Power Supply Support Circuit, Fixed, 1 Channel, CMOS, PDIP16, PLASTIC, DIP-16
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, |
| 针数 | 16 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 可调阈值 | NO |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | R-PDIP-T16 |
| JESD-609代码 | e0 |
| 长度 | 19.431 mm |
| 信道数量 | 1 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 认证状态 | Not Qualified |
| 座面最大高度 | 3.683 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | TIN LEAD |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| ICS1712N | ICS1712M | ICS1712MT | ICS1712MLF | ICS1712NLF | |
|---|---|---|---|---|---|
| 描述 | Power Supply Support Circuit, Fixed, 1 Channel, CMOS, PDIP16, PLASTIC, DIP-16 | Power Supply Support Circuit, Fixed, 1 Channel, CMOS, PDSO16, SOIC-16 | Power Supply Support Circuit, Fixed, 1 Channel, CMOS, PDSO16, SOIC-16 | Power Supply Support Circuit, Fixed, 1 Channel, CMOS, PDSO16, SOIC-16 | Power Supply Support Circuit, Fixed, 1 Channel, CMOS, PDIP16, PLASTIC, DIP-16 |
| 零件包装代码 | DIP | SOIC | SOIC | SOIC | DIP |
| 包装说明 | DIP, | SOP, | SOP, | SOP, | DIP, |
| 针数 | 16 | 16 | 16 | 16 | 16 |
| Reach Compliance Code | compliant | compliant | unknown | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 可调阈值 | NO | NO | NO | NO | NO |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | R-PDIP-T16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDIP-T16 |
| 长度 | 19.431 mm | 9.9 mm | 9.9 mm | 9.9 mm | 19.431 mm |
| 信道数量 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | SOP | SOP | SOP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 7.62 mm | 3.9 mm | 3.9 mm | 3.9 mm | 7.62 mm |
| 是否无铅 | 含铅 | 含铅 | - | 不含铅 | 不含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | - | 符合 | 符合 |
| JESD-609代码 | e0 | e0 | - | e3 | e3 |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | 225 | - | 260 | 260 |
| 座面最大高度 | 3.683 mm | - | 2.8194 mm | - | 3.683 mm |
| 端子面层 | TIN LEAD | Tin/Lead (Sn/Pb) | - | Matte Tin (Sn) | Matte Tin (Sn) |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | 30 | - | 30 | 30 |
| Base Number Matches | - | 1 | 1 | 1 | - |
工控电子
测试/测量
DIY/开源硬件专区
stm32/stm8
嵌入式系统
嵌入式系统
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