Flash PLD, 10ns, CMOS, PDIP20, 0.300 INCH, PLASTIC, DIP-20
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | Atmel (Microchip) |
零件包装代码 | DIP |
包装说明 | DIP, |
针数 | 20 |
Reach Compliance Code | not_compliant |
其他特性 | 8 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK |
JESD-30 代码 | R-PDIP-T20 |
JESD-609代码 | e0 |
长度 | 25.9 mm |
湿度敏感等级 | 1 |
专用输入次数 | 8 |
I/O 线路数量 | 8 |
端子数量 | 20 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
组织 | 8 DEDICATED INPUTS, 8 I/O |
输出函数 | MACROCELL |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
峰值回流温度(摄氏度) | 225 |
可编程逻辑类型 | FLASH PLD |
传播延迟 | 10 ns |
认证状态 | Not Qualified |
座面最大高度 | 5.33 mm |
最大供电电压 | 5.5 V |
最小供电电压 | 4.5 V |
标称供电电压 | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 7.62 mm |
ATF16V8CZ-10PI | ATF16V8CZ-10PC | 170M6809 | ATF16V8CZ-10JI | ATF16V8CZ-10PL | ATF16V8CZ-10PJ | ATF16V8CZ-10JL | ATF16V8CZ-10JJ | |
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描述 | Flash PLD, 10ns, CMOS, PDIP20, 0.300 INCH, PLASTIC, DIP-20 | Flash PLD, 10ns, CMOS, PDIP20, 0.300 INCH, PLASTIC, DIP-20 | 690V/700V (IEC/U.L.) | Flash PLD, 10ns, CMOS, PQCC20, PLASTIC, JLCC-20 | Flash PLD, 10ns, CMOS, PDIP20, 0.300 INCH, PLASTIC, DIP-20 | Flash PLD, 10ns, CMOS, PDIP20, 0.300 INCH, PLASTIC, DIP-20 | Flash PLD, 10ns, CMOS, PQCC20, PLASTIC, JLCC-20 | Flash PLD, 10ns, CMOS, PQCC20, PLASTIC, JLCC-20 |
厂商名称 | Atmel (Microchip) | Atmel (Microchip) | - | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) |
零件包装代码 | DIP | DIP | - | QLCC | DIP | DIP | QLCC | QLCC |
包装说明 | DIP, | DIP, | - | QCCJ, | DIP, | DIP, | QCCJ, | QCCJ, |
针数 | 20 | 20 | - | 20 | 20 | 20 | 20 | 20 |
Reach Compliance Code | not_compliant | not_compliant | - | compliant | unknown | unknown | unknown | compliant |
其他特性 | 8 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK | 8 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK | - | 8 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK | 8 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK | 8 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK | 8 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK | 8 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK |
JESD-30 代码 | R-PDIP-T20 | R-PDIP-T20 | - | S-PQCC-J20 | R-PDIP-T20 | R-PDIP-T20 | S-PQCC-J20 | S-PQCC-J20 |
JESD-609代码 | e0 | e0 | - | e0 | e0 | e0 | e0 | e3 |
长度 | 25.9 mm | 25.9 mm | - | 8.9662 mm | 25.9 mm | 25.9 mm | 8.9662 mm | 8.9662 mm |
湿度敏感等级 | 1 | 1 | - | 2 | 1 | 1 | 2 | 2 |
专用输入次数 | 8 | 8 | - | 8 | 8 | 8 | 8 | 8 |
I/O 线路数量 | 8 | 8 | - | 8 | 8 | 8 | 8 | 8 |
端子数量 | 20 | 20 | - | 20 | 20 | 20 | 20 | 20 |
最高工作温度 | 85 °C | 70 °C | - | 85 °C | 70 °C | 85 °C | 70 °C | 85 °C |
组织 | 8 DEDICATED INPUTS, 8 I/O | 8 DEDICATED INPUTS, 8 I/O | - | 8 DEDICATED INPUTS, 8 I/O | 8 DEDICATED INPUTS, 8 I/O | 8 DEDICATED INPUTS, 8 I/O | 8 DEDICATED INPUTS, 8 I/O | 8 DEDICATED INPUTS, 8 I/O |
输出函数 | MACROCELL | MACROCELL | - | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | DIP | - | QCCJ | DIP | DIP | QCCJ | QCCJ |
封装形状 | RECTANGULAR | RECTANGULAR | - | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE |
封装形式 | IN-LINE | IN-LINE | - | CHIP CARRIER | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER |
峰值回流温度(摄氏度) | 225 | 225 | - | 225 | 225 | 225 | 225 | 245 |
可编程逻辑类型 | FLASH PLD | FLASH PLD | - | FLASH PLD | FLASH PLD | FLASH PLD | FLASH PLD | FLASH PLD |
传播延迟 | 10 ns | 10 ns | - | 10 ns | 10 ns | 10 ns | 10 ns | 10 ns |
认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 5.33 mm | 5.33 mm | - | 4.57 mm | 5.33 mm | 5.33 mm | 4.57 mm | 4.57 mm |
最大供电电压 | 5.5 V | 5.25 V | - | 5.5 V | 5.25 V | 5.5 V | 5.25 V | 5.5 V |
最小供电电压 | 4.5 V | 4.75 V | - | 4.5 V | 4.75 V | 4.5 V | 4.75 V | 4.5 V |
标称供电电压 | 5 V | 5 V | - | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | - | YES | NO | NO | YES | YES |
技术 | CMOS | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | COMMERCIAL | - | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | Matte Tin (Sn) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | - | J BEND | THROUGH-HOLE | THROUGH-HOLE | J BEND | J BEND |
端子节距 | 2.54 mm | 2.54 mm | - | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | - | QUAD | DUAL | DUAL | QUAD | QUAD |
处于峰值回流温度下的最长时间 | 30 | 30 | - | 30 | 30 | 30 | 30 | 40 |
宽度 | 7.62 mm | 7.62 mm | - | 8.9662 mm | 7.62 mm | 7.62 mm | 8.9662 mm | 8.9662 mm |
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