HLMP-U802-xxxxx
T-1¾ (5 mm) LED Lamp
Data Sheet
Description
This yellow green LED is designed in industry standard T-1¾
package with untinted and non-diffused optics. It is ideal for
the use as indicators.
Features
Application
High luminous intensity output
Low power consumption
Popular T-1¾ package
High efficiency
Versatile mounting on PCB or panel
Status indicator
Package Dimensions
1.00
0.039
0.70 MAX.
0.028
ANODE
0.5 TYP.
0.020
2.54 TYP.
0.100
5.00
0.197
1.0 MIN.
0.04
8.70
0.343
See note 4
22.0 MIN.
0.87
Ø 5.9
0.232
Notes:
1. All dimensions are in millimeter/inches.
2. Dimension tolerances are ±0.25 mm unless otherwise specified.
3. Lead spacing is measured at where the leads emerge from the package.
4. Epoxy meniscus is 1.0 mm maximum below the body.
Broadcom Ltd.
-1-
HLMP-U802-xxxxx
Data Sheet
Absolute Maximum Rating at T
A
= 25 °C
Absolute Maximum Rating at T
A
= 25 °C
Parameter
DC Forward Current
a
Peak Forward Current (1/10 Duty Cycle, 0.1-ms Pulse Width)
Reverse Voltage (I
R
= 100 μA)
Power Dissipation
Operating Temperature Range
Storage Temperature Range
a.
Derate linearly as shown in Figure 4.
HLMP-U802-xxxxx
30
60
5
72
–40 to +100
–40 to +100
Unit
mA
mA
V
mW
°C
°C
Electrical/Optical Characteristics at T
A
= 25 °C
Parameter
Luminous Intensity
Viewing Angle
Spectral Half Width
Forward Voltage
Peak Wavelength
Dominant Wavelength
Reverse Voltage
a.
b.
c.
Symbol
Iv
2θ½
Δ
λ
V
F
λ
p
λ
d
V
R
Min
417.0
—
—
—
—
564.5
5
Typ
800.0
25
13
2.1
572.5
572.0
—
Max
—
—
—
2.4
—
576.5
—
Unit
mcd
deg
nm
V
nm
nm
V
Test Conditions
I
F
= 20 mA, Note
a
Note
b
I
F
= 20 mA
I
F
= 20 mA
I
F
= 20 mA
I
F
= 20 mA, Note
c
I
R
= 100 μA
The luminous intensity is measured on the mechanical axis of the lamp package.
2θ½ is the off-axis angle where the luminous intensity is ½ the on axis intensity.
The dominant wavelength,
λ
d
is derived from the CIE 1931 Chromaticity Diagram and represents the perceived color of the device.
Broadcom Ltd.
-3-
HLMP-U802-xxxxx
Data Sheet
Electrical/Optical Characteristics at T
A
= 25 °C
Figure 1 Relative Intensity vs. Wavelength
Figure 2 Forward Current vs. Forward Voltage
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
380
30
25
FORWARD CURRENT - mA
480
580
WAVELENGTH - nm
680
780
20
15
10
5
0
0
0.5
1
1.5
2
FORWARD VOLTAGE - V
2.5
3
Figure 3 Relative Luminous Intensity vs. Forward Current
RELATIVE INTENSITY
Figure 4 Maximum Forward Current vs. Ambient Temperature
1.8
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
1.6
MAX FORWARD CURRENT - mA
0
5
10
15
20
DC FORWARD CURRENT - mA
25
30
1.4
1.2
1
0.8
0.6
0.4
0.2
0
35
30
25
20
15
10
5
0
0
20
40
60
AMBIENT TEMPERATURE (°C)
80
100
Figure 5 Radiation Pattern
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
NORMALIZED INTENSITY
-90
-60
-30
0
30
60
ANGULAR DISPLACEMENT - DEGREES
90
Broadcom Ltd.
-4-
HLMP-U802-xxxxx
Data Sheet
Intensity Bin Limits
Intensity Bin Limits
Intensity (mcd) at 20 mA
Bin ID
a
Min
N
O
P
Q
a.
Soldering Conditions
Max
680.0
1100.0
1800.0
2700.0
417.0
680.0
1100.0
1800.0
Care must be taken during PCB assembly and soldering
process to prevent damage to LED component.
The closest LED is allowed to solder on board is 1.59 mm
below the body (encapsulant epoxy) for those parts
without standoff.
Recommended soldering conditions:
Wave Soldering
Maximum tolerance for each bin limit is ±18%.
Pre-heat Temperature
Preheat Time
Peak Temperature
Dwell Time
105 °C Max
60 sec Max
260 °C Max
5 sec Max
Color Bin Limits
Dominant Wavelength (nm) at 20 mA
Bin ID
a
5
4
3
2
a.
Min
564.5
567.5
570.5
573.5
Max
567.5
570.5
573.5
576.5
Tolerance for each bin limit is ±1 nm.
Precautions
Lead Forming
The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering into PC board.
If lead forming is required before soldering, care must be
taken to avoid any excessive mechanical stress induced to
LED package. Otherwise, cut the leads of LED to length
after soldering process at room temperature. The solder
joint formed will absorb the mechanical stress of the lead
cutting from traveling to the LED chip die attach and
wirebond.
During lead forming, the leads should be bent at a point at
least 3 mm from the base of the lens. Do not use the base
of the lead frame as a fulcrum during forming. Lead
forming must be done before soldering at normal
temperature.
It is recommended that tooling made to precisely form
and cut the leads to length rather than rely upon hand
operation.
Wave soldering parameter must be set and maintained
according to recommended temperature and dwell time in
the solder wave. Customer is advised to periodically check
on the soldering profile to ensure the soldering profile
used is always conforming to recommended soldering
condition.
If necessary, use fixture to hold the LED component in
proper orientation with respect to the PCB during
soldering process.
Proper handling is imperative to avoid excessive thermal
stresses to LED components when heated.
Therefore, the soldered PCB must be allowed to cool to
room temperature, 25 °C, before handling.
Special attention must be given to board fabrication,
solder masking, surface plating and lead holes size and
component orientation to assure solderability.
Recommended PC board plated through-hole sizes for
LED component leads:
LED Component
Lead Size
0.50 x 0.50 mm
(0.020 x 0.020 inch)
Diagonal
0.718 mm
(0.029 inch)
Plated Through
Hole Diameter
1.050 to 1.150 mm
(0.042 to 0.046 inch)
NOTE
Refer to application note AN1027 for more
information on soldering LED component.
Broadcom Ltd.
-5-
传感器
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