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HY29LV400BF-55

产品描述Flash, 256KX16, 55ns, PBGA48, 6 X 8 MM, FBGA-48
产品类别存储    存储   
文件大小550KB,共40页
制造商SK Hynix(海力士)
官网地址http://www.hynix.com/eng/
下载文档 详细参数 全文预览

HY29LV400BF-55概述

Flash, 256KX16, 55ns, PBGA48, 6 X 8 MM, FBGA-48

HY29LV400BF-55规格参数

参数名称属性值
厂商名称SK Hynix(海力士)
零件包装代码BGA
包装说明TFBGA, BGA48,6X8,32
针数48
Reach Compliance Codecompliant
ECCN代码EAR99
最长访问时间55 ns
备用内存宽度8
启动块BOTTOM
命令用户界面YES
数据轮询YES
耐久性100000 Write/Erase Cycles
JESD-30 代码R-PBGA-B48
JESD-609代码e1
长度8 mm
内存密度4194304 bit
内存集成电路类型FLASH
内存宽度16
功能数量1
部门数/规模1,2,1,7
端子数量48
字数262144 words
字数代码256000
工作模式ASYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织256KX16
封装主体材料PLASTIC/EPOXY
封装代码TFBGA
封装等效代码BGA48,6X8,32
封装形状RECTANGULAR
封装形式GRID ARRAY, THIN PROFILE, FINE PITCH
并行/串行PARALLEL
电源3.3 V
编程电压3 V
认证状态Not Qualified
就绪/忙碌YES
座面最大高度1.1 mm
部门规模16K,8K,32K,64K
最大待机电流0.000005 A
最大压摆率0.03 mA
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)3 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层TIN SILVER COPPER
端子形式BALL
端子节距0.8 mm
端子位置BOTTOM
切换位YES
类型NOR TYPE
宽度6 mm

文档预览

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HY29LV400
4 Mbit (512K x 8/256K x 16) Low Voltage Flash Memory
KEY FEATURES
n
Single Power Supply Operation
– Read, program and erase operations from
2.7 to 3.6 volts
– Ideal for battery-powered applications
High Performance
– 70 and 90 ns access time versions for full
voltage range operation
– 55 ns access time version for operation
from 3.0 to 3.6 volts
Ultra-low Power Consumption (Typical
Values)
– Automatic sleep mode current: 0.2 µA
– Standby mode current: 0.2 µA
– Read current: 7 mA (at 5 Mhz)
– Program/erase current: 15 mA
Flexible Sector Architecture:
– One 16 KB, two 8 KB, one 32 KB and
seven 64 KB sectors in byte mode
– One 8 KW, two 4 KW, one 16 KW and
seven 32 KW sectors in word mode
– Top or bottom boot block configurations
available
Sector Protection
– Allows locking of a sector or sectors to
prevent program or erase operations
within that sector
– Sectors lockable in-system or via
programming equipment
– Temporary Sector Unprotect allows
changes in locked sectors (requires high
voltage on RESET# pin)
Fast Program and Erase Times
– Sector erase time: 0.5 sec typical for each
sector
– Chip erase time: 5 sec typical
– Byte program time: 9
µs
typical
– Word program time: 11
µs
typical
Unlock Bypass Program Command
– Reduces programming time when issuing
multiple program command sequences
Automatic Erase Algorithm Preprograms
and Erases Any Combination of Sectors
or the Entire Chip
Automatic Program Algorithm Writes and
Verifies Data at Specified Addresses
n
Minimum 100,000 Write Cycles per Sector
n
Compatible With JEDEC standards
– Pinout and software compatible with
single-power supply Flash devices
– Superior inadvertent write protection
Data# Polling and Toggle Bits
– Provide software confirmation of
completion of program and erase
operations
Ready/Busy# Pin
– Provides hardware confirmation of
completion of program and erase
operations
Erase Suspend/Erase Resume
– Suspends an erase operation to allow
reading data from, or programming data
to, a sector that is not being erased
– Erase Resume can then be invoked to
complete suspended erasure
Hardware Reset Pin (RESET#) Resets the
Device to Reading Array Data
Space Efficient Packaging
– 48-pin TSOP and 48-ball FBGA packages
n
n
n
n
n
n
n
n
n
LOGIC DIAGRAM
18
A[17:0]
DQ[7:0]
7
CE#
OE#
WE#
RESET#
BYTE#
DQ[14:8]
DQ[15]/A[-1]
RY/BY#
8
n
n
n
n
Preliminary
Revision 1.0, November 2001

 
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