Datasheet> 器件分类 > 连接器> 连接器> 834-44-050-10-001000

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834-44-050-10-001000: 产品描述Board Connector, 50 Contact(s), 1 Row(s), Female, Straight, Solder Terminal, Socket, ROHS COMPLIANT; 产品类别连接器连接器; 文件大小167KB，共1页; 制造商Mill-Max; 官网地址https://www.mill-max.com; 标准

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834-44-050-10-001000概述

Board Connector, 50 Contact(s), 1 Row(s), Female, Straight, Solder Terminal, Socket, ROHS COMPLIANT

834-44-050-10-001000规格参数

参数名称	属性值
是否无铅	不含铅
是否Rohs认证	符合
厂商名称	Mill-Max
包装说明	ROHS COMPLIANT
Reach Compliance Code	compliant
主体/外壳类型	SOCKET
连接器类型	BOARD CONNECTOR
联系完成配合	TIN (200)
联系完成终止	TIN (200)
触点性别	FEMALE
触点材料	NOT SPECIFIED
DIN 符合性	NO
滤波功能	NO
IEC 符合性	NO
JESD-609代码	e3
MIL 符合性	NO
制造商序列号	834
混合触点	NO
安装方式	STRAIGHT
安装类型	BOARD
装载的行数	1
选件	GENERAL PURPOSE
端子节距	2.54 mm
端接类型	SOLDER
触点总数	50

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INTERCONNECTS

OFP® Pass Thru Sockets for Ø.030” &

Single and Double Row

•

834/835 Series Pass Thru Sockets have a low

.130” profile and will accept Ø.030” round pin,

as well as industry standard .025” square pin

headers.

•

They are typically used to interconnect two or

more parallel circuit boards.

•

Sockets are designed for hand, wave or reflow*

soldering. The high temp. insulator is compati-

ble with all solder processes.

•

Unique

ORGANIC FIBRE PLUG®

barriers pre-

vent solder, paste or flux from contaminating

the internal spring contacts. After soldering, the

OFP®

barriers are pushed out of the socket

when the mating header is inserted.

•

Mill-Max sockets use a precision machined

brass sleeve with a press-fit beryllium copper

“multi-finger” spring contact.

•

Recommended mounting holes are Ø.046

±.003” PTH (1,2 mm drilled prior to plating).

*Intrusive reflow (also called "pin-in-paste") is a tech-

nique of using conventional thru-hole components

in a reflow soldering process. The pass thru socket

is placed into plated-thru-holes in the circuit board

(solder paste has previously been screen printed on

pads adjacent to the holes) and the board is

reflowed in the same pass as other SMT compo-

nents. Solder will fill the plated-thru-holes and

achieve solder joints as reliable as wave soldering.

The OFP® barrier prevents solder paste from being

picked-up inside the contact during assembly.

Series 834, 835

.025” pins

Typical Application

US Patent #7,086,870

Ordering Information

Single Row

OFP® Pass Thru Socket

834-XX-0 _ _-10-001000

01-64

Fig. 1

Specify # of pins

Fig. 1

Double Row OFP® Pass Thru Socket

835-XX-0 _ _-10-001000

Fig. 2

Specify # of pins

For RoHS compliance

select plating code.

SPECIFY PLATING CODE XX=

02-72

XX= Plating Code

See Below

30µ” Au

Sleeve (Pin)

10µ” Au 200µ” Sn/Pb 200µ”Sn/Pb 200µ”Sn 200µ”Sn

200µ”Sn/Pb 30µ” Au 200µ”Sn

Fig. 2

Contact (Clip)

w w w. m i l l - m a x . c o m

516-922-6000

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