OTP ROM, 512X8, 30ns, Bipolar, CDIP22, 0.400 INCH, CERAMIC, DIP-22
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | AMD(超微) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP22,.4 |
| 针数 | 22 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 最长访问时间 | 30 ns |
| JESD-30 代码 | R-GDIP-T22 |
| JESD-609代码 | e0 |
| 长度 | 27.4955 mm |
| 内存密度 | 4096 bit |
| 内存集成电路类型 | OTP ROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 22 |
| 字数 | 512 words |
| 字数代码 | 512 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 组织 | 512X8 |
| 输出特性 | 3-STATE |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装等效代码 | DIP22,.4 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 Class B (Modified) |
| 座面最大高度 | 5.588 mm |
| 最大供电电压 (Vsup) | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | BIPOLAR |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 10.16 mm |
| AM27S27/DMC | AM27S27ADC | AM27S27ADCB | AM27S27DCB | AM27S27/BKA | AM27S27A/BWA | AM27S27A/DMC | AM27S27A/BKA | AM27S27/BWA | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | OTP ROM, 512X8, 30ns, Bipolar, CDIP22, 0.400 INCH, CERAMIC, DIP-22 | OTP ROM, 512X8, 17ns, Bipolar, CDIP22, 0.400 INCH, CERAMIC, DIP-22 | OTP ROM, 512X8, 17ns, Bipolar, CDIP22, 0.400 INCH, CERAMIC, DIP-22 | OTP ROM, 512X8, 27ns, Bipolar, CDIP22, 0.400 INCH, CERAMIC, DIP-22 | OTP ROM, 512X8, 30ns, Bipolar, CDFP24, FP-24 | OTP ROM, 512X8, 20ns, Bipolar, CDIP22, 0.400 INCH, CERAMIC, DIP-22 | OTP ROM, 512X8, 20ns, Bipolar, CDIP22, 0.400 INCH, CERAMIC, DIP-22 | OTP ROM, 512X8, 20ns, Bipolar, CDFP24, FP-24 | OTP ROM, 512X8, 30ns, Bipolar, CDIP22, 0.400 INCH, CERAMIC, DIP-22 |
| 零件包装代码 | DIP | DIP | DIP | DIP | DFP | DIP | DIP | DFP | DIP |
| 包装说明 | DIP, DIP22,.4 | DIP, DIP22,.4 | DIP, DIP22,.4 | DIP, DIP22,.4 | DFP, FL24,.4 | DIP, DIP22,.4 | DIP, DIP22,.4 | DFP, | DIP, DIP22,.4 |
| 针数 | 22 | 22 | 22 | 22 | 24 | 22 | 22 | 24 | 22 |
| Reach Compliance Code | unknown | unknow | unknow | unknow | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 30 ns | 17 ns | 17 ns | 27 ns | 30 ns | 20 ns | 20 ns | 20 ns | 30 ns |
| JESD-30 代码 | R-GDIP-T22 | R-GDIP-T22 | R-GDIP-T22 | R-GDIP-T22 | R-GDFP-F24 | R-GDIP-T22 | R-GDIP-T22 | R-GDFP-F24 | R-GDIP-T22 |
| 长度 | 27.4955 mm | 27.4955 mm | 27.4955 mm | 27.4955 mm | 15.367 mm | 27.4955 mm | 27.4955 mm | 15.367 mm | 27.4955 mm |
| 内存密度 | 4096 bit | 4096 bi | 4096 bi | 4096 bi | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bit |
| 内存集成电路类型 | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 22 | 22 | 22 | 22 | 24 | 22 | 22 | 24 | 22 |
| 字数 | 512 words | 512 words | 512 words | 512 words | 512 words | 512 words | 512 words | 512 words | 512 words |
| 字数代码 | 512 | 512 | 512 | 512 | 512 | 512 | 512 | 512 | 512 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 125 °C | 75 °C | 75 °C | 75 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | - | - | - | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 组织 | 512X8 | 512X8 | 512X8 | 512X8 | 512X8 | 512X8 | 512X8 | 512X8 | 512X8 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP | DIP | DIP | DIP | DFP | DIP | DIP | DFP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | FLATPACK | IN-LINE | IN-LINE | FLATPACK | IN-LINE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.588 mm | 5.588 mm | 5.588 mm | 5.588 mm | 2.286 mm | 5.588 mm | 5.588 mm | 2.286 mm | 5.588 mm |
| 最大供电电压 (Vsup) | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.5 V | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.5 V | 4.75 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | NO | YES | NO | NO | YES | NO |
| 技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| 温度等级 | MILITARY | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | FLAT | THROUGH-HOLE | THROUGH-HOLE | FLAT | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 9.525 mm | 10.16 mm | 10.16 mm | 9.525 mm | 10.16 mm |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | - | 不符合 |
| 厂商名称 | AMD(超微) | - | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | - | e0 |
| 封装等效代码 | DIP22,.4 | DIP22,.4 | DIP22,.4 | DIP22,.4 | FL24,.4 | DIP22,.4 | DIP22,.4 | - | DIP22,.4 |
| 筛选级别 | MIL-STD-883 Class B (Modified) | - | - | - | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | MIL-STD-883 Class B (Modified) | - | 38535Q/M;38534H;883B |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
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