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BU-65171V5-130

产品描述Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, CDFP70, 1.900 X 1 INCH, 0.150 INCH HEIGHT, LOW PROFILE, CERAMIC, FP-70
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小298KB,共44页
制造商Data Device Corporation
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BU-65171V5-130概述

Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, CDFP70, 1.900 X 1 INCH, 0.150 INCH HEIGHT, LOW PROFILE, CERAMIC, FP-70

BU-65171V5-130规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称Data Device Corporation
零件包装代码DFP
包装说明1.900 X 1 INCH, 0.150 INCH HEIGHT, LOW PROFILE, CERAMIC, FP-70
针数70
Reach Compliance Codecompliant
地址总线宽度16
边界扫描NO
最大时钟频率16 MHz
通信协议MIL-STD-1553A; MIL-STD-1553B
数据编码/解码方法BIPH-LEVEL(MANCHESTER)
最大数据传输速率0.125 MBps
外部数据总线宽度16
JESD-30 代码R-CDFP-F70
JESD-609代码e0
低功率模式NO
串行 I/O 数2
端子数量70
最高工作温度125 °C
最低工作温度-55 °C
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装代码DFP
封装形状RECTANGULAR
封装形式FLATPACK
峰值回流温度(摄氏度)NOT SPECIFIED
认证状态Not Qualified
座面最大高度3.81 mm
最大供电电压5.5 V
最小供电电压4.5 V
标称供电电压5 V
表面贴装YES
技术CMOS
温度等级MILITARY
端子面层TIN LEAD
端子形式FLAT
端子节距1.27 mm
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
uPs/uCs/外围集成电路类型SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553

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BU-65170/61580 and BU-61585
MIL-STD-1553A/B NOTICE 2 RT and BC/RT/MT,
ADVANCED COMMUNICATION ENGINE (ACE)
ACE User’s Guide
Also Available
DESCRIPTION
DDC's BU-65170, BU-61580 and
BU-61585 Bus Controller / Remote
Terminal
/
Monitor
Terminal
(BC/RT/MT)
A d v a n c e d
Communication Engine (ACE) termi-
nals comprise a complete integrated
interface between a host processor
and a MIL-STD-1553 A and B or
STANAG 3838 bus.
The ACE series is packaged in a 1.9 -
square-inch, 70-pin, low-profile,
cofired MultiChip Module (MCM)
ceramic package that is well suited for
applications with stringent height
requirements.
The BU-61585 ACE integrates dual
transceiver, protocol, memory man-
agement, processor interface logic,
and a total of 12K words of RAM in a
choice of DIP or flat pack packages.
The BU-61585 requires +5 V power
and either -15 V or -12 V power.
The BU-61585 internal RAM can be
configured as 12K x 16 or 8K x 17.
The 8K x 17 RAM feature provides
capability for memory integrity check-
ing by implementing RAM parity gen-
eration and verification on all access-
es. To minimize board space and
“glue” logic, the ACE provides ultimate
flexibility in interfacing to a host
processor and internal/external RAM.
The advanced functional architecture
of the ACE terminals provides soft-
ware
compatibility
to
DDC's
Advanced Integrated Multiplexer (AIM)
series hybrids, while incorporating a
multiplicity of architectural enhance-
ments. It allows flexible operation
while off-loading the host processor,
ensuring data sample consistency,
and supports bulk data transfers.
The ACE hybrids may be operated at
either 12 or 16 MHz. Wire bond
options allow for programmable RT
address (hardwired is standard) and
external transmitter inhibit inputs.
FEATURES
Fully Integrated MIL-STD-1553
Interface Terminal
Interface
Flexible Processor/Memory
Standard 4K x 16 RAM and
Optional RAM Parity
Optional 12K x 16 or 8K x 17 RAM
Available
Generation/Checking
Automatic BC Retries
Programmable BC Gap Times
BC Frame Auto-Repeat
Flexible RT Data Buffering
Programmable Illegalization
Selective Message Monitor
Simultaneous RT/Monitor Mode
TX/RX_A
SHARED
RAM
CH. A
TRANSCEIVER
A
DATA
BUFFERS
PROCESSOR
DATA BUS
*
TX/RX_A
DATA BUS
DUAL
ENCODER/DECODER,
MULTIPROTOCOL
AND
MEMORY
MANAGEMENT
D15-D0
TX/RX_B
ADDRESS BUS
ADDRESS
BUFFERS
A15-A0
PROCESSOR
ADDRESS BUS
CH. B
TRANSCEIVER
B
TX/RX_B
PROCESSOR
AND
MEMORY
INTERFACE
LOGIC
TRANSPARENT/BUFFERED, STRBD, SELECT,
RD/WR, MEM/REG, TRIGGER_SEL/MEMENA-IN,
MSB/LSB/DTGRT
IOEN, MEMENA-OUT, READYD
ADDR_LAT/MEMOE, ZERO_WAIT/MEMWR,
8/16-BIT/DTREQ, POLARITY_SEL/DTACK
INT
PROCESSOR
AND
MEMORY
CONTROL
INTERRUPT
REQUEST
RT ADDRESS
RTAD4-RTAD0, RTADP
INCMD
MISCELLANEOUS
CLK_IN, TAG_CLK,
MSTCLR,SSFLAG/EXT_TRG
* SEE ORDERING INFORMATION FOR AVAILABLE MEMORY
FIGURE 1. ACE BLOCK DIAGRAM
©
1992, 1999 Data Device Corporation
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