INTERCONNECTS
OFP® Pass Thru Sockets for Ø.030” &
Single and Double Row
•
834/835 Series Pass Thru Sockets have a low
.130” profile and will accept Ø.030” round pin,
as well as industry standard .025” square pin
headers.
•
They are typically used to interconnect two or
more parallel circuit boards.
•
Sockets are designed for hand, wave or reflow*
soldering. The high temp. insulator is compati-
ble with all solder processes.
•
Unique
ORGANIC FIBRE PLUG®
barriers pre-
vent solder, paste or flux from contaminating
the internal spring contacts. After soldering, the
OFP®
barriers are pushed out of the socket
when the mating header is inserted.
•
Mill-Max sockets use a precision machined
brass sleeve with a press-fit beryllium copper
“multi-finger” spring contact.
•
Recommended mounting holes are Ø.046
±.003” PTH (1,2 mm drilled prior to plating).
*Intrusive reflow (also called "pin-in-paste") is a tech-
nique of using conventional thru-hole components
in a reflow soldering process. The pass thru socket
is placed into plated-thru-holes in the circuit board
(solder paste has previously been screen printed on
pads adjacent to the holes) and the board is
reflowed in the same pass as other SMT compo-
nents. Solder will fill the plated-thru-holes and
achieve solder joints as reliable as wave soldering.
The OFP® barrier prevents solder paste from being
picked-up inside the contact during assembly.
Series 834, 835
.025” pins
Typical Application
U
US Patent #7,086,870
Ordering Information
Single Row
OFP® Pass Thru Socket
834-XX-0 _ _-10-001000
01-64
Fig. 1
®
Specify # of pins
Fig. 1
Double Row OFP® Pass Thru Socket
835-XX-0 _ _-10-001000
Fig. 2
Specify # of pins
For RoHS compliance
select plating code.
SPECIFY PLATING CODE XX=
®
02-72
XX= Plating Code
See Below
13
30µ” Au
93
30µ” Au
99
43
44
Sleeve (Pin)
10µ” Au 200µ” Sn/Pb 200µ”Sn/Pb 200µ”Sn 200µ”Sn
200µ”Sn/Pb 30µ” Au 200µ”Sn
Fig. 2
Contact (Clip)
w w w. m i l l - m a x . c o m
85
516-922-6000
Microchip MCU
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