MICROWAVE CORPORATION
HMC258CB1
General Description
The HMC258CB1 is a 14 – 20 GHz surface
mount sub-harmonically pumped (x2) MMIC
mixer with an integrated LO amplifier in a rugged
Ball Grid Array (BGA) package. The 2LO to RF
isolation is an excellent 38 dB, eliminating the
need for additional filtering. The LO amplifier is
a single bias (+5V) two stage design with only
0dBm drive requirement. This MESFET based
single-ended mixer chip was designed to be
used in microwave point-to-point radios, VSAT
and other SATCOM applications. All data is
with the non-hermetic, epoxy sealed BGA pack-
aged device mounted in a 50 ohm test fixture.
Utilizing the HMC258CB1 eliminates the need
for wirebonding, thereby providing a consistent
connection interface for the customer.
HMC258CB1 SUB-HARMONIC SMT MIXER 14 - 20 GHz
F
EBRUARY
2001
Features
RUGGED SMT BGA PACKAGE
INTEGRATED LO AMPLIFIER: 0 dBm INPUT
SUB-HARMONICALLY PUMPED (x2) LO
HIGH 2LO/RF ISOLATION: 38 dB
4
M
IXERS
SMT
Guaranteed Performance,
LO Drive = 0 dBm, Vdd = +5V, - 55 to + 85 deg C
Parameter
Min.
Frequency Range, RF
Frequency Range, LO
Frequency Range, IF
Conversion Loss
Noise Figure (SSB)
2LO to RF Isolation
2LO to IF Isolation
IP3 (Input)
1 dB Compression (Input)
Local Oscillator Drive Level
Supply Voltage (Vdd)
Supply Current (Idd) ( Vdd = +5.0 Vdc)
33
35
0
-5
-4
4.5
IF = 1 GHz
Vdd = +5.0V
IF = 1 GHz
Vdd = +5.0V
Units
Max.
GHz
GHz
GHz
11.5
11.5
dB
dB
dB
dB
dBm
dBm
+6
5.5
65
dBm
Vdc
mA
Typ.
14 - 20
7 - 10.5
DC - 3
10
10
38
40 ~ 50
7
0
0
5.0
50
Max.
Min.
Typ.
17 - 20
8.5 - 10
DC - 3
13.5
13.5
33
42
0
-5
+6
5.5
65
-4
4.5
9
9
38
48
7
0
0
5.0
50
12 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Web Site: www.hittite.com
4 - 106
HMC258CB1
MICROWAVE CORPORATION
HMC258CB1 SUB-HARMONIC SMT MIXER 14 - 20 GHz
F
EBRUARY
2001
Conversion Gain vs.
Temperature @ LO = 0 dBm
0
-55 C
CONVERSION GAIN (dB)
-5
Isolation @ LO = 0 dBm
10
LO/IF
0
LO/RF
ISOLATION (dB)
-10
-20
-30
-40
-50
2LO/IF
2LO/RF
RF/IF
-10
-15
+85 C
-20
+25 C
-25
14
16
18
RF FREQUENCY (GHz)
20
22
-60
14
16
18
RF FREQUENCY (GHz)
20
22
4
M
IXERS
Conversion Gain vs. LO Drive
0
0 dBm
Return Loss @ LO = 0 dBm
0
-5
RETURN LOSS (dB)
-10
-15
-20
-25
RF
-30
IF
LO
CONVERSION GAIN (dB)
-5
-10
-15
+2 dBm
-20
-4 dBm
-25
14
16
18
RF FREQUENCY (GHz)
20
22
+4 dBm
-2 dBm
-35
-40
0
5
10
15
20
FREQUENCY (GHz)
IF Bandwidth @ LO = 0 dBm
0
IF CONVERSION GAIN (dB)
Upconverter Performance
Conversion Gain vs LO Drive
0
-5
-10
-15
0 dBm
-20
-25
-30
-5
-10
-15
-20
-25
0
1
2
3
4
5
6
IF FREQUENCY (GHz)
CONVERSION GAIN (dB)
14
16
18
RF FREQUENCY (GHz)
20
22
12 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Web Site: www.hittite.com
4 - 107
SMT
HMC258CB1
MICROWAVE CORPORATION
HMC258CB1 SUB-HARMONIC SMT MIXER 14 - 20 GHz
F
EBRUARY
2001
Input IP3 vs. LO Drive
20
THIRD ORDER INTERCEPT (dBm)
+2 dBm
15
10
5
0
0 dBm
-5
-10
13
15
17
19
21
23
RF FREQUENCY (GHz)
-2 dBm
Input IP2 vs. LO Drive
SECOND ORDER INTERCEPT (dBm)
60
50
40
30
20
10
0
13
14
15
16
17
18
19
20
21
22
23
RF FREQUENCY (GHz)
-2 dBm
+2 dBm
0 dBm
4
M
IXERS
P1dB
6
5
4
3
P1dB (dBm)
MXN Spurious Outputs
@LO Drive = 0 dBm
nLO
±3 ±2
mRF
±5
-105.5
±4
±1
0
SMT
2
1
0
-1
-2
-3
-4
13
14
15
16
17
18
19
20
21
22
23
RF FREQUENCY (GHz)
-3
-2
-1
0
1
2
3
-87.5
X
-97
-44.7 -11.7
-105
-33.8
-71.5
RF = 18 GHz @ -10 dBm
LO = 8.5 GHz @ 0 dBm
All values in dBc below IF power level
12 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Web Site: www.hittite.com
4 - 108
HMC258CB1
MICROWAVE CORPORATION
HMC258CB1 SUB-HARMONIC SMT MIXER 14 - 20 GHz
F
EBRUARY
2001
Schematic
RF
(14 - 20 GHz)
IF
(DC - 3 GHz)
Absolute Maximum Ratings
RF / IF Input (Vdd = +5V)
LO Drive (Vdd = +5V)
Vdd
Storage Temperature
+13 dBm
+13 dBm
+8 Vdc
-65 to +150 deg C
-55 to +85 deg C
Vdd
(+5V)
Operating Temperature
LO In
(7 - 10 GHz
@0 dBm TYP.)
4
M
IXERS
Web Site: www.hittite.com
Outline Drawing
( See, Mounting, Note Page 4 - 110)
1. MATERIAL: PACKAGE BODY: WHITE ALUMINA (99.0%)
BALL CONTACTS
LID
: SILVER-COPPER BALL, EUTECTICALLY ATTACHED
: PLASTIC, B-STAGE EPOXY ATTACHED
2. PLATING : ELECTROLYTIC GOLD 50-225 MICROINCHES OVER
ELECTROLYTIC NICKEL 75 TO 225 MICROINCHES.
3. DIMENSIONS ARE IN INCHES (MILLIMETERS).UNLESS OTHERWISE SPECIFIED
ALL TOLERANCES ARE ± 0.005 (± 0.13).
4. ALL UNLABELED BALL CONTACTS ARE GROUND.
5. ALL GROUNDS MUST BE SOLDERED TO THE PCB RF GROUND
12 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
4 - 109
SMT
HMC258CB1
MICROWAVE CORPORATION
HMC258CB1 SUB-HARMONIC SMT MIXER 14 - 20 GHz
F
EBRUARY
2001
Mounting
The BGA package is back-metallized and can be mounted with either eutectic solder or electrically con-
ductive epoxy. The mounting surface should be clean and flat. Placement of the BGA package can be
done manually or with available automatic placement machines.
Eutectic Attach:
Eutectic solder paste may be applied manually or automatically by screen print/dispense methods to the
PCB. Geometry and process should be such as to supply sufficient solder volume to obtain adequate
solder fillets around the balls of the package after reflow without shorting RF/DC ball signal contacts. The
solder should be reflowed in an infrared reflow oven with the appropriate temperature profile for that solder.
The finished fillet should resemble a cylindrical column with a flared pedestal at the substrate surface when
viewed from the side.
Do not expose the BGA package to temperature greater than 220
o
C for more than 20 seconds.
Epoxy Attach:
Electrically conductive epoxy may be applied in the same manner as mentioned above. Again geometry
and process parameters should be such as to supply sufficient epoxy around each of the balls of the
package without shorting RF/DC ball signal contact . Cure the epoxy per the recommended manufacture's
schedule.
Handling Precautions:
Follow these precautions to avoid permanent damage.
Cleanliness: Handle the devices in a clean environment.
Static Sensitivity: Follow ESD precautions to protect against ESD strikes (
see page 8 - 2
).
Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and
bias cables to minimize inductive pick-up.
General Handling: Handle the BGA package along the edges with a vacuum collet or with a sharp pair of
bent tweezers. Avoiding damaging the solder balls on the package bottom.
4
M
IXERS
SMT
12 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Web Site: www.hittite.com
4 - 110
模拟与混合信号
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