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MK2308S-1HT

产品描述PLL Based Clock Driver, 2308 Series, 8 True Output(s), 0 Inverted Output(s), CMOS, PDSO16, 0.150 INCH, SOIC-16
产品类别逻辑    逻辑   
文件大小175KB,共7页
制造商IDT (Integrated Device Technology)
下载文档 详细参数 选型对比 全文预览

MK2308S-1HT概述

PLL Based Clock Driver, 2308 Series, 8 True Output(s), 0 Inverted Output(s), CMOS, PDSO16, 0.150 INCH, SOIC-16

MK2308S-1HT规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称IDT (Integrated Device Technology)
零件包装代码SOIC
包装说明SOP,
针数16
Reach Compliance Codenot_compliant
系列2308
输入调节STANDARD
JESD-30 代码R-PDSO-G16
JESD-609代码e0
长度9.9 mm
逻辑集成电路类型PLL BASED CLOCK DRIVER
湿度敏感等级1
功能数量1
反相输出次数
端子数量16
实输出次数8
最高工作温度70 °C
最低工作温度
输出特性3-STATE
封装主体材料PLASTIC/EPOXY
封装代码SOP
封装形状RECTANGULAR
封装形式SMALL OUTLINE
峰值回流温度(摄氏度)225
认证状态Not Qualified
Same Edge Skew-Max(tskwd)0.2 ns
座面最大高度1.75 mm
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)3 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Lead (Sn85Pb15)
端子形式GULL WING
端子节距1.27 mm
端子位置DUAL
处于峰值回流温度下的最长时间30
宽度3.9 mm
最小 fmax133 MHz

文档预览

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MK2308-1H
3.3 V
OLT
Z
ERO
D
ELAY
, L
OW
S
KEW
B
UFFER
Description
The MK2308-1H is a low phase noise, high-speed PLL
based, 8-output, low skew zero delay buffer. Based on
ICS’ proprietary low jitter Phase Locked Loop (PLL)
techniques, the device provides eight low skew outputs
at speeds up to 133 MHz at 3.3 V. The outputs can be
generated from the PLL (for zero delay), or directly
from the input (for testing), and can be set to tri-state
mode or to stop at a low level. For normal operation as
a zero delay buffer, any output clock is tied to the FBIN
pin.
ICS manufactures a large variety of clock generators
and buffers.
Features
Clock outputs from 10 to 133 MHz
Zero input-output delay
Eight low skew (<200 ps) outputs
Device-to-device skew <700 ps
Full CMOS outputs with 25 mA output drive
capability at TTL levels
5 V tolerant FBIN and CLKIN pins
Tri-state mode for board-level testing
Advanced, low-power, sub-micron CMOS process
Operating voltage of 3.3 V
Industrial temperature range available
Packaged in 16-pin SOIC and TSSOP packages
Available in Pb (lead) free package
Industrial and commercial temp operation
Block Diagram
VDD
2
2
Control
Logic
S2, S1
CLKA1
CLKA2
CLKIN
CLKA3
CLKA4
FBIN
Clock
Synthesis
PLL
1
0
CLKB1
CLKB2
CLKB3
CLKB4
GND
2
Feedback is shown from CLKB4 for
illustration, but may come from any output.
MDS 2308-1H D
I n t e gra te d C i r c u i t S y s t e m s
1
525 Race Stre et, San Jo se, CA 9 5126
Revision 081505
te l (40 8) 2 97-12 01
w w w. i c st . c o m

MK2308S-1HT相似产品对比

MK2308S-1HT MK2308S-1HILFT MK2308S-1HIT MK2308G-1HIT MK2308G-1HT
描述 PLL Based Clock Driver, 2308 Series, 8 True Output(s), 0 Inverted Output(s), CMOS, PDSO16, 0.150 INCH, SOIC-16 PLL Based Clock Driver, 2308 Series, 8 True Output(s), 0 Inverted Output(s), CMOS, PDSO16, 0.150 INCH, SOIC-16 PLL Based Clock Driver, 2308 Series, 8 True Output(s), 0 Inverted Output(s), CMOS, PDSO16, 0.150 INCH, SOIC-16 PLL Based Clock Driver, 2308 Series, 8 True Output(s), 0 Inverted Output(s), CMOS, PDSO16, 4.40 MM, 0.65 MM PITCH, TSSOP-16 PLL Based Clock Driver, 2308 Series, 8 True Output(s), 0 Inverted Output(s), CMOS, PDSO16, 4.40 MM, 0.65 MM PITCH, TSSOP-16
是否无铅 含铅 不含铅 含铅 含铅 含铅
是否Rohs认证 不符合 符合 不符合 不符合 不符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
零件包装代码 SOIC SOIC SOIC TSSOP TSSOP
包装说明 SOP, 0.150 INCH, SOIC-16 SOP, TSSOP, TSSOP,
针数 16 16 16 16 16
Reach Compliance Code not_compliant compliant not_compliant not_compliant not_compliant
系列 2308 2308 2308 2308 2308
输入调节 STANDARD STANDARD STANDARD STANDARD STANDARD
JESD-30 代码 R-PDSO-G16 R-PDSO-G16 R-PDSO-G16 R-PDSO-G16 R-PDSO-G16
JESD-609代码 e0 e3 e0 e0 e0
长度 9.9 mm 9.9 mm 9.9 mm 5 mm 5 mm
逻辑集成电路类型 PLL BASED CLOCK DRIVER PLL BASED CLOCK DRIVER PLL BASED CLOCK DRIVER PLL BASED CLOCK DRIVER PLL BASED CLOCK DRIVER
功能数量 1 1 1 1 1
端子数量 16 16 16 16 16
实输出次数 8 8 8 8 8
最高工作温度 70 °C 85 °C 85 °C 85 °C 70 °C
最低工作温度 - -40 °C -40 °C -40 °C -
输出特性 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 SOP SOP SOP TSSOP TSSOP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度) 225 260 225 NOT SPECIFIED NOT SPECIFIED
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Same Edge Skew-Max(tskwd) 0.2 ns 0.2 ns 0.2 ns 0.2 ns 0.2 ns
座面最大高度 1.75 mm 1.75 mm 1.75 mm 1.2 mm 1.2 mm
最大供电电压 (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
最小供电电压 (Vsup) 3 V 3 V 3 V 3 V 3 V
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL COMMERCIAL
端子面层 Tin/Lead (Sn85Pb15) MATTE TIN Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15)
端子形式 GULL WING GULL WING GULL WING GULL WING GULL WING
端子节距 1.27 mm 1.27 mm 1.27 mm 0.65 mm 0.65 mm
端子位置 DUAL DUAL DUAL DUAL DUAL
处于峰值回流温度下的最长时间 30 30 30 NOT SPECIFIED NOT SPECIFIED
宽度 3.9 mm 3.9 mm 3.9 mm 4.4 mm 4.4 mm
最小 fmax 133 MHz 133 MHz 133 MHz 133 MHz 133 MHz
湿度敏感等级 1 - 1 1 1
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