Flash, 32KX8, 70ns, PQCC32, PLASTIC, LCC-32
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | Atmel (Microchip) |
零件包装代码 | QFJ |
包装说明 | PLASTIC, LCC-32 |
针数 | 32 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
最长访问时间 | 70 ns |
JESD-30 代码 | R-PQCC-J32 |
JESD-609代码 | e0 |
长度 | 13.97 mm |
内存密度 | 262144 bit |
内存集成电路类型 | FLASH |
内存宽度 | 8 |
湿度敏感等级 | 2 |
功能数量 | 1 |
端子数量 | 32 |
字数 | 32768 words |
字数代码 | 32000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
组织 | 32KX8 |
输出特性 | 3-STATE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | QCCJ |
封装形状 | RECTANGULAR |
封装形式 | CHIP CARRIER |
并行/串行 | PARALLEL |
峰值回流温度(摄氏度) | 225 |
编程电压 | 5 V |
认证状态 | Not Qualified |
座面最大高度 | 3.55 mm |
最大供电电压 (Vsup) | 5.25 V |
最小供电电压 (Vsup) | 4.75 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | TIN LEAD |
端子形式 | J BEND |
端子节距 | 1.27 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | 30 |
类型 | NOR TYPE |
宽度 | 11.43 mm |
AT29C257-70JIT/R | AT29C257-12JIT/R | AT29C257-15JCT/R | AT29C257-70JCT/R | AT29C257-90JCT/R | AT29C257-90JIT/R | AT29C257-12JCT/R | AT29C257-15JIT/R | |
---|---|---|---|---|---|---|---|---|
描述 | Flash, 32KX8, 70ns, PQCC32, PLASTIC, LCC-32 | Flash, 32KX8, 120ns, PQCC32, PLASTIC, LCC-32 | Flash, 32KX8, 150ns, PQCC32, PLASTIC, LCC-32 | Flash, 32KX8, 70ns, PQCC32, PLASTIC, LCC-32 | Flash, 32KX8, 90ns, PQCC32, PLASTIC, LCC-32 | Flash, 32KX8, 90ns, PQCC32, PLASTIC, LCC-32 | Flash, 32KX8, 120ns, PQCC32, PLASTIC, LCC-32 | Flash, 32KX8, 150ns, PQCC32, PLASTIC, LCC-32 |
是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) |
零件包装代码 | QFJ | QFJ | QFJ | QFJ | QFJ | QFJ | QFJ | QFJ |
包装说明 | PLASTIC, LCC-32 | PLASTIC, LCC-32 | PLASTIC, LCC-32 | PLASTIC, LCC-32 | PLASTIC, LCC-32 | PLASTIC, LCC-32 | PLASTIC, LCC-32 | PLASTIC, LCC-32 |
针数 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最长访问时间 | 70 ns | 120 ns | 150 ns | 70 ns | 90 ns | 90 ns | 120 ns | 150 ns |
JESD-30 代码 | R-PQCC-J32 | R-PQCC-J32 | R-PQCC-J32 | R-PQCC-J32 | R-PQCC-J32 | R-PQCC-J32 | R-PQCC-J32 | R-PQCC-J32 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
长度 | 13.97 mm | 13.97 mm | 13.97 mm | 13.97 mm | 13.97 mm | 13.97 mm | 13.97 mm | 13.97 mm |
内存密度 | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit |
内存集成电路类型 | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
湿度敏感等级 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
字数 | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words |
字数代码 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 85 °C | 85 °C | 70 °C | 70 °C | 70 °C | 85 °C | 70 °C | 85 °C |
组织 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
峰值回流温度(摄氏度) | 225 | 225 | 225 | 225 | 225 | 225 | 225 | 225 |
编程电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 3.55 mm | 3.55 mm | 3.55 mm | 3.55 mm | 3.55 mm | 3.55 mm | 3.55 mm | 3.55 mm |
最大供电电压 (Vsup) | 5.25 V | 5.5 V | 5.5 V | 5.25 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.75 V | 4.5 V | 4.5 V | 4.75 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL |
端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
端子形式 | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
类型 | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE |
宽度 | 11.43 mm | 11.43 mm | 11.43 mm | 11.43 mm | 11.43 mm | 11.43 mm | 11.43 mm | 11.43 mm |
其他特性 | - | AUTOMATIC WRITE | AUTOMATIC WRITE | - | AUTOMATIC WRITE | - | AUTOMATIC WRITE | AUTOMATIC WRITE |
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