F-215 (Rev 11AUG15)
SEAFP–50–01–L–10–RA–GP
(1.27 mm) .050"
SEAFP-RA SERIES
HIGH DENSITY PRESS FIT OPEN PIN FIELD
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?SEAFP-RA
Insulator Material:
Natural LCP
Contact Material:
Copper Alloy
Operating Temp Range:
-55°C to +125°C
Current Rating:
1.3 A per pin
(10 adjacent pins powered)
Plating:
Au or Sn over
50 µ" (1.27 µm) Ni
Working Voltage:
195VAC/ 275VDC
RoHS Compliant:
Yes
Mates with:
SEAM, SEAM-RA, SEAMP
Edge Rate
®
contact
®
Press fit
tails
8 or 10 rows
Optional
guide post holes
SEAFP
NO. OF
POSITIONS
01
PLATING
OPTION
NO. OF
ROWS
RA
OPTION
– 20, – 30,
–40, –50
–L
= 10 µ" (0.25 µm) Gold on contact area,
Matte Tin on solder tail
– 08
= Eight
Rows
– GP
=Guide Post Hole
–S
= 30 µ" (0.76 µm) Gold on contact area,
Matte Tin on solder tail
– 10
= Ten
Rows
NO. OF
POSITIONS
–20
–30
(10.41)
.410
A
(32.26)
1.270
(44.96)
1.770
(57.66)
2.270
(70.36)
2.770
B
(44.96)
1.770
(57.66)
2.270
(70.36)
2.770
(83.06)
3.270
B
(36.45)
1.435
(49.15)
1.935
(61.85)
2.435
(74.55)
.2.935
(With -GP) (W/O -GP)
C
(39.45)
.1.553
(52.15)
2.053
(64.85)
2.553
(77.55)
3.053
–40
–50
B (with –GP)
A
C
(1.27) .050
(19.10) .752
08
Note:
Compliant pin fixture
CAT-SEAFP-XX-XX-RA.
Note:
Applications with
varying board thickness
refer to Samtec compliant
pin termination specifications.
Note:
Some sizes, styles and
options are non-standard,
non-returnable.
(1.27) .050
01
(6.12) (12.95)
.241
.510
(12.55)
.494
(2.54)
.100
B (without –GP)
–GP (8 ROW) SHOWN
(1.27)
.050
(1.23)
.049
WWW.SAMTEC.COM
Due to technical progress, all designs, specifications and components are subject to change without notice.
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
