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72T18115L5BBGI

产品描述FIFO, 256KX18, 3.6ns, Synchronous, CMOS, PBGA240, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-240
产品类别存储    存储   
文件大小375KB,共56页
制造商IDT (Integrated Device Technology)
标准  
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72T18115L5BBGI概述

FIFO, 256KX18, 3.6ns, Synchronous, CMOS, PBGA240, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-240

72T18115L5BBGI规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称IDT (Integrated Device Technology)
零件包装代码BGA
包装说明BGA, BGA240,18X18,40
针数240
Reach Compliance Codecompliant
ECCN代码EAR99
最长访问时间3.6 ns
其他特性ALTERNATIVE MEMORY WIDTH 9; ASYNCHRONOUS OPERATION ALSO POSSIBLE
备用内存宽度9
最大时钟频率 (fCLK)83 MHz
周期时间5 ns
JESD-30 代码S-PBGA-B240
JESD-609代码e1
长度19 mm
内存密度4718592 bit
内存集成电路类型OTHER FIFO
内存宽度18
湿度敏感等级3
功能数量1
端子数量240
字数262144 words
字数代码256000
工作模式SYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织256KX18
可输出YES
封装主体材料PLASTIC/EPOXY
封装代码BGA
封装等效代码BGA240,18X18,40
封装形状SQUARE
封装形式GRID ARRAY
并行/串行PARALLEL
峰值回流温度(摄氏度)260
电源2.5 V
认证状态Not Qualified
座面最大高度1.97 mm
最大待机电流0.06 A
最大压摆率0.07 mA
最大供电电压 (Vsup)2.625 V
最小供电电压 (Vsup)2.375 V
标称供电电压 (Vsup)2.5 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层Tin/Silver/Copper (Sn/Ag/Cu)
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间30
宽度19 mm

文档预览

下载PDF文档
2.5 VOLT HIGH-SPEED TeraSync™ FIFO
18-BIT/9-BIT CONFIGURATIONS
2,048 x 18/4,096 x 9, 4,096 x 18/8,192 x 9, 8,192 x 18/16,384 x 9,
16,384 x 18/32,768 x 9, 32,768 x 18/65,536 x 9, 65,536 x 18/131,072 x 9,
131,072 x 18/262,144 x 9, 262,144 x 18/524,288 x 9, 524,288 x 18/1,048,576 x 9
*IDT72T1845,
*IDT72T1865,
*IDT72T1885,
IDT72T18105,
*IDT72T1855
*IDT72T1875
*IDT72T1895
IDT72T18115
IDT72T18125
*SPECIFIED PRODUCTS ARE EOL - LAST TIME BUY EXPIRES MAY 26, 2018
FEATURES:
Choose among the following memory organizations:
IDT72T1845
2,048 x 18/4,096 x 9
IDT72T1855
4,096 x 18/8,192 x 9
IDT72T1865
8,192 x 18/16,384 x 9
IDT72T1875
16,384 x 18/32,768 x 9
IDT72T1885
32,768 x 18/65,536 x 9
IDT72T1895
65,536 x 18/131,072 x 9
IDT72T18105
131,072 x 18/262,144 x 9
IDT72T18115
262,144 x 18/524,288 x 9
IDT72T18125
524,288 x 18/1,048,576 x 9
Up to 225 MHz Operation of Clocks
User selectable HSTL/LVTTL Input and/or Output
Read Enable & Read Clock Echo outputs aid high speed operation
User selectable Asynchronous read and/or write port timing
2.5V LVTTL or 1.8V, 1.5V HSTL Port Selectable Input/Ouput voltage
3.3V Input tolerant
Mark & Retransmit, resets read pointer to user marked position
Write Chip Select (WCS) input enables/disables Write operations
Read Chip Select (RCS) synchronous to RCLK
Programmable Almost-Empty and Almost-Full flags, each flag can
default to one of eight preselected offsets
Program programmable flags by either serial or parallel means
Selectable synchronous/asynchronous timing modes for Almost-
Empty and Almost-Full flags
Separate SCLK input for Serial programming of flag offsets
User selectable input and output port bus-sizing
- x9 in to x9 out
- x9 in to x18 out
- x18 in to x9 out
- x18 in to x18 out
Big-Endian/Little-Endian user selectable byte representation
Auto power down minimizes standby power consumption
Master Reset clears entire FIFO
Partial Reset clears data, but retains programmable settings
Empty, Full and Half-Full flags signal FIFO status
Select IDT Standard timing (using
EF
and
FF
flags) or First Word
Fall Through timing (using
OR
and
IR
flags)
Output enable puts data outputs into high impedance state
JTAG port, provided for Boundary Scan function
Available in 144-pin (13mm x 13mm) or 240-pin (19mm x 19mm)
PlasticBall Grid Array (PBGA)
Easily expandable in depth and width
Independent Read and Write Clocks (permit reading and writing
simultaneously)
High-performance submicron CMOS technology
Industrial temperature range (–40°C to +85°C) is available
°
°
Green parts are available, see ordering information
For IDT72T1845/55/65/75/85/95 functional replacement device use
IDT72T18125
FUNCTIONAL BLOCK DIAGRAM
WEN
WCLK/WR
WCS
D
0
-D
n
(x18 or x9)
LD
SEN
SCLK
INPUT REGISTER
OFFSET REGISTER
FF/IR
PAF
EF/OR
PAE
HF
FWFT/SI
PFM
FSEL0
FSEL1
ASYW
WRITE CONTROL
LOGIC
RAM ARRAY
2,048 x 18 or 4,096 x 9
4,096 x 18 or 8,192 x 9
8,192 x 18 or 16,384 x 9
16,384 x 18 or 32,768 x 9
32,768 x 18 or 65,536 x 9
65,536 x 18 or 131,072 x 9
131,072 x 18 or 262,144 x 9
262,144 x 18 or 524,288 x 9
524,288 x 18 or 1,048,576 x 9
FLAG
LOGIC
WRITE POINTER
BE
IP
IW
OW
MRS
PRS
TCK
TRST
TMS
TDO
TDI
Vref
WHSTL
RHSTL
SHSTL
CONTROL
LOGIC
BUS
CONFIGURATION
RESET
LOGIC
READ POINTER
OUTPUT REGISTER
READ
CONTROL
LOGIC
RT
MARK
ASYR
JTAG CONTROL
(BOUNDARY SCAN)
RCLK/RD
REN
RCS
HSTL I/0
CONTROL
OE
EREN
5909 drw01
Q
0
-Q
n
(x18 or x9)
ERCLK
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc. TeraSync FIFO is a trademark of Integrated Device Technology, Inc.
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
1
©
2017 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.
MAY 2017
DSC-5909/20

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是否无铅 不含铅 不含铅 不含铅 不含铅
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
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