D Flip-Flop, FCT Series, 1-Func, Positive Edge Triggered, 8-Bit, True Output, CMOS, CQCC20, LCC-20
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Cypress(赛普拉斯) |
零件包装代码 | QLCC |
包装说明 | QCCN, LCC20,.35SQ |
针数 | 20 |
Reach Compliance Code | compliant |
系列 | FCT |
JESD-30 代码 | S-CQCC-N20 |
JESD-609代码 | e0 |
长度 | 8.89 mm |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | D FLIP-FLOP |
最大频率@ Nom-Sup | 83300000 Hz |
最大I(ol) | 0.032 A |
位数 | 8 |
功能数量 | 1 |
端子数量 | 20 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出极性 | TRUE |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装代码 | QCCN |
封装等效代码 | LCC20,.35SQ |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 5 V |
Prop。Delay @ Nom-Sup | 6.5 ns |
传播延迟(tpd) | 6.5 ns |
认证状态 | Not Qualified |
座面最大高度 | 1.905 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | NO LEAD |
端子节距 | 1.27 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
触发器类型 | POSITIVE EDGE |
宽度 | 8.89 mm |
CY54FCT273CTLM | CY54FCT273TLM | CY54FCT273ATDM | CY54FCT273CTDM | CY54FCT273ATLM | CY54FCT273TDM | |
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描述 | D Flip-Flop, FCT Series, 1-Func, Positive Edge Triggered, 8-Bit, True Output, CMOS, CQCC20, LCC-20 | D Flip-Flop, FCT Series, 1-Func, Positive Edge Triggered, 8-Bit, True Output, CMOS, CQCC20, LCC-20 | D Flip-Flop, FCT Series, 1-Func, Positive Edge Triggered, 8-Bit, True Output, CMOS, CDIP20, 0.300 INCH, CERDIP-20 | D Flip-Flop, FCT Series, 1-Func, Positive Edge Triggered, 8-Bit, True Output, CMOS, CDIP20, 0.300 INCH, CERDIP-20 | D Flip-Flop, FCT Series, 1-Func, Positive Edge Triggered, 8-Bit, True Output, CMOS, CQCC20, LCC-20 | D Flip-Flop, FCT Series, 1-Func, Positive Edge Triggered, 8-Bit, True Output, CMOS, CDIP20, 0.300 INCH, CERDIP-20 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) |
零件包装代码 | QLCC | QLCC | DIP | DIP | QLCC | DIP |
包装说明 | QCCN, LCC20,.35SQ | LCC-20 | DIP, DIP20,.3 | DIP, DIP20,.3 | QCCN, LCC20,.35SQ | DIP, DIP20,.3 |
针数 | 20 | 20 | 20 | 20 | 20 | 20 |
Reach Compliance Code | compliant | compliant | compliant | compliant | not_compliant | not_compliant |
系列 | FCT | FCT | FCT | FCT | FCT | FCT |
JESD-30 代码 | S-CQCC-N20 | S-CQCC-N20 | R-GDIP-T20 | R-GDIP-T20 | S-CQCC-N20 | R-GDIP-T20 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
长度 | 8.89 mm | 8.89 mm | 24.13 mm | 24.13 mm | 8.89 mm | 24.13 mm |
负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
逻辑集成电路类型 | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
最大频率@ Nom-Sup | 83300000 Hz | 71400000 Hz | 83300000 Hz | 83300000 Hz | 83300000 Hz | 71400000 Hz |
最大I(ol) | 0.032 A | 0.032 A | 0.032 A | 0.032 A | 0.032 A | 0.032 A |
位数 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 20 | 20 | 20 | 20 | 20 | 20 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED |
封装代码 | QCCN | QCCN | DIP | DIP | QCCN | DIP |
封装等效代码 | LCC20,.35SQ | LCC20,.35SQ | DIP20,.3 | DIP20,.3 | LCC20,.35SQ | DIP20,.3 |
封装形状 | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
封装形式 | CHIP CARRIER | CHIP CARRIER | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
Prop。Delay @ Nom-Sup | 6.5 ns | 15 ns | 8.3 ns | 6.5 ns | 8.3 ns | 15 ns |
传播延迟(tpd) | 6.5 ns | 15 ns | 8.3 ns | 6.5 ns | 8.3 ns | 15 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.905 mm | 1.905 mm | 5.08 mm | 5.08 mm | 1.905 mm | 5.08 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | NO | NO | YES | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | NO LEAD | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | THROUGH-HOLE |
端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm |
端子位置 | QUAD | QUAD | DUAL | DUAL | QUAD | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
宽度 | 8.89 mm | 8.89 mm | 7.62 mm | 7.62 mm | 8.89 mm | 7.62 mm |
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