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MRF18090BR3

产品描述L BAND, Si, N-CHANNEL, RF POWER, MOSFET, ROHS COMPLIANT, NI-880, CASE 465B-03, 2 PIN
产品类别分立半导体    晶体管   
文件大小550KB,共8页
制造商NXP(恩智浦)
官网地址https://www.nxp.com
标准  
下载文档 详细参数 选型对比 全文预览

MRF18090BR3概述

L BAND, Si, N-CHANNEL, RF POWER, MOSFET, ROHS COMPLIANT, NI-880, CASE 465B-03, 2 PIN

MRF18090BR3规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称NXP(恩智浦)
包装说明FLANGE MOUNT, R-CDFM-F2
针数2
制造商包装代码CASE 465B-03
Reach Compliance Codeunknown
ECCN代码EAR99
外壳连接SOURCE
配置SINGLE
最小漏源击穿电压65 V
FET 技术METAL-OXIDE SEMICONDUCTOR
最高频带L BAND
JESD-30 代码R-CDFM-F2
元件数量1
端子数量2
工作模式ENHANCEMENT MODE
最高工作温度200 °C
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装形状RECTANGULAR
封装形式FLANGE MOUNT
峰值回流温度(摄氏度)NOT SPECIFIED
极性/信道类型N-CHANNEL
最大功率耗散 (Abs)250 W
认证状态Not Qualified
表面贴装YES
端子形式FLAT
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
晶体管应用AMPLIFIER
晶体管元件材料SILICON

文档预览

下载PDF文档
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Freescale Semiconductor, Inc.
Order this document
by MRF18090B/D
The RF MOSFET Line
RF Power Field Effect Transistors
Designed for GSM and EDGE base station applications with frequencies from
1.9 to 2.0 GHz. Suitable for FM, TDMA, CDMA and multicarrier amplifier
applications. To be used in class AB for GSM and EDGE cellular radio
applications.
GSM and EDGE Performances, Full Frequency Band
Power Gain — 13.5 dB (Typ) @ 90 Watts (CW)
Efficiency — 45% (Typ) @ 90 Watts (CW)
Internally Matched, Controlled Q, for Ease of Use
High Gain, High Efficiency and High Linearity
Integrated ESD Protection
Designed for Maximum Gain and Insertion Phase Flatness
Capable of Handling 10:1 VSWR, @ 26 Vdc, 90 Watts (CW) Output Power
Excellent Thermal Stability
Characterized with Series Equivalent Large - Signal Impedance Parameters
In Tape and Reel. R3 Suffix = 250 Units per 56 mm, 13 inch Reel.
N - Channel Enhancement - Mode Lateral MOSFETs
MRF18090BR3
MRF18090BSR3
1.90 - 1.99 GHz, 90 W, 26 V
LATERAL N - CHANNEL
RF POWER MOSFETS
Freescale Semiconductor, Inc...
CASE 465B - 03, STYLE 1
NI - 880
MRF18090BR3
CASE 465C - 02, STYLE 1
NI - 880S
MRF18090BSR3
MAXIMUM RATINGS
Rating
Drain - Source Voltage
Gate - Source Voltage
Total Device Dissipation @ T
C
= 25°C
Derate above 25°C
Storage Temperature Range
Operating Junction Temperature
Symbol
V
DSS
V
GS
P
D
T
stg
T
J
Value
65
- 0.5, +15
250
1.43
- 65 to +150
200
Unit
Vdc
Vdc
Watts
W/°C
°C
°C
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Case
Symbol
R
θJC
Value
0.7
Unit
°C/W
ESD PROTECTION CHARACTERISTICS
Test Conditions
Human Body Model
Machine Model
Class
2 (Minimum)
M3 (Minimum)
NOTE -
CAUTION
- MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and
packaging MOS devices should be observed.
REV 5
MOTOROLA RF
Motorola, Inc. 2004
DEVICE DATA
For More Information On This Product,
Go to: www.freescale.com
MRF18090BR3 MRF18090BSR3
1

MRF18090BR3相似产品对比

MRF18090BR3 MRF18090BSR3
描述 L BAND, Si, N-CHANNEL, RF POWER, MOSFET, ROHS COMPLIANT, NI-880, CASE 465B-03, 2 PIN L BAND, Si, N-CHANNEL, RF POWER, MOSFET, ROHS COMPLIANT, NI-880S, CASE 465C-03, 2 PIN
是否无铅 不含铅 不含铅
是否Rohs认证 符合 符合
厂商名称 NXP(恩智浦) NXP(恩智浦)
包装说明 FLANGE MOUNT, R-CDFM-F2 FLATPACK, R-CDFP-F2
针数 2 2
制造商包装代码 CASE 465B-03 CASE 465C-03
Reach Compliance Code unknown unknown
ECCN代码 EAR99 EAR99
外壳连接 SOURCE SOURCE
配置 SINGLE SINGLE
最小漏源击穿电压 65 V 65 V
FET 技术 METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
最高频带 L BAND L BAND
JESD-30 代码 R-CDFM-F2 R-CDFP-F2
元件数量 1 1
端子数量 2 2
工作模式 ENHANCEMENT MODE ENHANCEMENT MODE
最高工作温度 200 °C 200 °C
封装主体材料 CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
封装形状 RECTANGULAR RECTANGULAR
封装形式 FLANGE MOUNT FLATPACK
峰值回流温度(摄氏度) NOT SPECIFIED 260
极性/信道类型 N-CHANNEL N-CHANNEL
最大功率耗散 (Abs) 250 W 250 W
认证状态 Not Qualified Not Qualified
表面贴装 YES YES
端子形式 FLAT FLAT
端子位置 DUAL DUAL
处于峰值回流温度下的最长时间 NOT SPECIFIED 40
晶体管应用 AMPLIFIER AMPLIFIER
晶体管元件材料 SILICON SILICON

 
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