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ISD4002-180ZD

产品描述Speech Synthesizer With RCDG, 180s, CMOS, PBGA19, CSP-19
产品类别模拟混合信号IC    消费电路   
文件大小1MB,共31页
制造商Winbond(华邦电子)
官网地址http://www.winbond.com.tw
下载文档 详细参数 选型对比 全文预览

ISD4002-180ZD概述

Speech Synthesizer With RCDG, 180s, CMOS, PBGA19, CSP-19

ISD4002-180ZD规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称Winbond(华邦电子)
零件包装代码BGA
包装说明CSP-19
针数19
Reach Compliance Codenot_compliant
商用集成电路类型SPEECH SYNTHESIZER WITH RCDG
JESD-30 代码R-PBGA-B19
JESD-609代码e0
长度6.1 mm
功能数量1
端子数量19
最高工作温度70 °C
最低工作温度-20 °C
封装主体材料PLASTIC/EPOXY
封装代码VFBGA
封装等效代码BGA19,4X5,30
封装形状RECTANGULAR
封装形式GRID ARRAY, VERY THIN PROFILE, FINE PITCH
峰值回流温度(摄氏度)NOT SPECIFIED
电源3 V
认证状态Not Qualified
最长读取时间180 s
座面最大高度0.85 mm
最大压摆率40 mA
最大供电电压 (Vsup)3.3 V
最小供电电压 (Vsup)2.7 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Lead (Sn/Pb)
端子形式BALL
端子节距0.75 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度4.7 mm

文档预览

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ISD4002 Series
Single-Chip Voice Record/Playback Devices
120-, 150-, 180-, and 240-Second Durations
GENERAL DESCRIPTION
The ISD4002 ChipCorder
®
products provide high-
quality, 3-volt, single-chip record/playback solu-
tions for 2- to 4-minute messaging applications
ideal for cellular phones and other portable prod-
ucts. The CMOS-based devices include an on-
chip oscillator, anti-aliasing filter, smoothing filter,
AutoMute™ feature, audio amplifier, and high
density, multilevel Flash storage array. The
ISD4002 series is designed to be used in a micro-
processor- or microcontroller-based system.
Address and control are accomplished through a
Serial Peripheral Interface (SPI) or Microwire Serial
Interface to minimize pin count.
Recordings are stored in on-chip nonvolatile
memory cells, providing zero-power message
storage. This unique, single-chip solution is made
possible through ISD’s patented multilevel storage
technology. Voice and audio signals are stored
directly into solid-state memory in their natural
form, providing high-quality voice reproduction.
Figure: ISD4002 Series Block Diagram
June 2000
ISD/Winbond · 2727 North First Street, San Jose, CA 95134 · TEL: 408/943-6666 · FAX: 408/544-1787 · http://www.isd.com

ISD4002-180ZD相似产品对比

ISD4002-180ZD ISD4002-150ZD ISD4002-120ZD ISD4002-240ZD
描述 Speech Synthesizer With RCDG, 180s, CMOS, PBGA19, CSP-19 Speech Synthesizer With RCDG, 150s, CMOS, PBGA19, CSP-19 Speech Synthesizer With RCDG, 120s, CMOS, PBGA19, CSP-19 Speech Synthesizer With RCDG, 240s, CMOS, PBGA19, CSP-19
是否Rohs认证 不符合 不符合 不符合 不符合
零件包装代码 BGA BGA BGA BGA
包装说明 CSP-19 CSP-19 CSP-19 CSP-19
针数 19 19 19 19
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant
商用集成电路类型 SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG
JESD-30 代码 R-PBGA-B19 R-PBGA-B19 R-PBGA-B19 R-PBGA-B19
JESD-609代码 e0 e0 e0 e0
长度 6.1 mm 6.1 mm 6.1 mm 6.1 mm
功能数量 1 1 1 1
端子数量 19 19 19 19
最高工作温度 70 °C 70 °C 70 °C 70 °C
最低工作温度 -20 °C -20 °C -20 °C -20 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 VFBGA VFBGA VFBGA VFBGA
封装等效代码 BGA19,4X5,30 BGA19,4X5,30 BGA19,4X5,30 BGA19,4X5,30
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
电源 3 V 3 V 3 V 3 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified
最长读取时间 180 s 150 s 120 s 240 s
座面最大高度 0.85 mm 0.85 mm 0.85 mm 0.85 mm
最大压摆率 40 mA 40 mA 40 mA 40 mA
最大供电电压 (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V
最小供电电压 (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V
表面贴装 YES YES YES YES
技术 CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 BALL BALL BALL BALL
端子节距 0.75 mm 0.75 mm 0.75 mm 0.75 mm
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
宽度 4.7 mm 4.7 mm 4.7 mm 4.7 mm
厂商名称 Winbond(华邦电子) - Winbond(华邦电子) Winbond(华邦电子)

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