TELECOM, DATA ENCRYPTION CIRCUIT, PDSO8, 0.150 INCH, PLASTIC, SOIC-8
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Microchip(微芯科技) |
| 零件包装代码 | SOIC |
| 包装说明 | SOP, |
| 针数 | 8 |
| Reach Compliance Code | compliant |
| JESD-30 代码 | R-PDSO-G8 |
| JESD-609代码 | e3 |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 260 |
| 认证状态 | Not Qualified |
| 标称供电电压 | 3 V |
| 表面贴装 | YES |
| 电信集成电路类型 | DATA ENCRYPTION CIRCUIT |
| 温度等级 | COMMERCIAL |
| 端子面层 | MATTE TIN |
| 端子形式 | GULL WING |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 40 |
| HCS412-/SN | HCS412-I/SN | HCS412-I/P | HCS412T-I/SN | HCS412T/SN | HCS412/P | HCS412/SN | HCS412TI/SN | HCS412T-/SN | HCS412-/P | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | TELECOM, DATA ENCRYPTION CIRCUIT, PDSO8, 0.150 INCH, PLASTIC, SOIC-8 | IC code hop encodr/trnspnd 8soic | IC code hop encodr/trnspond 8dip | IC code hop encodr/trnspnd 8soic | IC code hop encodr/trnspnd 8soic | IC code hop encodr/trnspond 8dip | IC code hop encodr/trnspnd 8soic | TELECOM, DATA ENCRYPTION CIRCUIT, PDSO8, 0.150 INCH, PLASTIC, SOIC-8 | TELECOM, DATA ENCRYPTION CIRCUIT, PDSO8, 0.150 INCH, PLASTIC, SOIC-8 | TELECOM, DATA ENCRYPTION CIRCUIT, PDIP8, 0.300 INCH, PLASTIC, DIP-8 |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | - | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | - | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | - | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) |
| 零件包装代码 | SOIC | SOIC | DIP | - | SOIC | DIP | SOIC | SOIC | SOIC | DIP |
| 包装说明 | SOP, | SOP, SOP8,.25 | DIP, DIP8,.3 | - | SOP, SOP8,.25 | DIP, DIP8,.3 | SOP, SOP8,.25 | SOP, SOP8,.25 | SOP, | DIP, |
| 针数 | 8 | 8 | 8 | - | 8 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | compliant | compliant | compliant | - | compliant | compliant | compliant | compliant | compliant | compliant |
| JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-PDIP-T8 | - | R-PDSO-G8 | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDIP-T8 |
| JESD-609代码 | e3 | e3 | e3 | - | e3 | e3 | e3 | e3 | e3 | e3 |
| 湿度敏感等级 | 1 | 1 | - | - | 1 | - | 1 | 1 | 1 | - |
| 功能数量 | 1 | 1 | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | - | 8 | 8 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 70 °C | 85 °C | 85 °C | - | 70 °C | 70 °C | 70 °C | 85 °C | 70 °C | 70 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | SOP | DIP | - | SOP | DIP | SOP | SOP | SOP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | - | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE |
| 峰值回流温度（摄氏度） | 260 | 260 | NOT SPECIFIED | - | 260 | NOT SPECIFIED | 260 | 260 | 260 | NOT SPECIFIED |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 标称供电电压 | 3 V | 3 V | 3 V | - | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 表面贴装 | YES | YES | NO | - | YES | NO | YES | YES | YES | NO |
| 电信集成电路类型 | DATA ENCRYPTION CIRCUIT | DATA ENCRYPTION CIRCUIT | DATA ENCRYPTION CIRCUIT | - | DATA ENCRYPTION CIRCUIT | DATA ENCRYPTION CIRCUIT | DATA ENCRYPTION CIRCUIT | DATA ENCRYPTION CIRCUIT | DATA ENCRYPTION CIRCUIT | DATA ENCRYPTION CIRCUIT |
| 温度等级 | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | MATTE TIN | Matte Tin (Sn) | Matte Tin (Sn) | - | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | MATTE TIN | MATTE TIN |
| 端子形式 | GULL WING | GULL WING | THROUGH-HOLE | - | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | THROUGH-HOLE |
| 端子位置 | DUAL | DUAL | DUAL | - | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 40 | 40 | NOT SPECIFIED | - | 40 | NOT SPECIFIED | 40 | 40 | 40 | NOT SPECIFIED |
| 长度 | - | 4.9 mm | 9.46 mm | - | 4.9 mm | 9.46 mm | 4.9 mm | 4.9 mm | - | - |
| 封装等效代码 | - | SOP8,.25 | DIP8,.3 | - | SOP8,.25 | DIP8,.3 | SOP8,.25 | SOP8,.25 | - | - |
| 电源 | - | 2/6.3 V | 2/6.5 V | - | 2/6.3 V | 2/6.3 V | 2/6.3 V | 2/6.3 V | - | - |
| 座面最大高度 | - | 1.75 mm | 4.32 mm | - | 1.75 mm | 4.32 mm | 1.75 mm | 1.75 mm | - | - |
| 最大压摆率 | - | 0.0005 mA | 0.0003 mA | - | 0.0003 mA | 0.0003 mA | 0.0003 mA | 0.0005 mA | - | - |
| 端子节距 | - | 1.27 mm | 2.54 mm | - | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | - | - |
| 宽度 | - | 3.9 mm | 7.62 mm | - | 3.9116 mm | 7.62 mm | 3.9116 mm | 3.9 mm | - | - |
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