4N55, 5962-87679, HCPL-553x, HCPL-653x,
HCPL-257K, HCPL-655x, 5962-90854,
HCPL-550x
1
Hermetically Sealed, Transistor Output Optocouplers
for Analog and Digital Applications
Data Sheet
Description
These units are single-, dual-, and quad-channel, hermetically
sealed optocouplers. The products are capable of operation
and storage over the full military temperature range and can
be purchased as either Commercial product or with full
MIL-PRF-38534 Class Level H or K testing or from the
appropriate DLA Standard Microcircuit Drawing (SMD). All
devices are manufactured and tested on a MIL-PRF-38534
certified line and Class H and K devices are included in the DLA
Qualified Manufacturers List QML-38534 for Hybrid
Microcircuits.
CAUTION
It is advised that normal static precautions be
taken in handling and assembly of this
component to prevent damage and/or
degradation which may be induced by ESD.
Features
Dual marked with device part number and DLA Standard
Microcircuit Drawing (SMD)
Manufactured and tested on a MIL-PRF-38534 Certified
Line
QML-38534, Class H and K
Five hermetically sealed package configurations
Performance guaranteed over full military temperature
range: –55°C to +125°C
High speed: 400 kb/s typical
9-MHz bandwidth
Open collector output
V
CC
ranges from 2V to 18V
1500 VDC withstand test voltage
High radiation immunity
6N135, 6N136, HCPL-2530/2531 function compatibility
Reliability data
Applications
Military and aerospace
High reliability systems
Vehicle command, control, life critical systems
Line receiver
Switching power supply
Voltage level shifting
Analog signal ground isolation (see Figures
7, 8,
and
13)
Isolated input line receiver
Isolated output line driver
Logic ground isolation
Harsh industrial environments
Isolation for test equipment systems
1.
See the
Selection Guide – Package Styles and Lead
Configuration Options
table for available extensions.
Broadcom
-1-
4N55, 5962-87679, HCPL-553x, HCPL-653x, HCPL-257K, HCPL-655x, 5962-90854, HCPL-550x
Data Sheet
Functional Diagram
V
CC
V
B
V
O
Each channel contains a GaAsP light emitting diode that is
optically coupled to an integrated photon detector. Separate
connections for the photodiodes and output transistor
collectors improve the speed up to one-hundred times that of
a conventional phototransistor optocoupler by reducing the
base-collector capacitance.
These devices are suitable for wide-bandwidth analog
applications, as well as for interfacing TTL to LSTTL or CMOS.
Current Transfer Ratio (CTR) is 9% minimum at I
F
= 16 mA. The
18V V
CC
capability enables the designer to interface any TTL
family to CMOS. The availability of the base lead allows
optimized gain/bandwidth adjustment in analog applications.
The shallow depth of the IC photodiode provides better
radiation immunity than conventional phototransistor
couplers.
Package styles for these parts are 8- and 16-pin DIP
through-hole (case outlines P and E, respectively), 16-pin DIP
flat pack (case outline F), and leadless ceramic chip carrier (case
outline 2). Devices may be purchased with a variety of lead
bend and plating options, see the selection guide table for
details. Standard Microcircuit Drawing (SMD) parts are
available for each package and lead style.
Because the same functional die (emitters and detectors) are
used for each channel of each device listed in this data sheet,
absolute maximum ratings, recommended operating
conditions, electrical specifications, and performance
characteristics shown in the figures are identical for all parts.
Occasional exceptions exist due to package variations and
limitations and are as noted. Additionally, the same package
assembly processes and materials are used in all devices. These
similarities give justification for the use of data obtained from
one part to represent other part’s performance for die related
reliability and certain limited radiation test results.
GND
Multiple channel devices available.
Truth Table
(Positive Logic)
Input
On (H)
Off (L)
Output
L
H
NOTE
The connection of a 0.1 μF bypass capacitor
between V
CC
and GND is recommended.
Broadcom
-2-
4N55, 5962-87679, HCPL-553x, HCPL-653x, HCPL-257K, HCPL-655x, 5962-90854, HCPL-550x
Data Sheet
Selection Guide – Package Styles and Lead Configuration Options
Package
Lead Style
Channels
Common Channel Wiring
Part Number and Options
Commercial
MIL-PRF-38534, Class H
MIL-PRF-38534, Class K
Standard Lead Finish
Solder Dipped
b
Butt Joint/Gold Plate
a
Gull Wing/Soldered
b
Class H SMD Part Number
Prescript for all below
Gold Plate
a
Solder Dipped
b
Butt Joint/Gold Plate
a
Butt Joint/Soldered
b
Gull Wing/Soldered
b
Class K SMD Part Number
Prescript for all below
Gold Plate
a
Solder Dipped
b
Butt Joint/Gold Plate
a
Butt Joint/Soldered
b
Gull Wing/Soldered
b
a.
b.
Solder lead finish: Sn63/Pb37.
16-Pin DIP
Through Hole
2
None
8-Pin DIP
Through Hole
1
None
8-Pin DIP
Through Hole
2
V
CC
, GND
HCPL-5530
HCPL-5531
HCPL-553K
Gold Plate
a
Option #200
Option #100
Option #300
5962-
8767902PC
8767902PA
8767902YC
8767902YA
8767902XA
5962-
8767906KPC
8767906KPA
8767906KYC
8767906KYA
8767906KXA
16-Pin Flat Pack
Unformed Leads
4
V
CC
, GND
HCPL-6550
HCPL-6551
HCPL-655K
Gold Plate
a
20-Pad LCCC
Surface Mount
2
None
4N55
4N55/883B
HCPL-257K
Gold Plate
a
Option #200
Option #100
Option #300
5962-
8767901EC
8767901EA
8767901UC
8767901UA
8767901TA
5962-
8767905KEC
8767905KEA
8767905KUC
8767905KUA
8767905KTA
HCPL-5500
HCPL-5501
HCPL-550K
Gold Plate
a
Option #200
Option #100
Option #300
5962-
9085401HPC
9085401HPA
9085401HYC
9085401HYA
9085401HXA
5962-
9085401KPC
9085401KPA
9085401KYC
9085401KYA
9085401KXA
HCPL-6530
HCPL-6531
HCPL-653K
Solder Pads
b
5962-
8767904FC
5962-
87679032A
5962-
8767908KFC
5962-
8767907K2A
Gold Plate lead finish: Maximum gold thickness of leads is <100 micro inches. Typical is 60 to 90 micro inches.
Broadcom
-3-
4N55, 5962-87679, HCPL-553x, HCPL-653x, HCPL-257K, HCPL-655x, 5962-90854, HCPL-550x
Data Sheet
8-Pin Ceramic DIP Single Channel Schematic
ANODE
2
+
V
F
CATHODE
-
3
5
I
F
I
CC
I
B
I
O
8
7
6
V
CC
V
B
V
O
GND
NOTE
Base is pin 7.
Functional Diagrams
16-Pin DIP
Through Hole
2 Channels
1
V
B1
V
CC1
V
O1
GND
16
8-Pin DIP
Through Hole
1 Channel
8-Pin DIP
Through Hole
2 Channels
16-Pin Flat Pack
Unformed Leads
4 Channels
1
16
20-Pad LCCC
Surface Mount
2 Channels
15
2
15
14
V
B2
V
O2
GND
2
13
12
2
1
V
CC
V
B
V
OUT
8
V
CC
V
O1
V
O2
V
O3
V
O4
GND
15
1
V
CC
V
O1
V
O2
8
3
14
V
CC2
19
20
3
14
2
4
13
7
2
7
4
13
5
V
B2
V
CC2
GND
V
O2
12
3
6
3
6
5
12
2
3
GND
1
V
O1
V
CC1
V
B1
10
9
6
11
4
GND
5
4
GND
5
6
11
7
10
7
10
7
8
9
8
8
9
NOTE
8-pin DIP and flat pack devices have common V
CC
and ground. 16-pin DIP and LCCC (leadless ceramic chip carrier)
packages have isolated channels with separate V
CC
and ground connections. All diagrams are top view.
Leaded Device Marking
Avago DESIGNATOR
Avago P/N
DLA SMD
[1]
DLA SMD
[1]
PIN ONE/
ESD IDENT
A QYYWWZ
XXXXXX
XXXXXXX
XXX XXX
X 50434
COMPLIANCE INDICATOR,
[1]
DATE CODE, SUFFIX (IF REQUIRED)
COUNTRY OF MFR.
Avago CAGE CODE
[1]
[1] QML PARTS ONLY
Leadless Device Marking
Avago DESIGNATOR
Avago P/N
PIN ONE/
ESD IDENT
COUNTRY OF MFR.
A QYYWWZ
XXXXXX
X XXXX
XXXXXX
XXX 50434
COMPLIANCE INDICATOR,
[1]
DATE CODE, SUFFIX (IF REQUIRED)
DLA SMD
[1]
DLA SMD
[1]
Avago CAGE CODE
[1]
[1] QML PARTS ONLY
Broadcom
-4-
4N55, 5962-87679, HCPL-553x, HCPL-653x, HCPL-257K, HCPL-655x, 5962-90854, HCPL-550x
Data Sheet
Outline Drawings
16-Pin DIP, Through Hole, 2 Channels
20.06 (0.790)
20.83 (0.820)
0.89 (0.035)
1.65 (0.065)
8.13 (0.320)
MAX.
4.45 (0.175)
MAX.
0.51 (0.020)
MIN.
3.81 (0.150)
MIN.
0.20 (0.008)
0.33 (0.013)
2.29 (0.090)
2.79 (0.110)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
0.51 (0.020)
MAX.
7.36 (0.290)
7.87 (0.310)
8-Pin DIP, Through Hole, 1 and 2 Channels
10.03 (0.395)
10.29 (0.405)
1.02 (0.040)
1.52 (0.060)
4.32 (0.170)
MAX.
8.13 (0.320)
MAX.
7.16 (0.282)
7.57 (0.298)
0.51 (0.020)
MIN.
3.81 (0.150)
MIN.
0.20 (0.008)
0.33 (0.013)
0.51 (0.020)
MAX.
2.29 (0.090)
2.79 (0.110)
7.36 (0.290)
7.87 (0.310)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
Broadcom
-5-
FPGA/CPLD
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