Power Supply Management Circuit, Fixed, 1 Channel, CMOS, PDIP16, 0.300 INCH, DIP-16
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Maxim(美信半导体) |
零件包装代码 | DIP |
包装说明 | 0.300 INCH, DIP-16 |
针数 | 16 |
Reach Compliance Code | not_compliant |
ECCN代码 | EAR99 |
可调阈值 | NO |
模拟集成电路 - 其他类型 | POWER SUPPLY MANAGEMENT CIRCUIT |
JESD-30 代码 | R-PDIP-T16 |
JESD-609代码 | e0 |
长度 | 19.175 mm |
信道数量 | 1 |
功能数量 | 1 |
端子数量 | 16 |
最高工作温度 | 70 °C |
最低工作温度 | |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装等效代码 | DIP16,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 5 V |
认证状态 | Not Qualified |
座面最大高度 | 4.572 mm |
最大供电电流 (Isup) | 4 mA |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 7.62 mm |
DS1238 | DS1238AS-5+ | DS1238S-10+ | DS1238S-5+ | DS1238AS-10/T&R | DS1238S-5/T&R; | DS1238AS-10/T&R; | DS1238S+T&R; | DS1238S-5+T&R; | |
---|---|---|---|---|---|---|---|---|---|
描述 | Power Supply Management Circuit, Fixed, 1 Channel, CMOS, PDIP16, 0.300 INCH, DIP-16 | IC micro manager 5% 16-soic | IC microman W/fresh 10% 16-soic | IC microman W/fresh 5% 16-soic | IC micromanager 10% 16-soic | IC MICROMAN W/FRESH 5% 16-SOIC | IC MICROMANAGER 10% 16-SOIC | IC MICROMAN W/FRESH 10% 16-SOIC | IC MICROMAN W/FRESH 5% 16-SOIC |
是否Rohs认证 | 不符合 | 符合 | 符合 | 符合 | 不符合 | - | - | - | - |
厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | - | - | - | - |
零件包装代码 | DIP | SOIC | SOIC | SOIC | SOIC | - | - | - | - |
包装说明 | 0.300 INCH, DIP-16 | SOP, | SOP, SOP16,.4 | 0.300 INCH, SOIC-16 | SOP, | - | - | - | - |
针数 | 16 | 16 | 16 | 16 | 16 | - | - | - | - |
Reach Compliance Code | not_compliant | compli | compli | unknown | compliant | - | - | - | - |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - | - | - | - |
可调阈值 | NO | NO | NO | NO | NO | - | - | - | - |
模拟集成电路 - 其他类型 | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | - | - | - | - |
JESD-30 代码 | R-PDIP-T16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | - | - | - | - |
JESD-609代码 | e0 | e3 | e3 | e3 | e0 | - | - | - | - |
长度 | 19.175 mm | 10.3 mm | 10.3 mm | 10.3 mm | 10.3 mm | - | - | - | - |
信道数量 | 1 | 1 | 2 | 1 | 1 | - | - | - | - |
功能数量 | 1 | 1 | 1 | 1 | 1 | - | - | - | - |
端子数量 | 16 | 16 | 16 | 16 | 16 | - | - | - | - |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | - | - | - | - |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - | - | - |
封装代码 | DIP | SOP | SOP | SOP | SOP | - | - | - | - |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | - | - | - |
封装形式 | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | - | - | - | - |
峰值回流温度(摄氏度) | NOT SPECIFIED | 260 | 260 | 260 | 245 | - | - | - | - |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | - | - | - |
座面最大高度 | 4.572 mm | 2.65 mm | 2.65 mm | 2.65 mm | 2.65 mm | - | - | - | - |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | - | - | - | - |
表面贴装 | NO | YES | YES | YES | YES | - | - | - | - |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | - | - | - | - |
端子面层 | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | TIN LEAD | - | - | - | - |
端子形式 | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING | - | - | - | - |
端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | - | - | - | - |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | - | - | - | - |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | - | - |
宽度 | 7.62 mm | 7.5 mm | 7.5 mm | 7.5 mm | 7.5 mm | - | - | - | - |
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