Buffers & Line Drivers Octal Buffers Driver
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | Texas Instruments(德州仪器) |
零件包装代码 | TSSOP |
包装说明 | TSSOP, TSSOP20,.25 |
针数 | 20 |
Reach Compliance Code | unknow |
控制类型 | ENABLE LOW |
系列 | AHC/VHC/H/U/V |
JESD-30 代码 | R-PDSO-G20 |
JESD-609代码 | e4 |
长度 | 6.5 mm |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | BUS DRIVER |
最大I(ol) | 0.008 A |
湿度敏感等级 | 1 |
位数 | 8 |
功能数量 | 1 |
端口数量 | 2 |
端子数量 | 20 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
输出特性 | 3-STATE |
输出极性 | INVERTED |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSSOP |
封装等效代码 | TSSOP20,.25 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
包装方法 | TUBE |
峰值回流温度(摄氏度) | 260 |
电源 | 2/5.5 V |
Prop。Delay @ Nom-Su | 8 ns |
传播延迟(tpd) | 12 ns |
认证状态 | Not Qualified |
座面最大高度 | 1.2 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 2 V |
标称供电电压 (Vsup) | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | GULL WING |
端子节距 | 0.65 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 4.4 mm |
SN74AHC540PWG4 | SN74AHC540DBRE4 | SN74AHC540DGVRE4 | SN74AHC540DGVRG4 | SN74AHC540DWRE4 | SN74AHC540NE4 | SN74AHC540NSR | SN74AHC540PWRG4 | |
---|---|---|---|---|---|---|---|---|
描述 | Buffers & Line Drivers Octal Buffers Driver | Buffers & Line Drivers Octal Buffer/Driver With 3-State Outputs | Buffers & Line Drivers Octal Buffer/Driver With 3-State Outputs | Buffers & Line Drivers Octal Buffers Driver | Buffers & Line Drivers Octal Buffer/Driver With 3-State Outputs | Buffers & Line Drivers Octal Buffer/Driver With 3-State Outputs | Buffers & Line Drivers Octal Buffer/Driver With 3-State Outputs | Octal Buffers/Drivers With 3-State Outputs 20-TSSOP -40 to 125 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
零件包装代码 | TSSOP | SSOP | SOIC | SOIC | SOIC | DIP | SOIC | TSSOP |
包装说明 | TSSOP, TSSOP20,.25 | SSOP, SSOP20,.3 | TSSOP, TSSOP20,.25,16 | TSSOP, TSSOP20,.25,16 | SOP, SOP20,.4 | DIP, DIP20,.3 | SOP, SOP20,.3 | TSSOP, TSSOP20,.25 |
针数 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
Reach Compliance Code | unknow | unknow | unknow | unknow | unknow | unknow | unknow | compli |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | - | 不含铅 |
控制类型 | ENABLE LOW | ENABLE LOW | - | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW |
系列 | AHC/VHC/H/U/V | AHC/VHC/H/U/V | - | AHC/VHC/H/U/V | AHC/VHC/H/U/V | AHC/VHC/H/U/V | AHC/VHC/H/U/V | AHC/VHC/H/U/V |
JESD-30 代码 | R-PDSO-G20 | R-PDSO-G20 | - | R-PDSO-G20 | R-PDSO-G20 | R-PDIP-T20 | R-PDSO-G20 | R-PDSO-G20 |
JESD-609代码 | e4 | e4 | - | e4 | e4 | e4 | - | e4 |
长度 | 6.5 mm | 7.2 mm | - | 5 mm | 12.8 mm | 25.4 mm | 12.6 mm | 6.5 mm |
负载电容(CL) | 50 pF | 50 pF | - | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | - | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
最大I(ol) | 0.008 A | 0.008 A | - | 0.008 A | 0.008 A | 0.008 A | 0.008 A | 0.008 A |
湿度敏感等级 | 1 | 1 | - | 1 | 1 | - | - | 1 |
位数 | 8 | 8 | - | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | - | 1 | 1 | 1 | 1 | 1 |
端口数量 | 2 | 2 | - | 2 | 2 | 2 | 2 | 2 |
端子数量 | 20 | 20 | - | 20 | 20 | 20 | 20 | 20 |
最高工作温度 | 85 °C | 85 °C | - | 85 °C | 85 °C | 85 °C | 85 °C | 125 °C |
最低工作温度 | -40 °C | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
输出特性 | 3-STATE | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
输出极性 | INVERTED | INVERTED | - | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSSOP | SSOP | - | TSSOP | SOP | DIP | SOP | TSSOP |
封装等效代码 | TSSOP20,.25 | SSOP20,.3 | - | TSSOP20,.25,16 | SOP20,.4 | DIP20,.3 | SOP20,.3 | TSSOP20,.25 |
封装形状 | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
包装方法 | TUBE | TAPE AND REEL | - | TR | TAPE AND REEL | TUBE | TAPE AND REEL | TR |
峰值回流温度(摄氏度) | 260 | 260 | - | 260 | 260 | NOT SPECIFIED | NOT SPECIFIED | 260 |
电源 | 2/5.5 V | 2/5.5 V | - | 2/5.5 V | 2/5.5 V | 2/5.5 V | 2/5.5 V | 2/5.5 V |
Prop。Delay @ Nom-Su | 8 ns | 8 ns | - | 8 ns | 8 ns | 8 ns | 8 ns | 8 ns |
传播延迟(tpd) | 12 ns | 12 ns | - | 12 ns | 12 ns | 12 ns | 12 ns | 12 ns |
认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.2 mm | 2 mm | - | 1.2 mm | 2.65 mm | 5.08 mm | 2 mm | 1.2 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 2 V | 2 V | - | 2 V | 2 V | 2 V | 2 V | 2 V |
标称供电电压 (Vsup) | 3.3 V | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | - | YES | YES | NO | YES | YES |
技术 | CMOS | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | AUTOMOTIVE |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | - | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | GULL WING | GULL WING | - | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING |
端子节距 | 0.65 mm | 0.65 mm | - | 0.4 mm | 1.27 mm | 2.54 mm | 1.27 mm | 0.65 mm |
端子位置 | DUAL | DUAL | - | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 4.4 mm | 5.3 mm | - | 4.4 mm | 7.5 mm | 7.62 mm | 5.3 mm | 4.4 mm |
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