Single Positive-Edge-Triggered D-Type Flip-Flop with Clear and Preset 8-UQFN -40 to 85
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | QFN |
| 包装说明 | HVQCCN, LCC8,.06SQ,20 |
| 针数 | 8 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| Factory Lead Time | 1 week |
| 系列 | AUC |
| JESD-30 代码 | S-XQCC-N8 |
| JESD-609代码 | e4 |
| 长度 | 1.5 mm |
| 负载电容（CL） | 15 pF |
| 逻辑集成电路类型 | D FLIP-FLOP |
| 最大频率@ Nom-Su | 200000000 Hz |
| 最大I（ol） | 0.009 A |
| 湿度敏感等级 | 1 |
| 位数 | 1 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | COMPLEMENTARY |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | HVQCCN |
| 封装等效代码 | LCC8,.06SQ,20 |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 包装方法 | TR |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 1.2/2.5 V |
| 最大电源电流（ICC） | 0.01 mA |
| Prop。Delay @ Nom-Su | 3.8 ns |
| 传播延迟（tpd） | 3.8 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.6 mm |
| 最大供电电压 (Vsup) | 2.7 V |
| 最小供电电压 (Vsup) | 0.8 V |
| 标称供电电压 (Vsup) | 1.2 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 触发器类型 | POSITIVE EDGE |
| 宽度 | 1.5 mm |
| 最小 fmax | 275 MHz |
| SN74AUC1G74RSER | SN74AUC1G74YZPR | SN74AUC1G74DCTR | SN74AUC1G74DCUR | SN74AUC1G74DCTRE4 | SN74AUC1G74DCURE4 | SN74AUC1G74DCURG4 | SN74AUC1G74RSERG4 | SN74AUC1G74DCTRG4 | SN74AUC1G74YEPR | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | Single Positive-Edge-Triggered D-Type Flip-Flop with Clear and Preset 8-UQFN -40 to 85 | Single Positive-Edge-Triggered D-Type Flip-Flop with Clear and Preset 8-DSBGA -40 to 85 | Flip Flop D-Type Pos-Edge 1-Element 8-Pin SSOP T/R | Single Positive-Edge-Triggered D-Type Flip-Flop with Clear and Preset 8-VSSOP -40 to 85 | Single Positive-Edge-Triggered D-Type Flip-Flop with Clear and Preset 8-SM8 -40 to 85 | Single Positive-Edge-Triggered D-Type Flip-Flop with Clear and Preset 8-VSSOP -40 to 85 | Single Positive-Edge-Triggered D-Type Flip-Flop with Clear and Preset 8-VSSOP -40 to 85 | Single Positive-Edge-Triggered D-Type Flip-Flop with Clear and Preset 8-UQFN -40 to 85 | Single Positive-Edge-Triggered D-Type Flip-Flop with Clear and Preset 8-SM8 -40 to 85 | IC FF D-TYPE SNGL 1BIT 8DSBGA |
| Brand Name | Texas Instruments | Texas Instruments | - | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | - |
| 是否Rohs认证 | 符合 | 符合 | - | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) |
| 零件包装代码 | QFN | BGA | - | SOIC | SOIC | TSSOP | SOIC | QFN | SOIC | BGA |
| 包装说明 | HVQCCN, LCC8,.06SQ,20 | VFBGA, BGA8,2X4,20 | - | VSSOP-8 | LSSOP, SSOP8,.16 | VSSOP, TSSOP8,.12,20 | VSSOP, TSSOP8,.12,20 | HVQCCN, LCC8,.06SQ,20 | LSSOP, TSSOP8,.16 | VFBGA, BGA8,2X4,20 |
| 针数 | 8 | 8 | - | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | compli | compli | - | compliant | compli | compli | compli | compli | compli | not_compliant |
| 系列 | AUC | AUC | - | AUC | AUC | AUC | AUC | AUC | AUC | AUC |
| JESD-30 代码 | S-XQCC-N8 | R-XBGA-B8 | - | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | S-XQCC-N8 | R-PDSO-G8 | R-XBGA-B8 |
| JESD-609代码 | e4 | e1 | - | e4 | e4 | e4 | e4 | e4 | e4 | - |
| 长度 | 1.5 mm | 1.9 mm | - | 2.3 mm | 2.95 mm | 2.3 mm | 2.3 mm | 1.5 mm | 2.95 mm | 1.9 mm |
| 负载电容（CL） | 15 pF | 15 pF | - | 15 pF | 15 pF | 15 pF | 15 pF | 15 pF | 15 pF | 15 pF |
| 逻辑集成电路类型 | D FLIP-FLOP | D FLIP-FLOP | - | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
| 最大频率@ Nom-Su | 200000000 Hz | 200000000 Hz | - | - | 200000000 Hz | 200000000 Hz | 200000000 Hz | 200000000 Hz | 200000000 Hz | - |
| 最大I（ol） | 0.009 A | 0.009 A | - | 0.009 A | 0.005 A | 0.009 A | 0.009 A | 0.005 A | 0.005 A | 0.005 A |
| 湿度敏感等级 | 1 | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 | - |
| 位数 | 1 | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | - | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 85 °C | 85 °C | - | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | COMPLEMENTARY | COMPLEMENTARY | - | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | UNSPECIFIED |
| 封装代码 | HVQCCN | VFBGA | - | VSSOP | LSSOP | VSSOP | VSSOP | HVQCCN | LSSOP | VFBGA |
| 封装等效代码 | LCC8,.06SQ,20 | BGA8,2X4,20 | - | TSSOP8,.12,20 | SSOP8,.16 | TSSOP8,.12,20 | TSSOP8,.12,20 | LCC8,.06SQ,20 | TSSOP8,.16 | BGA8,2X4,20 |
| 封装形状 | SQUARE | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | - | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 包装方法 | TR | TR | - | TR | TAPE AND REEL | TR | TR | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL |
| 峰值回流温度（摄氏度） | 260 | 260 | - | 260 | 260 | 260 | 260 | 260 | 260 | NOT SPECIFIED |
| 电源 | 1.2/2.5 V | 1.2/2.5 V | - | 1.2/2.5 V | 1.2/2.5 V | 1.2/2.5 V | 1.2/2.5 V | 1.2/2.5 V | 1.2/2.5 V | 1.2/2.5 V |
| Prop。Delay @ Nom-Su | 3.8 ns | 3.8 ns | - | - | 3.8 ns | 3.8 ns | 3.8 ns | 3.8 ns | 3.8 ns | - |
| 传播延迟（tpd） | 3.8 ns | 3.8 ns | - | 3.8 ns | 3.8 ns | 3.8 ns | 3.8 ns | 3.8 ns | 3.8 ns | 3.8 ns |
| 认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 0.6 mm | 0.5 mm | - | 0.9 mm | 1.3 mm | 0.9 mm | 0.9 mm | 0.6 mm | 1.3 mm | 0.5 mm |
| 最大供电电压 (Vsup) | 2.7 V | 2.7 V | - | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| 最小供电电压 (Vsup) | 0.8 V | 0.8 V | - | 0.8 V | 0.8 V | 0.8 V | 0.8 V | 0.8 V | 0.8 V | 0.8 V |
| 标称供电电压 (Vsup) | 1.2 V | 1.2 V | - | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| 表面贴装 | YES | YES | - | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin/Silver/Copper (Sn/Ag/Cu) | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | - |
| 端子形式 | NO LEAD | BALL | - | GULL WING | GULL WING | GULL WING | GULL WING | NO LEAD | GULL WING | BALL |
| 端子节距 | 0.5 mm | 0.5 mm | - | 0.5 mm | 0.65 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.65 mm | 0.5 mm |
| 端子位置 | QUAD | BOTTOM | - | DUAL | DUAL | DUAL | DUAL | QUAD | DUAL | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 触发器类型 | POSITIVE EDGE | POSITIVE EDGE | - | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| 宽度 | 1.5 mm | 0.9 mm | - | 2 mm | 2.8 mm | 2 mm | 2 mm | 1.5 mm | 2.8 mm | 0.9 mm |
| 最小 fmax | 275 MHz | 275 MHz | - | 275 MHz | 275 MHz | 275 MHz | 275 MHz | 275 MHz | 275 MHz | 275 MHz |
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