Flash, 8MX1, PDSO8, 0.208 INCH WIDTH, ROHS COMPLIANT, SOW-8
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Micron Technology |
| 零件包装代码 | SOIC |
| 包装说明 | SOP, SOP8,.3 |
| 针数 | 8 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 其他特性 | LG-MAX |
| 最大时钟频率 (fCLK) | 75 MHz |
| 数据保留时间-最小值 | 20 |
| 耐久性 | 100000 Write/Erase Cycles |
| JESD-30 代码 | R-PDSO-G8 |
| 长度 | 6.05 mm |
| 内存密度 | 8388608 bit |
| 内存集成电路类型 | FLASH |
| 内存宽度 | 1 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 字数 | 8388608 words |
| 字数代码 | 8000000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 8MX1 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP8,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 并行/串行 | SERIAL |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 3/3.3 V |
| 编程电压 | 2.7 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.5 mm |
| 串行总线类型 | SPI |
| 最大待机电流 | 0.0001 A |
| 最大压摆率 | 0.015 mA |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 2.7 V |
| 标称供电电压 (Vsup) | 3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 类型 | NOR TYPE |
| 宽度 | 5.62 mm |
| 最长写入周期时间 (tWC) | 15 ms |
| 写保护 | HARDWARE/SOFTWARE |
| M25P80-VMW6TG | M25P80-VMN6TP | M25P80-VMN6TPBA | M25P80-VMP6TG | M25P80-VMP6T | M25P80-VMN3TPB | M25P80-VMN3PB | |
|---|---|---|---|---|---|---|---|
| 描述 | Flash, 8MX1, PDSO8, 0.208 INCH WIDTH, ROHS COMPLIANT, SOW-8 | Flash, 8MX1, PDSO8, 4 X 3 MM, ROHS COMPLIANT, UFDFPN-8 | Flash, 8MX1, PDSO8, ROHS COMPLIANT, PACKAGE | Flash, 8MX1, PDSO8, 0.208 INCH, ROHS COMPLIANT, SOP-8 | Flash, 1MX8, VDFPN-8 | Flash, 8MX1, PDSO8, ROHS COMPLIANT, PACKAGE | Flash, 8MX1, PDSO8, 6 X 5 MM, ROHS COMPLIANT, VFDFPN-8 |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 不符合 | 符合 | 符合 |
| 厂商名称 | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
| 零件包装代码 | SOIC | SON | SON | SOIC | DFP | SON | SON |
| 包装说明 | SOP, SOP8,.3 | SOP, SOP8,.25 | SOP, SOP8,.25 | HVSON, SOLCC8,.25 | VDFPN-8 | SOP, SOP8,.25 | SOP, SOP8,.25 |
| 针数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | unknown | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最大时钟频率 (fCLK) | 75 MHz | 75 MHz | 75 MHz | 75 MHz | 40 MHz | 75 MHz | 75 MHz |
| JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-N8 | R-XDSO-N8 | R-PDSO-G8 | R-PDSO-G8 |
| 长度 | 6.05 mm | 4.9 mm | 4.9 mm | 6 mm | 6 mm | 4.9 mm | 4.9 mm |
| 内存密度 | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit |
| 内存集成电路类型 | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
| 内存宽度 | 1 | 1 | 1 | 1 | 8 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 字数 | 8388608 words | 8388608 words | 8388608 words | 8388608 words | 1048576 words | 8388608 words | 8388608 words |
| 字数代码 | 8000000 | 8000000 | 8000000 | 8000000 | 1000000 | 8000000 | 8000000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 8MX1 | 8MX1 | 8MX1 | 8MX1 | 1MX8 | 8MX1 | 8MX1 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | SOP | SOP | HVSON | HVSON | SOP | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 峰值回流温度（摄氏度） | 260 | 260 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 260 | NOT SPECIFIED |
| 编程电压 | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.5 mm | 1.75 mm | 1.75 mm | 1 mm | 1 mm | 1.75 mm | 1.75 mm |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | AUTOMOTIVE |
| 端子形式 | GULL WING | GULL WING | GULL WING | NO LEAD | NO LEAD | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 30 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 30 | NOT SPECIFIED |
| 宽度 | 5.62 mm | 3.9 mm | 3.9 mm | 5 mm | 5 mm | 3.9 mm | 3.9 mm |
| 数据保留时间-最小值 | 20 | 20 | 20 | 20 | - | 20 | 20 |
| 耐久性 | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | - | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles |
| 封装等效代码 | SOP8,.3 | SOP8,.25 | SOP8,.25 | SOLCC8,.25 | - | SOP8,.25 | SOP8,.25 |
| 电源 | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V | - | 3/3.3 V | 3/3.3 V |
| 串行总线类型 | SPI | SPI | SPI | SPI | - | SPI | SPI |
| 最大待机电流 | 0.0001 A | 0.0001 A | 0.00001 A | 0.0001 A | - | 0.0001 A | 0.0001 A |
| 最大压摆率 | 0.015 mA | 0.015 mA | 0.015 mA | 0.015 mA | - | 0.015 mA | 0.015 mA |
| 标称供电电压 (Vsup) | 3 V | 3 V | - | 3 V | 3 V | - | - |
| 类型 | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | - | NOR TYPE | NOR TYPE |
| 最长写入周期时间 (tWC) | 15 ms | 15 ms | 15 ms | 15 ms | - | 15 ms | 15 ms |
| 写保护 | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | - | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE |
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