电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

5962-8869001JA

产品描述512X8 OTPROM, 220ns, CDIP24, SIDE BRAZED, DIP-24
产品类别存储    存储   
文件大小38KB,共8页
制造商Renesas(瑞萨电子)
官网地址https://www.renesas.com/
下载文档 详细参数 选型对比 全文预览

5962-8869001JA概述

512X8 OTPROM, 220ns, CDIP24, SIDE BRAZED, DIP-24

5962-8869001JA规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称Renesas(瑞萨电子)
零件包装代码DIP
包装说明DIP, DIP24,.6
针数24
Reach Compliance Codenot_compliant
ECCN代码EAR99
最长访问时间220 ns
JESD-30 代码R-CDIP-T24
JESD-609代码e0
内存密度4096 bit
内存集成电路类型OTP ROM
内存宽度8
功能数量1
端子数量24
字数512 words
字数代码512
工作模式ASYNCHRONOUS
最高工作温度125 °C
最低工作温度-55 °C
组织512X8
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装代码DIP
封装等效代码DIP24,.6
封装形状RECTANGULAR
封装形式IN-LINE
并行/串行PARALLEL
峰值回流温度(摄氏度)NOT SPECIFIED
电源5 V
认证状态Not Qualified
筛选级别38535Q/M;38534H;883B
座面最大高度5.72 mm
最大待机电流0.0001 A
最大压摆率0.02 mA
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装NO
技术CMOS
温度等级MILITARY
端子面层Tin/Lead (Sn/Pb) - hot dipped
端子形式THROUGH-HOLE
端子节距2.54 mm
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度15.24 mm

文档预览

下载PDF文档
HM-6642
March 1997
512 x 8 CMOS PROM
Description
The HM-6642 is a 512 x 8 CMOS NiCr fusible link
Programmable Read Only Memory in the popular 24 pin,
byte wide pinout. Synchronous circuit design techniques
combine with CMOS processing to give this device high
speed performance with very low power dissipation.
On-chip address latches are provided, allowing easy
interfacing with recent generation microprocessors that use
multiplexed address/data bus structures, such as the 8085.
The output enable controls, both active low and active high,
further simplify microprocessor system interfacing by
allowing output data bus control independent of the chip
enable control. The data output latches allow the use of the
HM-6642 in high speed pipelined architecture systems, and
also in synchronous logic replacement functions.
Applications for the HM-6642 CMOS PROM include low
power handheld microprocessor based instrumentation and
communications systems, remote data acquisition and
processing systems, processor control store, and synchro-
nous logic replacement.
All bits are manufactured storing a logical “0” and can be
selectively programmed for a logical “1” at any bit location.
Features
• Low Power Standby and Operating Power
- ICCSB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .100µA
- ICCOP . . . . . . . . . . . . . . . . . . . . . . . . . . 20mA at 1MHz
• Fast Access Time. . . . . . . . . . . . . . . . . . . . . . 120/200ns
• Industry Standard Pinout
• Single 5.0V Supply
• CMOS/TTL Compatible Inputs
• Field Programmable
• Synchronous Operation
• On-Chip Address Latches
• Separate Output Enable
Ordering Information
PACKAGE
SBDIP
SMD#
SLIM SBDIP
SMD#
CLCC
SMD#
TEMPERATURE RANGE
-40
o
C to +85
o
C
-55
o
C to +125
o
C
-40
o
C to +85
o
C
-55
o
C to +125
o
C
-40
o
C to +85
o
C
-55
o
C to +125
o
C
120ns
HM1-6642B-9
5962-8869002JA
HM6-6642B-9
5962-8869002LA
-
5962-88690023A
200ns
HM1-6642-9
5962-8869001JA
HM6-6642-9
5962-8869001LA
HM4-6642-9
5962-88690013A
PKG. NO.
D24.6
D24.6
D24.3
D24.3
J28.A
J28.A
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
http://www.intersil.com or 407-727-9207
|
Copyright
©
Intersil Corporation 1999
File Number
3012.1
6-1

5962-8869001JA相似产品对比

5962-8869001JA 5962-8869001LA 5962-88690013A
描述 512X8 OTPROM, 220ns, CDIP24, SIDE BRAZED, DIP-24 512X8 OTPROM, 220ns, CDIP24, SIDE BRAZED, DIP-24 512X8 OTPROM, 220ns, CQCC28
包装说明 DIP, DIP24,.6 DIP, ,
Reach Compliance Code not_compliant unknown unknown
ECCN代码 EAR99 EAR99 EAR99
最长访问时间 220 ns 220 ns 220 ns
JESD-30 代码 R-CDIP-T24 R-CDIP-T24 S-CQCC-N28
JESD-609代码 e0 e0 e0
内存密度 4096 bit 4096 bit 4096 bit
内存集成电路类型 OTP ROM OTP ROM OTP ROM
内存宽度 8 8 8
功能数量 1 1 1
端子数量 24 24 28
字数 512 words 512 words 512 words
字数代码 512 512 512
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 125 °C 125 °C 125 °C
最低工作温度 -55 °C -55 °C -55 °C
组织 512X8 512X8 512X8
封装主体材料 CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
封装形状 RECTANGULAR RECTANGULAR SQUARE
封装形式 IN-LINE IN-LINE CHIP CARRIER
并行/串行 PARALLEL PARALLEL PARALLEL
认证状态 Not Qualified Not Qualified Not Qualified
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V
表面贴装 NO NO YES
技术 CMOS CMOS CMOS
温度等级 MILITARY MILITARY MILITARY
端子面层 Tin/Lead (Sn/Pb) - hot dipped TIN LEAD TIN LEAD
端子形式 THROUGH-HOLE THROUGH-HOLE NO LEAD
端子位置 DUAL DUAL QUAD
厂商名称 Renesas(瑞萨电子) - Renesas(瑞萨电子)
零件包装代码 DIP DIP -
针数 24 24 -
封装代码 DIP DIP -
座面最大高度 5.72 mm 5.08 mm -
端子节距 2.54 mm 2.54 mm -
宽度 15.24 mm 7.62 mm -

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1585  2558  1292  2683  1288  53  29  44  45  38 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved