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MAX3001EAUP/V+T

产品描述Interface Circuit, BICMOS, PDSO20, TSSOP-20
产品类别模拟混合信号IC    驱动程序和接口   
文件大小971KB,共25页
制造商Maxim(美信半导体)
官网地址https://www.maximintegrated.com/en.html
标准
下载文档 详细参数 选型对比 全文预览

MAX3001EAUP/V+T概述

Interface Circuit, BICMOS, PDSO20, TSSOP-20

MAX3001EAUP/V+T规格参数

参数名称属性值
是否Rohs认证符合
厂商名称Maxim(美信半导体)
包装说明TSSOP,
Reach Compliance Codecompliant
接口集成电路类型INTERFACE CIRCUIT
JESD-30 代码R-PDSO-G20
长度6.5 mm
功能数量1
端子数量20
最高工作温度125 °C
最低工作温度-40 °C
封装主体材料PLASTIC/EPOXY
封装代码TSSOP
封装形状RECTANGULAR
封装形式SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
筛选级别AEC-Q100
座面最大高度1.1 mm
最大供电电压5.5 V
最小供电电压1.2 V
电源电压1-最大5.5 V
电源电压1-分钟1.65 V
表面贴装YES
技术BICMOS
温度等级AUTOMOTIVE
端子形式GULL WING
端子节距0.65 mm
端子位置DUAL
宽度4.4 mm

文档预览

下载PDF文档
MAX3000E/MAX3001E/
LE
MAX3002–MAX3012
AVAILAB
+1.2V to +5.5V, ±15kV ESD-Protected, 0.1µA,
35Mbps, 8-Channel Level Translators
General Description
The MAX3000E/MAX3001E/MAX3002–MAX3012
8-channel level translators provide the level shifting nec-
essary to allow data transfer in a multivoltage system.
Externally applied voltages, V
CC
and V
L
, set the logic lev-
els on either side of the device. Logic signals present on
the V
L
side of the device appear as a higher voltage logic
signal on the V
CC
side of the device, and vice-versa.
The MAX3000E/MAX3001E/MAX3002/MAX3003 use an
architecture specifically designed to be bidirectional
without the use of a directional pin.
The MAX3000E/MAX3001E/MAX3002/MAX3004–MAX3012
feature an EN input that, when low, reduces the V
CC
and
V
L
supply currents to < 2µA. The MAX3000E/MAX3001E
also have ±15kV ESD protection on the I/O V
CC
side for
greater protection in applications that route signals
externally. The MAX3000E operates at a guaranteed data
rate of 230kbps. The MAX3001E operates at a guaranteed
data rate of 4Mbps. The MAX3002–MAX3012 operate at a
guaranteed data rate of 20Mbps over the entire specified
operating voltage range.
The MAX3000E/MAX3001E/MAX3002–MAX3012 accept
V
L
voltages from +1.2V to +5.5V and V
CC
voltages from
+1.65V to +5.5V, making them ideal for data transfer
between low-voltage ASICs/PLDs and higher voltage
systems. The MAX3000E/MAX3001E/MAX3002–
MAX3012 are available in 20-bump UCSP™, 20-pin
TQFN (5mm x 5mm), and 20-pin TSSOP packages.
Features
Guaranteed Data Rate Options
230kbps (MAX3000E)
4Mbps (MAX3001E)
20Mbps (MAX3002–MAX3012)
Bidirectional Level Translation Without Using a
Directional Pin (MAX3000E/MAX3001E/MAX3002/
MAX3003)
Unidirectional Level Translation
(MAX3004–MAX3012)
Operation Down to +1.2V on V
L
±15kV ESD Protection on I/O V
CC
Lines
(MAX3000E/MAX3001E)
Ultra-Low 0.1µA Supply Current in Shutdown
Low Quiescent Current (< 10µA)
UCSP, TQFN, and TSSOP Packages
Ordering Information
PART
MAX3000EEUP
MAX3000EEBP-T
TEMP RANGE
-40°C to +85°C
-40°C to +85°C
PIN-PACKAGE
20 TSSOP
4 x 5 UCSP
Ordering Information continued at end of data sheet.
Note:
All devices operate over the -40°C to +85°C operating
temperature range.
Applications
Functional Diagrams
CMOS Logic-Level Translation
Cellphones
SPI™ and MICROWIRE™ Level Translation
Low-Voltage ASIC Level Translation
Smart Card Readers
Cellphone Cradles
Portable POS Systems
Portable Communication Devices
Low-Cost Serial Interfaces
GPS
DATA
+1.8V
SYSTEM
CONTROLLER
+1.8V
Typical Operating Circuit
+3.3V
V
L
EN
V
CC
MAX3000E
MAX3001E
MAX3002–
MAX3012
I/O V
CC_
+3.3V
SYSTEM
Telecommunications Equipment
UCSP is a trademark of Maxim Integrated Products, Inc.
SPI is a trademark of Motorola, Inc.
Pin Configurations appear at end of data sheet.
MICROWIRE is a trademark of National Semiconductor.
Functional Diagrams continued at end of data sheet.
UCSP is a trademark of Maxim Integrated Products, Inc.
I/O V
L_
DATA
GND
Pin Configurations and Functional Diagrams appear at end
of data sheet.
For pricing, delivery, and ordering information, please contact Maxim Direct
at 1-888-629-4642, or visit Maxim’s website at www.maximintegrated.com.
19-2672; Rev 5; 8/08

MAX3001EAUP/V+T相似产品对比

MAX3001EAUP/V+T MAX3001EAUP/V+
描述 Interface Circuit, BICMOS, PDSO20, TSSOP-20 Interface Circuit, BICMOS, PDSO20, TSSOP-20
是否Rohs认证 符合 符合
厂商名称 Maxim(美信半导体) Maxim(美信半导体)
包装说明 TSSOP, TSSOP,
Reach Compliance Code compliant compliant
接口集成电路类型 INTERFACE CIRCUIT INTERFACE CIRCUIT
JESD-30 代码 R-PDSO-G20 R-PDSO-G20
长度 6.5 mm 6.5 mm
功能数量 1 1
端子数量 20 20
最高工作温度 125 °C 125 °C
最低工作温度 -40 °C -40 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TSSOP TSSOP
封装形状 RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
筛选级别 AEC-Q100 AEC-Q100
座面最大高度 1.1 mm 1.1 mm
最大供电电压 5.5 V 5.5 V
最小供电电压 1.2 V 1.2 V
电源电压1-最大 5.5 V 5.5 V
电源电压1-分钟 1.65 V 1.65 V
表面贴装 YES YES
技术 BICMOS BICMOS
温度等级 AUTOMOTIVE AUTOMOTIVE
端子形式 GULL WING GULL WING
端子节距 0.65 mm 0.65 mm
端子位置 DUAL DUAL
宽度 4.4 mm 4.4 mm
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