REVISIONS
LTR
B
C
DESCRIPTION
Redrawn with changes. Converted drawing to one part-one part number SMD
format. Corrected art work for Y and Z packages.
Redrawn with changes. Added devices 03 and 04. Changes to paragraph
4.2.1. Changes to table I and table IIA. Changed the max lead thickness on
case outline Z.
Added case outlines U and T. Made format changes, editorial changes
throughout.
Changes in accordance with NOR 5962-R198-95.
Changes in accordance with NOR 5962-R005-97.
Updated drawing to current requirements. Editorial changes throughout. - gap
Boilerplate update, part of 5 year review. ksr
Update drawing to current MIL-PRF-38535 requirements. - llb
DATE (YR-MO-DA)
92-11-16
93-09-10
APPROVED
M.A. Frye
M.A. Frye
D
E
F
G
H
J
94-01-27
95-10-05
96-10-04
01-11-09
07-04-27
15-11-18
M.A. Frye
M.A. Frye
Raymond Monnin
Raymond Monnin
Robert M. Heber
Charles Saffle
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
J
35
J
15
J
16
J
17
J
18
REV
SHEET
PREPARED BY
Kenneth Rice
J
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J
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J
1
J
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J
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J
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J
4
J
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J
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J
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J
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J
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STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
Rajesh Pithadia
APPROVED BY
Mike Frye
DRAWING APPROVAL DATE
91-11-08
REVISION LEVEL
J
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
http://www.landandmaritime.dla.mil
MICROCIRCUIT, MEMORY, DIGITAL, CMOS 9000
GATE PROGRAMMABLE LOGIC ARRAY,
MONOLITHIC SILICON
SIZE
A
CAGE CODE
AMSC N/A
67268
SHEET
1 OF 35
5962-89823
DSCC FORM 2233
APR 97
5962-E066-16
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device class Q and M)
and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or
Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN.
1.2 PIN. The PIN is as shown in the following example:
5962
-
89823
01
M
X
A
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
/
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are
marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
02
03
04
Generic number
3090-50
3090-70
3090-100
3090-125
Circuit function
16 x 20 9000 gate programmable array
16 x 20 9000 gate programmable array
16 x 20 9000 gate programmable array
16 x 20 9000 gate programmable array
Toggle Speed
50 MHz
70 MHz
100 MHz
125 MHz
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as
follows:
Device class
M
Device requirements documentation
Vendor self-certification to the requirements for MIL-STD-883 compliant, non-
JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A
Certification and qualification to MIL-PRF-38535
Q or V
1.2.4 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows:
Outline letter
X
Y
Z
U
T
Descriptive designator
CMGA8-PN
See figure 1
See figure 1
See figure 1
See figure 1
Terminals
175 1/
164
164
164
164
Package style
Pin grid array package
Quad flat package
Quad flat package
Quad flat package
Quad flat package
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
________
1/ 175 = actual number of pins used, not maximum listed in MIL-STD-1835
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-89823
SHEET
J
2
1.3 Absolute maximum ratings. 2/
Supply voltage range to ground potential (V
CC
) ............................
DC input voltage range.................................................................
Voltage applied to three-state output(V
TS
) ....................................
Lead temperature (soldering, 10 seconds) ................................
Thermal resistance, junction-to-case (θ
JC
):
Case outline X ........................................................................
Case outlines Y, Z, U, T .........................................................
Junction temperature (T
J
) .............................................................
Storage temperature range ..........................................................
-0.5 V dc to +7.0 V dc
-0.5 V dc to V
CC
+0.5 V dc
-0.5 V dc to V
CC
+0.5 V dc
+260°C
See MIL-STD-1835
20°C/W 3/
+150°C 4/
-65°C to +150°C
1.4 Recommended operating conditions. 5/
Case operating temperature Range(T
C
) ....................................... -55°C to +125°C
Supply voltage relative to ground(V
CC
) ......................................... +4.5 V dc minimum to +5.5 V dc maximum
Ground voltage (GND) ............................................................... 0 V dc
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 -
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at
http://quicksearch.dla.mil
or from the Standardization Document Order
Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Non-Government publications. The following document forms a part of this document to the extent specified herein.
Unless otherwise specified, the issues of the documents are the issues of the documents cited in the solicitation.
JEDEC – SOLID STATE TECHNOLOGY ASSOCIATION (JEDEC)
JESD 78
-
IC Latch-Up Test.
(Copies of these documents are available online at
http://www.jedec.org
or from JEDEC – Solid State Technology
Association, 3103 North 10th Street, Suite 240-S, Arlington, VA 22201-2107.)
(Non-Government standards and other publications are normally available from the organizations that prepare or distribute the
documents. These documents also may be available in or through libraries or other informational services.)
________
2/
Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
3/
When a thermal resistance for this case is specified in MIL-STD-1835 that value shall supersede the value indicated
herein.
4/
Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening conditions in
accordance with method 5004 of MIL-STD-883.
5/
All voltage values in this drawing are with respect to V
SS
.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-89823
SHEET
J
3
2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 as specified herein, or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for
device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified
herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Logic block diagram. The logic block diagram shall be as specified on figure 3.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full
case operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical
tests for each subgroup are defined in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer
has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be
marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be
in accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in
MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.
3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535
listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of
compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see
6.6.2 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of
supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-
PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for
device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.
3.8 Notification of change for device class M. For device class M, notification to DLA Land and Maritime-VA of change of
product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing.
3.9 Verification and review for device class M. For device class M, DLA Land and Maritime, DLA Land and Maritime’s agent,
and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore
documentation shall be made available onshore at the option of the reviewer.
3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in
microcircuit group number 042 (see MIL-PRF-38535, appendix A).
3.11 Operational notes. Additional information shall be provided by the device manufacturer (see 6.6 herein).
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-89823
SHEET
J
4
TABLE I. Electrical performance characteristics.
Test
Symbol
Conditions
4.5 V
≤
V
CC
≤
5.5 V
-55°C
≤
T
C
≤
+125°C
unless otherwise specified
V
CC
= 4.5 V, V
IL
= 0.8V
I
OH
= -4.0 mA, V
IH
= 2.0 V
V
CC
= 4.5 V and 5.5 V
V
IL
= 0.9 V and 1.1 V
V
IH
= 3.5 V and 3.85 V
I
OH
= -4.0 mA
Group A
subgroups
Device
type
Min
Limits
Unit
Max
V
High level output voltage
V
OH
1, 2, 3
All
3.7
Low level output voltage
V
OL
V
CC
= 5.5 V, I
OL
= 4.0V
V
IL
= 0.8 V, V
IH
= 2.0 V
V
CC
= 4.5 V and 5.5 V
V
IL
= 0.9 V and 1.1 V
V
IH
= 3.5 V and 3.85 V
I
OH
= 4.0 mA
1, 2, 3
All
0.4
V
Operating power supply
current
I
CC
V
CC
= 5.5 V 1/
1, 2, 3
01
02
03
04
245
250
260
270
3.0
15
2.5
-20
-20
20
20
2.5
2.0
0.8
0.7 V
CC
0.2 V
CC
3.5
mA
Quiescent power supply
current
Quiescent power supply
current
Power-down supply
current
Input leakage current
Output leakage current
Horizontal long line,
pull-up current
High level input voltage
Low level input voltage
High level input voltage
Low level input voltage
I
CCO
I
CCO
I
CCPD
I
IL
I
OL
I
RLL
V
IHT
V
ILT
V
IHC
V
ILC
V
PD
CMOS inputs,
V
CC
= V
IN
= 5.5 V
TTL inputs,
V
CC
= V
IN
= 5.5 V
PWR DWN = 0.0 V,
V
CC
= V
IN
= 5.5 V
V
CC
= 5.5 V, V
IN
= 0 V
and 5.5 V
V
CC
= 5.5 V, V
IN
= 0 V
and 5.5 V
V
CC
= 5.5 V, V
IN
= 0 V
and 5.5 V
TTL inputs
TTL inputs
CMOS inputs
CMOS inputs
PWR DWN = 0.0 V
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
All
All
All
All
All
All
All
All
All
All
All
mA
mA
mA
µA
µA
mA
V
V
V
V
V
Power down (
PWR DWN
)
voltage 2/
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-89823
SHEET
J
5
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