TELECOM-SLIC, PQCC28, LEAD FREE, PLASTIC, MS-018AB, LCC-28
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
厂商名称 | Renesas(瑞萨电子) |
零件包装代码 | LCC |
包装说明 | QCCJ, LDCC28,.5SQ |
针数 | 28 |
Reach Compliance Code | compliant |
电池馈电 | CONSTANT CURRENT/RESISTIVE |
电池供电 | -100 V |
混合 | 2-4 CONVERSION |
JESD-30 代码 | S-PQCC-J28 |
JESD-609代码 | e3 |
长度 | 11.505 mm |
湿度敏感等级 | 3 |
最大噪声 | 13 dBrnC |
功能数量 | 1 |
端子数量 | 28 |
最高工作温度 | 75 °C |
最低工作温度 | |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | QCCJ |
封装等效代码 | LDCC28,.5SQ |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER |
峰值回流温度(摄氏度) | 260 |
电源 | 5 V |
认证状态 | Not Qualified |
座面最大高度 | 4.57 mm |
最大压摆率 | 0.0135 mA |
标称供电电压 | 5 V |
表面贴装 | YES |
技术 | BIPOLAR |
电信集成电路类型 | SLIC |
温度等级 | COMMERCIAL EXTENDED |
端子面层 | MATTE TIN |
端子形式 | J BEND |
端子节距 | 1.27 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | 40 |
宽度 | 11.505 mm |
ISL5586FCMZ-T | ISL5586FCMZ | ISL5586CIMZ | ISL5586BIMZ | ISL5586FCM-T | |
---|---|---|---|---|---|
描述 | TELECOM-SLIC, PQCC28, LEAD FREE, PLASTIC, MS-018AB, LCC-28 | TELECOM-SLIC, PQCC28, LEAD FREE, PLASTIC, MS-018AB, LCC-28 | TELECOM-SLIC, PQCC28, LEAD FREE, PLASTIC, MS-018AB, LCC-28 | TELECOM-SLIC, PQCC28, LEAD FREE, PLASTIC, MS-018AB, LCC-28 | TELECOM-SLIC, PQCC28, PLASTIC, MS-018AB, LCC-28 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 不符合 |
厂商名称 | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) |
零件包装代码 | LCC | LCC | LCC | LCC | LCC |
包装说明 | QCCJ, LDCC28,.5SQ | QCCJ, LDCC28,.5SQ | QCCJ, LDCC28,.5SQ | QCCJ, LDCC28,.5SQ | PLASTIC, MS-018AB, LCC-28 |
针数 | 28 | 28 | 28 | 28 | 28 |
Reach Compliance Code | compliant | compliant | compliant | compliant | not_compliant |
JESD-30 代码 | S-PQCC-J28 | S-PQCC-J28 | S-PQCC-J28 | S-PQCC-J28 | S-PQCC-J28 |
JESD-609代码 | e3 | e3 | e3 | e3 | e0 |
长度 | 11.505 mm | 11.505 mm | 11.505 mm | 11.505 mm | 11.505 mm |
湿度敏感等级 | 3 | 3 | 3 | 3 | 2 |
功能数量 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 28 | 28 | 28 | 28 | 28 |
最高工作温度 | 75 °C | 75 °C | 85 °C | 85 °C | 75 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 | 240 |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 4.57 mm | 4.57 mm | 4.57 mm | 4.57 mm | 4.57 mm |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES |
技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
电信集成电路类型 | SLIC | SLIC | SLIC | SLIC | SLIC |
温度等级 | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | INDUSTRIAL | INDUSTRIAL | COMMERCIAL EXTENDED |
端子面层 | MATTE TIN | MATTE TIN | MATTE TIN | MATTE TIN | TIN LEAD |
端子形式 | J BEND | J BEND | J BEND | J BEND | J BEND |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD |
处于峰值回流温度下的最长时间 | 40 | 40 | 40 | 40 | NOT SPECIFIED |
宽度 | 11.505 mm | 11.505 mm | 11.505 mm | 11.505 mm | 11.505 mm |
电池馈电 | CONSTANT CURRENT/RESISTIVE | CONSTANT CURRENT/RESISTIVE | CONSTANT CURRENT/RESISTIVE | CONSTANT CURRENT/RESISTIVE | - |
电池供电 | -100 V | -100 V | -100 V | -100 V | - |
混合 | 2-4 CONVERSION | 2-4 CONVERSION | 2-4 CONVERSION | 2-4 CONVERSION | - |
最大噪声 | 13 dBrnC | 13 dBrnC | 13 dBrnC | 13 dBrnC | - |
封装等效代码 | LDCC28,.5SQ | LDCC28,.5SQ | LDCC28,.5SQ | LDCC28,.5SQ | - |
电源 | 5 V | 5 V | 5 V | 5 V | - |
最大压摆率 | 0.0135 mA | 0.0135 mA | 0.0135 mA | 0.0135 mA | - |
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