Octal D-Type Edge-Triggered Flip-Flops With 3-State Outputs 20-SOIC -40 to 85
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | SOIC |
| 包装说明 | SOP, SOP20,.4 |
| 针数 | 20 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| Factory Lead Time | 1 week |
| 其他特性 | BROADSIDE VERSION OF 534 |
| 控制类型 | INDEPENDENT CONTROL |
| 计数方向 | UNIDIRECTIONAL |
| 系列 | AC |
| JESD-30 代码 | R-PDSO-G20 |
| JESD-609代码 | e4 |
| 长度 | 12.8 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER |
| 最大I（ol） | 0.024 A |
| 湿度敏感等级 | 1 |
| 位数 | 8 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | INVERTED |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP20,.4 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 包装方法 | TUBE |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 3.3/5 V |
| 最大电源电流（ICC） | 0.04 mA |
| Prop。Delay @ Nom-Su | 15.5 ns |
| 传播延迟（tpd） | 15.5 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.65 mm |
| 最大供电电压 (Vsup) | 6 V |
| 最小供电电压 (Vsup) | 2 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 翻译 | N/A |
| 触发器类型 | POSITIVE EDGE |
| 宽度 | 7.5 mm |
| SN74AC564DW | SN74AC564N | SN74AC564DBR | SN74AC564DWG4 | SN74AC564PWR | SN74AC564PW | |
|---|---|---|---|---|---|---|
| 描述 | Octal D-Type Edge-Triggered Flip-Flops With 3-State Outputs 20-SOIC -40 to 85 | Octal D-Type Edge-Triggered Flip-Flops With 3-State Outputs 20-PDIP -40 to 85 | Octal D-Type Edge-Triggered Flip-Flops With 3-State Outputs 20-SSOP -40 to 85 | Octal D-Type Edge-Triggered Flip-Flops With 3-State Outputs 20-SOIC -40 to 85 | Octal D-Type Edge-Triggered Flip-Flops With 3-State Outputs 20-TSSOP -40 to 85 | Octal D-Type Edge-Triggered Flip-Flops With 3-State Outputs 20-TSSOP -40 to 85 |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | SOIC | DIP | SSOP | SOIC | TSSOP | TSSOP |
| 包装说明 | SOP, SOP20,.4 | DIP, DIP20,.3 | SSOP, SSOP20,.3 | SOP, SOP20,.4 | TSSOP, TSSOP20,.25 | TSSOP, TSSOP20,.25 |
| 针数 | 20 | 20 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | compli | compli | compli | compli | compli | compli |
| 厂商名称 | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| Factory Lead Time | 1 week | - | 6 weeks | 6 weeks | 1 week | 6 weeks |
| 控制类型 | INDEPENDENT CONTROL | INDEPENDENT CONTROL | INDEPENDENT CONTROL | - | INDEPENDENT CONTROL | INDEPENDENT CONTROL |
| 计数方向 | UNIDIRECTIONAL | UNIDIRECTIONAL | UNIDIRECTIONAL | - | UNIDIRECTIONAL | UNIDIRECTIONAL |
| 系列 | AC | AC | AC | - | AC | AC |
| JESD-30 代码 | R-PDSO-G20 | R-PDIP-T20 | R-PDSO-G20 | - | R-PDSO-G20 | R-PDSO-G20 |
| JESD-609代码 | e4 | e4 | e4 | - | e4 | e4 |
| 长度 | 12.8 mm | 25.4 mm | 7.2 mm | - | 6.5 mm | 6.5 mm |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | - | 50 pF | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | - | BUS DRIVER | BUS DRIVER |
| 最大I（ol） | 0.024 A | 0.024 A | 0.024 A | - | 0.024 A | 0.024 A |
| 湿度敏感等级 | 1 | - | 1 | - | 1 | 1 |
| 位数 | 8 | 8 | 8 | - | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | - | 1 | 1 |
| 端口数量 | 2 | 2 | 2 | - | 2 | 2 |
| 端子数量 | 20 | 20 | 20 | - | 20 | 20 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | - | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | - | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | - | 3-STATE | 3-STATE |
| 输出极性 | INVERTED | INVERTED | INVERTED | - | INVERTED | INVERTED |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | DIP | SSOP | - | TSSOP | TSSOP |
| 封装等效代码 | SOP20,.4 | DIP20,.3 | SSOP20,.3 | - | TSSOP20,.25 | TSSOP20,.25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | IN-LINE | SMALL OUTLINE, SHRINK PITCH | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 包装方法 | TUBE | TUBE | TR | - | TR | TUBE |
| 峰值回流温度（摄氏度） | 260 | NOT SPECIFIED | 260 | - | 260 | 260 |
| 电源 | 3.3/5 V | 3.3/5 V | 3.3/5 V | - | 3.3/5 V | 3.3/5 V |
| 最大电源电流（ICC） | 0.04 mA | 0.04 mA | 0.04 mA | - | 0.04 mA | 0.04 mA |
| Prop。Delay @ Nom-Su | 15.5 ns | 15.5 ns | 15.5 ns | - | 15.5 ns | 15.5 ns |
| 传播延迟（tpd） | 15.5 ns | 15.5 ns | 15.5 ns | - | 15.5 ns | 15.5 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
| 座面最大高度 | 2.65 mm | 5.08 mm | 2 mm | - | 1.2 mm | 1.2 mm |
| 最大供电电压 (Vsup) | 6 V | 6 V | 6 V | - | 6 V | 6 V |
| 最小供电电压 (Vsup) | 2 V | 2 V | 2 V | - | 2 V | 2 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | - | 3.3 V | 3.3 V |
| 表面贴装 | YES | NO | YES | - | YES | YES |
| 技术 | CMOS | CMOS | CMOS | - | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING | THROUGH-HOLE | GULL WING | - | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | 2.54 mm | 0.65 mm | - | 0.65 mm | 0.65 mm |
| 端子位置 | DUAL | DUAL | DUAL | - | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
| 翻译 | N/A | N/A | N/A | - | N/A | N/A |
| 触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | - | POSITIVE EDGE | POSITIVE EDGE |
| 宽度 | 7.5 mm | 7.62 mm | 5.3 mm | - | 4.4 mm | 4.4 mm |
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