Fast Page DRAM Module, 4MX72, 70ns, CMOS, DIMM-168
| 参数名称 | 属性值 |
| 厂商名称 | IBM |
| 零件包装代码 | DIMM |
| 包装说明 | , |
| 针数 | 168 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 访问模式 | FAST PAGE |
| 最长访问时间 | 70 ns |
| 其他特性 | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
| 备用内存宽度 | 36 |
| JESD-30 代码 | R-XDMA-N168 |
| 内存密度 | 301989888 bit |
| 内存集成电路类型 | FAST PAGE DRAM MODULE |
| 内存宽度 | 72 |
| 功能数量 | 1 |
| 端口数量 | 1 |
| 端子数量 | 168 |
| 字数 | 4194304 words |
| 字数代码 | 4000000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 4MX72 |
| 输出特性 | 3-STATE |
| 封装主体材料 | UNSPECIFIED |
| 封装形状 | RECTANGULAR |
| 封装形式 | MICROELECTRONIC ASSEMBLY |
| 认证状态 | Not Qualified |
| 刷新周期 | 4096 |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | NO LEAD |
| 端子位置 | DUAL |
| IBM11M4730CBD-70J | IBM11M4730CD-60J | IBM11M4730CD-70J | IBM11M4730CE-60T | IBM11M4730CE-70T | 16SEV10M4X5.5 | |
|---|---|---|---|---|---|---|
| 描述 | Fast Page DRAM Module, 4MX72, 70ns, CMOS, DIMM-168 | Fast Page DRAM Module, 4MX72, 60ns, CMOS, DIMM-168 | Fast Page DRAM Module, 4MX72, 70ns, CMOS, DIMM-168 | Fast Page DRAM Module, 4MX72, 60ns, CMOS, DIMM-168 | Fast Page DRAM Module, 4MX72, 70ns, CMOS, DIMM-168 | CHIP ALUMINUM ELECTROLYTIC CAPACITORS |
| 零件包装代码 | DIMM | DIMM | DIMM | DIMM | DIMM | - |
| 针数 | 168 | 168 | 168 | 168 | 168 | - |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | - |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - |
| 访问模式 | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | - |
| 最长访问时间 | 70 ns | 60 ns | 70 ns | 60 ns | 70 ns | - |
| 其他特性 | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | - |
| 备用内存宽度 | 36 | 36 | 36 | 36 | 36 | - |
| JESD-30 代码 | R-XDMA-N168 | R-XDMA-N168 | R-XDMA-N168 | R-XDMA-N168 | R-XDMA-N168 | - |
| 内存密度 | 301989888 bit | 301989888 bit | 301989888 bit | 301989888 bit | 301989888 bit | - |
| 内存集成电路类型 | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | - |
| 内存宽度 | 72 | 72 | 72 | 72 | 72 | - |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | - |
| 端口数量 | 1 | 1 | 1 | 1 | 1 | - |
| 端子数量 | 168 | 168 | 168 | 168 | 168 | - |
| 字数 | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words | - |
| 字数代码 | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 | - |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | - |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | - |
| 组织 | 4MX72 | 4MX72 | 4MX72 | 4MX72 | 4MX72 | - |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | - |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 刷新周期 | 4096 | 4096 | 4096 | 4096 | 4096 | - |
| 最大供电电压 (Vsup) | 3.6 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - |
| 最小供电电压 (Vsup) | 3 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | - |
| 标称供电电压 (Vsup) | 3.3 V | 5 V | 5 V | 5 V | 5 V | - |
| 表面贴装 | NO | NO | NO | NO | NO | - |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | - |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | - |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | - |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | - |
| Base Number Matches | - | 1 | 1 | 1 | 1 | - |
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