DRAM Module, 256KX32, 150ns, CMOS, PDIP48, 0.900 INCH, PLASTIC, DIP-48
| 参数名称 | 属性值 |
| 厂商名称 | MOSAIC |
| 零件包装代码 | DIP |
| 包装说明 | , |
| 针数 | 48 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 最长访问时间 | 150 ns |
| 其他特性 | RAS ONLY/CAS BEFORE RAS REFRESH; BYTE WRITE; MULTIPLEXED ADDRESS/DATA BUS |
| JESD-30 代码 | R-PDIP-T48 |
| 内存密度 | 8388608 bit |
| 内存集成电路类型 | DRAM MODULE |
| 内存宽度 | 32 |
| 功能数量 | 1 |
| 端口数量 | 1 |
| 端子数量 | 48 |
| 字数 | 262144 words |
| 字数代码 | 256000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 256KX32 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 认证状态 | Not Qualified |
| 刷新周期 | 512 |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | THROUGH-HOLE |
| 端子位置 | DUAL |
| MD32256FKX-15/AD5 | MD32256FKXI-10/AD4 | MD32256FKXI-15/AD5 | MD32256FKX-15/AD7 | MD32256FKXI-15/AD7 | MD32256FKX-10/AD7 | MD32256FKXI-10/AD7 | MD32256FKXI-15/AD4 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | DRAM Module, 256KX32, 150ns, CMOS, PDIP48, 0.900 INCH, PLASTIC, DIP-48 | DRAM Module, 256KX32, 100ns, CMOS, PDIP48, 0.900 INCH, PLASTIC, DIP-48 | DRAM Module, 256KX32, 150ns, CMOS, PDIP48, 0.900 INCH, PLASTIC, DIP-48 | DRAM Module, 256KX32, 150ns, CMOS, PDIP48, 0.900 INCH, PLASTIC, DIP-48 | DRAM Module, 256KX32, 150ns, CMOS, PDIP48, 0.900 INCH, PLASTIC, DIP-48 | DRAM Module, 256KX32, 100ns, CMOS, PDIP48, 0.900 INCH, PLASTIC, DIP-48 | DRAM Module, 256KX32, 100ns, CMOS, PDIP48, 0.900 INCH, PLASTIC, DIP-48 | DRAM Module, 256KX32, 150ns, CMOS, PDIP48, 0.900 INCH, PLASTIC, DIP-48 |
| 零件包装代码 | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
| 针数 | 48 | 48 | 48 | 48 | 48 | 48 | 48 | 48 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 150 ns | 100 ns | 150 ns | 150 ns | 150 ns | 100 ns | 100 ns | 150 ns |
| 其他特性 | RAS ONLY/CAS BEFORE RAS REFRESH; BYTE WRITE; MULTIPLEXED ADDRESS/DATA BUS | RAS ONLY/CAS BEFORE RAS REFRESH; BYTE WRITE; MULTIPLEXED ADDRESS/DATA BUS | RAS ONLY/CAS BEFORE RAS REFRESH; BYTE WRITE; MULTIPLEXED ADDRESS/DATA BUS | RAS ONLY/CAS BEFORE RAS REFRESH; BYTE WRITE; MULTIPLEXED ADDRESS/DATA BUS | RAS ONLY/CAS BEFORE RAS REFRESH; BYTE WRITE; MULTIPLEXED ADDRESS/DATA BUS | RAS ONLY/CAS BEFORE RAS REFRESH; BYTE WRITE; MULTIPLEXED ADDRESS/DATA BUS | RAS ONLY/CAS BEFORE RAS REFRESH; BYTE WRITE; MULTIPLEXED ADDRESS/DATA BUS | RAS ONLY/CAS BEFORE RAS REFRESH; BYTE WRITE; MULTIPLEXED ADDRESS/DATA BUS |
| JESD-30 代码 | R-PDIP-T48 | R-PDIP-T48 | R-PDIP-T48 | R-PDIP-T48 | R-PDIP-T48 | R-PDIP-T48 | R-PDIP-T48 | R-PDIP-T48 |
| 内存密度 | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit |
| 内存集成电路类型 | DRAM MODULE | DRAM MODULE | DRAM MODULE | DRAM MODULE | DRAM MODULE | DRAM MODULE | DRAM MODULE | DRAM MODULE |
| 内存宽度 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 48 | 48 | 48 | 48 | 48 | 48 | 48 | 48 |
| 字数 | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
| 字数代码 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 85 °C | 85 °C | 70 °C | 85 °C | 70 °C | 85 °C | 85 °C |
| 最低工作温度 | - | -40 °C | -40 °C | - | -40 °C | - | -40 °C | -40 °C |
| 组织 | 256KX32 | 256KX32 | 256KX32 | 256KX32 | 256KX32 | 256KX32 | 256KX32 | 256KX32 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 刷新周期 | 512 | 512 | 512 | 512 | 512 | 512 | 512 | 512 |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 厂商名称 | MOSAIC | MOSAIC | MOSAIC | - | MOSAIC | MOSAIC | MOSAIC | MOSAIC |
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