低工作温度 | -10 °C | - | -10 °C | -10 °C | -10 °C | -10 °C |
封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | - | SOP | SOP | QCCJ | QCCJ |
封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE |
封装形式 | IN-LINE | - | SMALL OUTLINE | SMALL OUTLINE | CHIP CARRIER | CHIP CARRIER |
认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 5.08 mm | - | 2.5 mm | 2.5 mm | 4.55 mm | 4.55 mm |
标称供电电压 | 5 V | - | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | - | YES | YES | YES | YES |
技术 | CMOS | - | CMOS | CMOS | CMOS | CMOS |
电信集成电路类型 | PCM CODEC | - | PCM CODEC | PCM CODEC | PCM CODEC | PCM CODEC |
温度等级 | COMMERCIAL | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | THROUGH-HOLE | - | GULL WING | GULL WING | J BEND | J BEND |
端子节距 | 2.54 mm | - | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | - | DUAL | DUAL | QUAD | QUAD |
宽度 | 7.62 mm | - | 7.9 mm | 7.9 mm | 11.51 mm | 11.51 mm |
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