4-CHANNEL, DIFFERENTIAL MULTIPLEXER, PDSO16, SOIC-16
| 参数名称 | 属性值 |
| 厂商名称 | Motorola ( NXP ) |
| 零件包装代码 | SOIC |
| 包装说明 | SOP, SOP16,.25 |
| 针数 | 16 |
| Reach Compliance Code | unknown |
| 模拟集成电路 - 其他类型 | DIFFERENTIAL MULTIPLEXER |
| JESD-30 代码 | R-PDSO-G16 |
| JESD-609代码 | e0 |
| 长度 | 9.9 mm |
| 标称负供电电压 (Vsup) | |
| 信道数量 | 4 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 标称断态隔离度 | 50 dB |
| 通态电阻匹配规范 | 10 Ω |
| 最大通态电阻 (Ron) | 280 Ω |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP16,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 电源 | 5/15 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.75 mm |
| 标称供电电压 (Vsup) | 15 V |
| 表面贴装 | YES |
| 最长断开时间 | 250 ns |
| 最长接通时间 | 250 ns |
| 切换 | BREAK-BEFORE-MAKE |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 宽度 | 3.9 mm |
| MC14052BDR2 | MC14053BCPD | MC14051BDR2 | MC14053BDR2 | MC14051BCPD | |
|---|---|---|---|---|---|
| 描述 | 4-CHANNEL, DIFFERENTIAL MULTIPLEXER, PDSO16, SOIC-16 | TRIPLE 2-CHANNEL, SGL ENDED MULTIPLEXER, PDIP16, 648-08 | 8-CHANNEL, SGL ENDED MULTIPLEXER, PDSO16, SOIC-16 | TRIPLE 2-CHANNEL, SGL ENDED MULTIPLEXER, PDSO16, SOIC-16 | 8-CHANNEL, SGL ENDED MULTIPLEXER, PDIP16, 648-08 |
| 厂商名称 | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) |
| 包装说明 | SOP, SOP16,.25 | 648-08 | SOP, SOP16,.25 | SOP, | DIP, DIP16,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| 模拟集成电路 - 其他类型 | DIFFERENTIAL MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER |
| JESD-30 代码 | R-PDSO-G16 | R-PDIP-T16 | R-PDSO-G16 | R-PDSO-G16 | R-PDIP-T16 |
| 长度 | 9.9 mm | 19.175 mm | 9.9 mm | 9.9 mm | 19.175 mm |
| 信道数量 | 4 | 2 | 8 | 2 | 8 |
| 功能数量 | 1 | 3 | 1 | 3 | 1 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 |
| 标称断态隔离度 | 50 dB | 50 dB | 50 dB | 50 dB | 50 dB |
| 通态电阻匹配规范 | 10 Ω | 10 Ω | 10 Ω | 10 Ω | 10 Ω |
| 最大通态电阻 (Ron) | 280 Ω | 280 Ω | 280 Ω | 280 Ω | 280 Ω |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | DIP | SOP | SOP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.75 mm | 4.44 mm | 1.75 mm | 1.75 mm | 4.44 mm |
| 标称供电电压 (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V |
| 表面贴装 | YES | NO | YES | YES | NO |
| 最长断开时间 | 250 ns | 220 ns | 280 ns | 220 ns | 280 ns |
| 最长接通时间 | 250 ns | 220 ns | 280 ns | 220 ns | 280 ns |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 3.9 mm | 7.62 mm | 3.9 mm | 3.9 mm | 7.62 mm |
| 零件包装代码 | SOIC | - | SOIC | SOIC | DIP |
| 针数 | 16 | - | 16 | 16 | 16 |
| JESD-609代码 | e0 | e0 | e0 | - | e0 |
| 封装等效代码 | SOP16,.25 | DIP16,.3 | SOP16,.25 | - | DIP16,.3 |
| 电源 | 5/15 V | 5/15 V | 5/15 V | - | 5/15 V |
| 切换 | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | - | BREAK-BEFORE-MAKE |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
| 峰值回流温度（摄氏度） | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
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