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BCL4516BC: 产品描述Binary Counter, Synchronous, Bidirectional, CMOS, CDIP16; 产品类别逻辑逻辑; 文件大小223KB，共4页; 制造商Solid State Scientific Inc

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BCL4516BC概述

Binary Counter, Synchronous, Bidirectional, CMOS, CDIP16

BCL4516BC规格参数

参数名称	属性值
是否Rohs认证	不符合
厂商名称	Solid State Scientific Inc
包装说明	DIP, DIP16,.3
Reach Compliance Code	unknown
计数方向	BIDIRECTIONAL
JESD-30 代码	R-XDIP-T16
JESD-609代码	e0
负载/预设输入	YES
逻辑集成电路类型	BINARY COUNTER
工作模式	SYNCHRONOUS
功能数量	1
端子数量	16
最高工作温度	125 °C
最低工作温度	-55 °C
封装主体材料	CERAMIC
封装代码	DIP
封装等效代码	DIP16,.3
封装形状	RECTANGULAR
封装形式	IN-LINE
电源	5/15 V
认证状态	Not Qualified
筛选级别	38535Q/M;38534H;883B
表面贴装	NO
技术	CMOS
温度等级	MILITARY
端子面层	Tin/Lead (Sn/Pb)
端子形式	THROUGH-HOLE
端子节距	2.54 mm
端子位置	DUAL

BCL4516BC相似产品对比

	BCL4516BC	SCL4516BC+	BCL4516BH	BCL4516BD	SCL4516BE	SCL4516BE+	SCL4516BE++	883/4516BF
描述	Binary Counter, Synchronous, Bidirectional, CMOS, CDIP16	Binary Counter, Synchronous, Bidirectional, CMOS, CDIP16	Binary Counter, Synchronous, Bidirectional, CMOS	Binary Counter, Synchronous, Bidirectional, CMOS, CDIP16	Binary Counter, Synchronous, Bidirectional, CMOS, PDIP16	Binary Counter, Synchronous, Bidirectional, CMOS, PDIP16	Binary Counter, Synchronous, Bidirectional, CMOS, PDIP16	Binary Counter, Synchronous, Bidirectional, CMOS, CDFP16
包装说明	DIP, DIP16,.3	DIP, DIP16,.3	, DIE OR CHIP	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DFP, FL16,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
计数方向	BIDIRECTIONAL	BIDIRECTIONAL	BIDIRECTIONAL	BIDIRECTIONAL	BIDIRECTIONAL	BIDIRECTIONAL	BIDIRECTIONAL	BIDIRECTIONAL
负载/预设输入	YES	YES	YES	YES	YES	YES	YES	YES
逻辑集成电路类型	BINARY COUNTER	BINARY COUNTER	BINARY COUNTER	BINARY COUNTER	BINARY COUNTER	BINARY COUNTER	BINARY COUNTER	BINARY COUNTER
工作模式	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
功能数量	1	1	1	1	1	1	1	1
最高工作温度	125 °C	125 °C	125 °C	125 °C	85 °C	85 °C	85 °C	125 °C
最低工作温度	-55 °C	-55 °C	-55 °C	-55 °C	-40 °C	-40 °C	-40 °C	-55 °C
封装等效代码	DIP16,.3	DIP16,.3	DIE OR CHIP	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	FL16,.3
电源	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	MILITARY	MILITARY	MILITARY	MILITARY	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	MILITARY
是否Rohs认证	不符合	不符合	-	不符合	不符合	不符合	不符合	不符合
厂商名称	Solid State Scientific Inc	-	Solid State Scientific Inc	Solid State Scientific Inc	Solid State Scientific Inc	Solid State Scientific Inc	Solid State Scientific Inc	Solid State Scientific Inc
JESD-30 代码	R-XDIP-T16	R-XDIP-T16	-	R-XDIP-T16	R-PDIP-T16	R-PDIP-T16	R-PDIP-T16	R-XDFP-F16
JESD-609代码	e0	e0	-	e0	e0	e0	e0	e0
端子数量	16	16	-	16	16	16	16	16
封装主体材料	CERAMIC	CERAMIC	-	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC
封装代码	DIP	DIP	-	DIP	DIP	DIP	DIP	DFP
封装形状	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	IN-LINE	IN-LINE	-	IN-LINE	IN-LINE	IN-LINE	IN-LINE	FLATPACK
认证状态	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	-	-	Not Qualified
表面贴装	NO	NO	-	NO	NO	NO	NO	YES
端子面层	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
端子形式	THROUGH-HOLE	THROUGH-HOLE	-	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	FLAT
端子节距	2.54 mm	2.54 mm	-	2.54 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm
端子位置	DUAL	DUAL	-	DUAL	DUAL	DUAL	DUAL	DUAL

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