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IDT72V15160L10BBI

产品描述FIFO, 4KX16, 6.5ns, Synchronous/Asynchronous, CMOS, PBGA144
产品类别存储    存储   
文件大小236KB,共26页
制造商IDT (Integrated Device Technology)
下载文档 详细参数 选型对比 全文预览

IDT72V15160L10BBI概述

FIFO, 4KX16, 6.5ns, Synchronous/Asynchronous, CMOS, PBGA144

IDT72V15160L10BBI规格参数

参数名称属性值
是否Rohs认证不符合
Reach Compliance Code_compli
最长访问时间6.5 ns
最大时钟频率 (fCLK)100 MHz
JESD-30 代码S-PBGA-B144
JESD-609代码e0
内存密度65536 bi
内存集成电路类型OTHER FIFO
内存宽度16
湿度敏感等级3
端子数量144
字数4096 words
字数代码4000
工作模式SYNCHRONOUS/ASYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织4KX16
封装主体材料PLASTIC/EPOXY
封装代码BGA
封装等效代码BGA144,12X12,40
封装形状SQUARE
封装形式GRID ARRAY
电源3.3 V
认证状态Not Qualified
最大待机电流0.015 A
最大压摆率0.04 mA
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层Tin/Lead (Sn63Pb37)
端子形式BALL
端子节距1 mm
端子位置BOTTOM
Base Number Matches1

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3.3V MULTI-MEDIA FIFO
16 BIT V-III, 32 BIT Vx-III FAMILY
UP TO 1 Mb DENSITY
IDT72V15160
IDT72V16160
IDT72V17160
IDT72V18160
IDT72V19160
PRELIMINARY
IDT72V14320
IDT72V15320
IDT72V16320
IDT72V17320
IDT72V18320
IDT72V19320
FEATURES:
Choose among the following memory organizations: Commercial
V-III
Vx-III
IDT72V15160 - 4,096 x 16
IDT72V16160 - 8,192 x 16
IDT72V17160 - 16,384 x 16
IDT72V18160 - 32,768 x 16
IDT72V19160 - 65,536 x 16
IDT72V14320 - 1,024 x 32
IDT72V15320 - 2,048 x 32
IDT72V16320 - 4,096 x 32
IDT72V17320 - 8,192 x 32
IDT72V18320 - 16,384 x 32
IDT72V19320 - 32,768 x 32
Up to 100 MHz Operation of the Clocks
5V input tolerant
Auto power down minimizes standby power consumption
Master Reset clears entire FIFO
Partial Reset clears data, but retains programmable settings
Empty, Full and Half-Full flags signal FIFO status
Programmable Almost-Empty and Almost-Full flags, each flag can
default to one of eight preselected offsets
Program programmable flags through serial input
Output enable puts data outputs into high impedance state
JTAG port, provided for Boundary Scan function (PBGA Only)
Available in a 80-pin (V-III) Thin Quad Flat Pack, 128-pin(Vx-III)
Thin Quad Flat Pack (TQFP) or a 144-pin (Vx-III) Plastic Ball Grid
Array (PBGA) (with additional features)
Industrial temperature range (–40°C to +85°C)
°
°
High-performance submicron CMOS technology
FUNCTIONAL BLOCK DIAGRAM
*
Available on the Vx-III PBGA package only.
MRS
WCLK
WEN
PRS
RCLK
REN
OE
D0 - Dn
Data In
x16, x32
FIFO ARRAY
Q0 - Qn
Data Out
x16, x32
WRITE
CONTROL
RESET LOGIC
READ
CONTROL
*
*
**
*
TCK
TRST
TMS
TDI
TDO
JTAG CONTROL
(BOUNDARY
SCAN)
*
LD
SEN
SI
PFM
FLAG LOGIC
FSEL1
EF
FSEL0
HF
PAE
FF
PAF
6163 drw01
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
INDUSTRIAL TEMPERATURE RANGE
1
2003 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.
APRIL 2003
DSC-6163/-

IDT72V15160L10BBI相似产品对比

IDT72V15160L10BBI 72V15160L10BBI IDT72V16160L10BBI 72V16160L10BBI 72V17160L10BBI IDT72V17160L10BBI 72V19160L10BBI IDT72V19160L10BBI IDT72V18160L10BBI
描述 FIFO, 4KX16, 6.5ns, Synchronous/Asynchronous, CMOS, PBGA144 FIFO, 4KX16, 6.5ns, Synchronous/Asynchronous, CMOS, PBGA144 FIFO, 8KX16, 6.5ns, Synchronous/Asynchronous, CMOS, PBGA144 FIFO, 8KX16, 6.5ns, Synchronous/Asynchronous, CMOS, PBGA144 FIFO, 16KX16, 6.5ns, Synchronous/Asynchronous, CMOS, PBGA144 FIFO, 16KX16, 6.5ns, Synchronous/Asynchronous, CMOS, PBGA144 FIFO, 64KX16, 6.5ns, Synchronous/Asynchronous, CMOS, PBGA144 FIFO, 64KX16, 6.5ns, Synchronous/Asynchronous, CMOS, PBGA144 FIFO, 32KX16, 6.5ns, Synchronous/Asynchronous, CMOS, PBGA144
是否Rohs认证 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合
Reach Compliance Code _compli _compli _compli _compli _compli _compli _compli _compli not_compliant
最长访问时间 6.5 ns 6.5 ns 6.5 ns 6.5 ns 6.5 ns 6.5 ns 6.5 ns 6.5 ns 6.5 ns
最大时钟频率 (fCLK) 100 MHz 100 MHz 100 MHz 100 MHz 100 MHz 100 MHz 100 MHz 100 MHz 100 MHz
JESD-30 代码 S-PBGA-B144 S-PBGA-B144 S-PBGA-B144 S-PBGA-B144 S-PBGA-B144 S-PBGA-B144 S-PBGA-B144 S-PBGA-B144 S-PBGA-B144
JESD-609代码 e0 e0 e0 e0 e0 e0 e0 e0 e0
内存密度 65536 bi 65536 bi 131072 bi 131072 bi 262144 bi 262144 bi 1048576 bi 1048576 bi 524288 bit
内存集成电路类型 OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO
内存宽度 16 16 16 16 16 16 16 16 16
湿度敏感等级 3 3 3 3 3 3 3 3 3
端子数量 144 144 144 144 144 144 144 144 144
字数 4096 words 4096 words 8192 words 8192 words 16384 words 16384 words 65536 words 65536 words 32768 words
字数代码 4000 4000 8000 8000 16000 16000 64000 64000 32000
工作模式 SYNCHRONOUS/ASYNCHRONOUS SYNCHRONOUS/ASYNCHRONOUS SYNCHRONOUS/ASYNCHRONOUS SYNCHRONOUS/ASYNCHRONOUS SYNCHRONOUS/ASYNCHRONOUS SYNCHRONOUS/ASYNCHRONOUS SYNCHRONOUS/ASYNCHRONOUS SYNCHRONOUS/ASYNCHRONOUS SYNCHRONOUS/ASYNCHRONOUS
最高工作温度 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
组织 4KX16 4KX16 8KX16 8KX16 16KX16 16KX16 64KX16 64KX16 32KX16
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 BGA BGA BGA BGA BGA BGA BGA BGA BGA
封装等效代码 BGA144,12X12,40 BGA144,12X12,40 BGA144,12X12,40 BGA144,12X12,40 BGA144,12X12,40 BGA144,12X12,40 BGA144,12X12,40 BGA144,12X12,40 BGA144,12X12,40
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
电源 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
最大待机电流 0.015 A 0.015 A 0.015 A 0.015 A 0.015 A 0.015 A 0.015 A 0.015 A 0.015 A
最大压摆率 0.04 mA 0.04 mA 0.04 mA 0.04 mA 0.04 mA 0.04 mA 0.04 mA 0.04 mA 0.04 mA
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子面层 Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37)
端子形式 BALL BALL BALL BALL BALL BALL BALL BALL BALL
端子节距 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
Base Number Matches 1 1 1 1 1 1 1 1 -

 
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